JP5954196B2 - 円筒形Ｃｕ−Ｇａ合金スパッタリングターゲット及びその製造方法 - Google Patents

円筒形Ｃｕ−Ｇａ合金スパッタリングターゲット及びその製造方法 Download PDF

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JP5954196B2
JP5954196B2 JP2013012023A JP2013012023A JP5954196B2 JP 5954196 B2 JP5954196 B2 JP 5954196B2 JP 2013012023 A JP2013012023 A JP 2013012023A JP 2013012023 A JP2013012023 A JP 2013012023A JP 5954196 B2 JP5954196 B2 JP 5954196B2
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Japan
Prior art keywords
alloy
capsule
density
cylindrical
sputtering target
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JP2013012023A
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Japanese (ja)
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JP2014141722A (ja
Inventor
辰也 高橋
辰也 高橋
山岸　浩一
浩一 山岸
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Sumitomo Metal Mining Co Ltd
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Sumitomo Metal Mining Co Ltd
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Application filed by Sumitomo Metal Mining Co Ltd filed Critical Sumitomo Metal Mining Co Ltd
Priority to JP2013012023A priority Critical patent/JP5954196B2/ja
Priority to CN201380071399.6A priority patent/CN105008578B/zh
Priority to PCT/JP2013/077832 priority patent/WO2014115379A1/ja
Priority to KR1020157020475A priority patent/KR20150105364A/ko
Priority to TW102137897A priority patent/TWI596222B/zh
Publication of JP2014141722A publication Critical patent/JP2014141722A/ja
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Publication of JP5954196B2 publication Critical patent/JP5954196B2/ja
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    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C1/00—Making non-ferrous alloys
    • C22C1/04—Making non-ferrous alloys by powder metallurgy
    • C22C1/0425—Copper-based alloys
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F3/00—Manufacture of workpieces or articles from metallic powder characterised by the manner of compacting or sintering; Apparatus specially adapted therefor ; Presses and furnaces
    • B22F3/12—Both compacting and sintering
    • B22F3/14—Both compacting and sintering simultaneously
    • B22F3/15—Hot isostatic pressing
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F5/00—Manufacture of workpieces or articles from metallic powder characterised by the special shape of the product
    • B22F5/10—Manufacture of workpieces or articles from metallic powder characterised by the special shape of the product of articles with cavities or holes, not otherwise provided for in the preceding subgroups
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C9/00—Alloys based on copper
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/34—Sputtering
    • C23C14/3407—Cathode assembly for sputtering apparatus, e.g. Target
    • C23C14/3414—Metallurgical or chemical aspects of target preparation, e.g. casting, powder metallurgy

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Powder Metallurgy (AREA)
  • Physical Vapour Deposition (AREA)
JP2013012023A 2013-01-25 2013-01-25 円筒形Ｃｕ−Ｇａ合金スパッタリングターゲット及びその製造方法 Active JP5954196B2 (ja)

Priority Applications (5)

Application Number Priority Date Filing Date Title
JP2013012023A JP5954196B2 (ja) 2013-01-25 2013-01-25 円筒形Ｃｕ−Ｇａ合金スパッタリングターゲット及びその製造方法
CN201380071399.6A CN105008578B (zh) 2013-01-25 2013-10-11 圆筒形Cu‑Ga合金溅射靶材和其制造方法
PCT/JP2013/077832 WO2014115379A1 (ja) 2013-01-25 2013-10-11 円筒形Ｃｕ－Ｇａ合金スパッタリングターゲット及びその製造方法
KR1020157020475A KR20150105364A (ko) 2013-01-25 2013-10-11 원통형 Cu-Ga 합금 스퍼터링 타겟 및 그 제조 방법
TW102137897A TWI596222B (zh) 2013-01-25 2013-10-21 Cylindrical Cu-Ga alloy sputtering target and method of manufacturing the same

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2013012023A JP5954196B2 (ja) 2013-01-25 2013-01-25 円筒形Ｃｕ−Ｇａ合金スパッタリングターゲット及びその製造方法

Publications (2)

Publication Number Publication Date
JP2014141722A JP2014141722A (ja) 2014-08-07
JP5954196B2 true JP5954196B2 (ja) 2016-07-20

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JP2013012023A Active JP5954196B2 (ja) 2013-01-25 2013-01-25 円筒形Ｃｕ−Ｇａ合金スパッタリングターゲット及びその製造方法

