JP5948545B2 - ポリイミド前駆体及びそれを含有する樹脂組成物 - Google Patents

ポリイミド前駆体及びそれを含有する樹脂組成物 Download PDF

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JP5948545B2
JP5948545B2 JP2014553229A JP2014553229A JP5948545B2 JP 5948545 B2 JP5948545 B2 JP 5948545B2 JP 2014553229 A JP2014553229 A JP 2014553229A JP 2014553229 A JP2014553229 A JP 2014553229A JP 5948545 B2 JP5948545 B2 JP 5948545B2
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polyimide
polyimide precursor
film
molecular weight
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JPWO2014098235A1 (ja
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隆行 金田
隆行 金田
加藤　聡
聡 加藤
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Asahi Kasei Corp
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    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C08G73/1057—Polyimides containing other atoms than carbon, hydrogen, nitrogen or oxygen in the main chain
    • C08G73/106—Polyimides containing other atoms than carbon, hydrogen, nitrogen or oxygen in the main chain containing silicon
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/42—Block-or graft-polymers containing polysiloxane sequences
    • C08G77/452—Block-or graft-polymers containing polysiloxane sequences containing nitrogen-containing sequences
    • C08G77/455—Block-or graft-polymers containing polysiloxane sequences containing nitrogen-containing sequences containing polyamide, polyesteramide or polyimide sequences
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/06—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B27/08—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/28—Layered products comprising a layer of synthetic resin comprising synthetic resins not wholly covered by any one of the sub-groups B32B27/30 - B32B27/42
    • B32B27/281—Layered products comprising a layer of synthetic resin comprising synthetic resins not wholly covered by any one of the sub-groups B32B27/30 - B32B27/42 comprising polyimides
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/34—Layered products comprising a layer of synthetic resin comprising polyamides
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C08G73/1039—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors comprising halogen-containing substituents
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C08G73/1042—Copolyimides derived from at least two different tetracarboxylic compounds or two different diamino compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C08G73/1046—Polyimides containing oxygen in the form of ether bonds in the main chain
    • C08G73/1053—Polyimides containing oxygen in the form of ether bonds in the main chain with oxygen only in the tetracarboxylic moiety
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
    • C08J5/18—Manufacture of films or sheets
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L79/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen or carbon only, not provided for in groups C08L61/00 - C08L77/00
    • C08L79/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
    • C08L79/08—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D179/00—Coating compositions based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen, with or without oxygen, or carbon only, not provided for in groups C09D161/00 - C09D177/00
    • C09D179/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
    • C09D179/08—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D183/00—Coating compositions based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon, with or without sulfur, nitrogen, oxygen, or carbon only; Coating compositions based on derivatives of such polymers
    • C09D183/10—Block or graft copolymers containing polysiloxane sequences
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/20—Properties of the layers or laminate having particular electrical or magnetic properties, e.g. piezoelectric
    • B32B2307/206—Insulating
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/40—Properties of the layers or laminate having particular optical properties
    • B32B2307/412—Transparent
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2457/00—Electrical equipment

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  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Organic Chemistry (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Health & Medical Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Wood Science & Technology (AREA)
  • Manufacturing & Machinery (AREA)
  • Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
  • Laminated Bodies (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
JP2014553229A 2012-12-21 2013-12-20 ポリイミド前駆体及びそれを含有する樹脂組成物 Active JP5948545B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2012280187 2012-12-21
JP2012280187 2012-12-21
PCT/JP2013/084331 WO2014098235A1 (ja) 2012-12-21 2013-12-20 ポリイミド前駆体及びそれを含有する樹脂組成物

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JP5948545B2 true JP5948545B2 (ja) 2016-07-06
JPWO2014098235A1 JPWO2014098235A1 (ja) 2017-01-12

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JP (1) JP5948545B2 (ko)
KR (5) KR20210014751A (ko)
TW (1) TWI523913B (ko)
WO (1) WO2014098235A1 (ko)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN113015760A (zh) * 2018-11-16 2021-06-22 三菱瓦斯化学株式会社 聚酰亚胺树脂、清漆及聚酰亚胺薄膜
KR20210138701A (ko) 2019-03-20 2021-11-19 가부시키가이샤 가네카 폴리아미드산 조성물 및 그의 제조 방법, 폴리아미드산 용액, 폴리이미드, 폴리이미드막, 적층체 및 그의 제조 방법, 그리고 플렉시블 디바이스 및 그의 제조 방법