Country Status (5)

Country Link
JP (1) JP5954196B2 (zh)
KR (1) KR20150105364A (zh)
CN (1) CN105008578B (zh)
TW (1) TWI596222B (zh)
WO (1) WO2014115379A1 (zh)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2016023361A (ja) * 2014-07-24 2016-02-08 三菱マテリアル株式会社 Ｃｕ−Ｇａ合金円筒型スパッタリングターゲット及びＣｕ−Ｇａ合金円筒型鋳塊
JP2016079450A (ja) * 2014-10-15 2016-05-16 Ｊｘ金属株式会社 Ｃｕ−Ｇａ合金スパッタリングターゲット
JP5887625B1 (ja) * 2015-03-27 2016-03-16 Ｊｘ金属株式会社 円筒型スパッタリングターゲット、円筒型焼結体、円筒型成形体及びそれらの製造方法
JP2016191092A (ja) * 2015-03-30 2016-11-10 三菱マテリアル株式会社 円筒型スパッタリングターゲットの製造方法
JP6888294B2 (ja) * 2016-02-03 2021-06-16 三菱マテリアル株式会社 Ｃｕ−Ｇａ合金スパッタリングターゲットの製造方法、及び、Ｃｕ−Ｇａ合金スパッタリングターゲット
JP6557696B2 (ja) * 2017-03-31 2019-08-07 Ｊｘ金属株式会社 円筒型スパッタリングターゲット及びその製造方法
WO2019194275A1 (ja) * 2018-04-04 2019-10-10 三菱マテリアル株式会社 Ｃｕ－Ｇａ合金スパッタリングターゲット
US20200122233A1 (en) * 2018-10-19 2020-04-23 United Technologies Corporation Powder metallurgy method using a four-wall cylindrical canister
CN109972100B (zh) * 2019-05-13 2023-06-06 无锡飞而康新材料科技有限公司 一种管状铬靶材的制备方法
CN111058004A (zh) * 2020-01-02 2020-04-24 宁波江丰电子材料股份有限公司 一种铬硅合金溅射靶材及其制备方法
CN114030217B (zh) * 2021-11-29 2023-06-20 航天特种材料及工艺技术研究所 一种筒形纳米隔热材料及其制备方法

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0539566A (ja) * 1991-02-19 1993-02-19 Mitsubishi Materials Corp スパツタリング用ターゲツト及びその製造方法
JPH05171428A (ja) * 1991-12-12 1993-07-09 Mitsubishi Materials Corp 柱状スパッタリング用ターゲット
JPH05230645A (ja) * 1991-12-24 1993-09-07 Asahi Glass Co Ltd セラミックス回転カソードターゲット及びその製造法
JPH0726374A (ja) * 1993-07-09 1995-01-27 Asahi Glass Co Ltd 回転カソードターゲット、その製法、および該ターゲットを用いて形成される膜
JPH07238303A (ja) * 1994-02-25 1995-09-12 Sanyo Special Steel Co Ltd 高融点金属ターゲット材の成形方法
JP2000073163A (ja) * 1998-08-28 2000-03-07 Vacuum Metallurgical Co Ltd Ｃｕ−Ｇａ合金スパッタリングターゲット及びその製造方法
JP2007302981A (ja) * 2006-05-15 2007-11-22 Hitachi Metals Ltd 円筒型Ｍｏ合金スパッタリングターゲット材の製造方法
JP5467735B2 (ja) * 2007-07-02 2014-04-09 東ソー株式会社 円筒形スパッタリングターゲット
JP5818139B2 (ja) * 2010-06-28 2015-11-18 日立金属株式会社 Ｃｕ−Ｇａ合金ターゲット材およびその製造方法
JP2012177158A (ja) * 2011-02-25 2012-09-13 Toyota Central R&D Labs Inc 銀ナノ粒子、銀コロイド、殺菌剤及び銀ナノ粒子の製造方法
JP5672066B2 (ja) * 2011-02-25 2015-02-18 東ソー株式会社 円筒形ターゲットの製造方法

Also Published As

Publication number Publication date
JP2014141722A (ja) 2014-08-07
WO2014115379A1 (ja) 2014-07-31
CN105008578A (zh) 2015-10-28
TWI596222B (zh) 2017-08-21
KR20150105364A (ko) 2015-09-16
CN105008578B (zh) 2017-03-22
TW201430155A (zh) 2014-08-01

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