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TWI523913B (zh) * 2012-12-21 2016-03-01 Asahi Kasei E Materials Corp A polyimide precursor and a resin composition containing the same
US10026637B2 (en) * 2014-02-26 2018-07-17 Toray Industries, Inc. Polyimide resin, resin composition using same, and laminated film
KR101993652B1 (ko) 2015-03-05 2019-09-24 주식회사 엘지화학 광전소자의 플렉시블 기판용 폴리이미드 필름용 조성물
WO2016147958A1 (ja) * 2015-03-13 2016-09-22 旭化成株式会社 ポリイミド前駆体樹脂組成物
TWI576370B (zh) * 2016-04-29 2017-04-01 長興材料工業股份有限公司 聚醯亞胺樹脂及含其之金屬被覆積層板
CN106256542B (zh) 2015-06-17 2019-03-26 长兴材料工业股份有限公司 聚酰亚胺树脂及含聚酰亚胺树脂的金属被覆积层板
KR102067856B1 (ko) * 2016-04-04 2020-01-17 주식회사 엘지화학 폴리이미드 전구체 조성물 및 이로부터 제조된 투명 폴리이미드 필름
JP6939225B2 (ja) 2016-08-10 2021-09-22 大日本印刷株式会社 ポリイミドフィルム、積層体、及びディスプレイ用表面材
KR101796875B1 (ko) * 2016-09-23 2017-11-10 주식회사 엘지화학 폴리이미드 전구체 용액 및 이의 제조방법
KR101966737B1 (ko) * 2017-06-23 2019-04-09 주식회사 엘지화학 폴리이미드 전구체 조성물 및 이를 이용한 폴리이미드 필름
KR101840977B1 (ko) 2017-09-14 2018-03-21 주식회사 엘지화학 폴리이미드 전구체 조성물 및 이를 이용한 폴리이미드 필름
CN111133054B (zh) * 2017-09-26 2022-11-11 东丽株式会社 聚酰亚胺前体树脂组合物、聚酰亚胺树脂组合物、聚酰亚胺树脂膜
KR102117151B1 (ko) * 2017-09-29 2020-05-29 주식회사 엘지화학 폴리이미드 전구체 용액 및 이를 이용하여 제조된 폴리이미드 필름
JP2019172970A (ja) * 2018-03-26 2019-10-10 東レ株式会社 表示デバイスまたは受光デバイスの基板用樹脂組成物、並びに、それを用いた表示デバイスまたは受光デバイスの基板、表示デバイス、受光デバイス、表示デバイスまたは受光デバイスの製造方法。
WO2019188380A1 (ja) * 2018-03-30 2019-10-03 株式会社カネカ ポリアミド酸およびその製造方法、ポリアミド酸溶液、ポリイミド、ポリイミド膜、積層体およびその製造方法、ならびにフレキシブルデバイスおよびその製造方法
KR102112483B1 (ko) 2018-04-23 2020-05-19 아사히 가세이 가부시키가이샤 폴리이미드 전구체 수지 조성물
US20210246268A1 (en) 2018-04-23 2021-08-12 Shin-Etsu Chemical Co., Ltd. Silicon-containing compound
JP7412094B2 (ja) * 2018-06-28 2024-01-12 旭化成株式会社 ポリイミド前駆体樹脂組成物
WO2020067558A1 (ja) 2018-09-29 2020-04-02 日鉄ケミカル＆マテリアル株式会社 ポリイミド前駆体及びそれから生じるポリイミド並びにフレキシブルデバイス
KR20210109525A (ko) 2018-12-28 2021-09-06 미쯔비시 가스 케미칼 컴파니, 인코포레이티드 이미드-아미드산 공중합체 및 그의 제조방법, 바니시, 그리고 폴리이미드 필름
JP7300504B2 (ja) * 2019-05-24 2023-06-29 旭化成株式会社 ポリイミド前駆体及びポリイミド樹脂組成物
JP7433007B2 (ja) * 2019-09-20 2024-02-19 旭化成株式会社 ポリイミド前駆体樹脂組成物
KR20220056861A (ko) * 2019-10-03 2022-05-06 미쓰이 가가쿠 가부시키가이샤 폴리이미드 필름, 폴리아마이드산 및 이것을 포함하는 바니시, 및 폴리이미드 적층체 및 그 제조 방법
WO2021132197A1 (ja) 2019-12-27 2021-07-01 三菱瓦斯化学株式会社 ポリイミド樹脂、ワニス及びポリイミドフィルム
WO2021193978A1 (ja) 2020-03-27 2021-09-30 宇部興産株式会社 ポリイミド前駆体組成物およびポリイミドフィルム／基材積層体
KR20220158818A (ko) * 2020-05-28 2022-12-01 아사히 가세이 가부시키가이샤 수지 조성물
CN111635525A (zh) * 2020-07-03 2020-09-08 浙江中科玖源新材料有限公司 一种低介电常数疏水聚酰亚胺薄膜及其制备方法
CN114573810A (zh) * 2020-11-30 2022-06-03 旭化成株式会社 聚酰亚胺前体及聚酰亚胺树脂组合物

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN113015760A (zh) * 2018-11-16 2021-06-22 三菱瓦斯化学株式会社 聚酰亚胺树脂、清漆及聚酰亚胺薄膜
CN113015760B (zh) * 2018-11-16 2023-07-28 三菱瓦斯化学株式会社 聚酰亚胺树脂、清漆及聚酰亚胺薄膜
KR20210138701A (ko) 2019-03-20 2021-11-19 가부시키가이샤 가네카 폴리아미드산 조성물 및 그의 제조 방법, 폴리아미드산 용액, 폴리이미드, 폴리이미드막, 적층체 및 그의 제조 방법, 그리고 플렉시블 디바이스 및 그의 제조 방법

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TWI523913B (zh) 2016-03-01
KR102213304B1 (ko) 2021-02-05
KR101776447B1 (ko) 2017-09-07
WO2014098235A1 (ja) 2014-06-26
KR20180122755A (ko) 2018-11-13
KR20210014751A (ko) 2021-02-09
JPWO2014098235A1 (ja) 2017-01-12
TW201434973A (zh) 2014-09-16
KR20200096319A (ko) 2020-08-11
KR20170104007A (ko) 2017-09-13
KR20150086496A (ko) 2015-07-28

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