JP5935809B2 - プリント基板の取り付け構造およびその構造を用いた半導体装置 - Google Patents
プリント基板の取り付け構造およびその構造を用いた半導体装置 Download PDFInfo
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- 229920005989 resin Polymers 0.000 claims description 52
- 239000011347 resin Substances 0.000 claims description 52
- 239000000758 substrate Substances 0.000 claims description 34
- 239000000853 adhesive Substances 0.000 claims description 27
- 230000001070 adhesive effect Effects 0.000 claims description 27
- 230000017525 heat dissipation Effects 0.000 claims description 14
- 239000003822 epoxy resin Substances 0.000 claims description 13
- 229920000647 polyepoxide Polymers 0.000 claims description 13
- 239000002184 metal Substances 0.000 claims description 7
- 239000004020 conductor Substances 0.000 claims description 5
- 239000004568 cement Substances 0.000 claims description 2
- 229910000679 solder Inorganic materials 0.000 description 10
- 239000003990 capacitor Substances 0.000 description 7
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Description
プリント基板5の中央部には重量物3であるトランス、コンデンサまたはインダクタなどが固定され、その重量物3の周辺には軽量物4である抵抗や半導体素子が固定されている。つまり、重量物3および軽量物4とはここでは電気部品のことである。
そのため、プリント基板5が共振するようになり、重量物3の振幅は増幅され、激しく振動し、重量物3が搭載されたプリント基板5は振動により破壊する。このプリント基板5の振動はX,Y,Zの方向で生じる。前記の重量物3が搭載されたプリント基板5の振動による破壊は、具体的には、例えば、重量物3であるトランスやコンデンサの端子とプリント基板5との接続箇所の破壊や端子の破断などである。
また、高温環境での使用に耐えるシリコン樹脂やエポキシ樹脂を用いる方法も考えられるが、シリコン樹脂は柔らかいので振動を抑える効果が小さく使用できない。一方、硬いエポキシ樹脂では振動を抑える効果はあるが、プリント基板に搭載される部品とプリント基板の隙間にエポキシ樹脂が入り込み、熱膨張係数の差で部品を基板から剥がしたり、部品自身を破壊したりするため使用できない。
また、この発明にかかるプリント基板の取り付け構造は、上述した発明において、前記受け部材が前記本体の一部である。
また、この発明にかかる半導体装置は、上述した発明において、前記受け部材が前記蓋の一部であるとよい。
<実施例1>
図1は、この発明の第1実施例のプリント基板の取り付け構造の構成図であり、同図(a)は要部断面図、同図(b)はアンカー6の拡大図である。本発明のプリント基板の取り付け構造は点線で囲まれたAの箇所である。本体1の隅にネジ止め部材2を固定し、このネジ止め部材2上にプリント基板5の隅が位置するようにプリント基板5を配置する。このプリント基板5の隅をネジ10でネジ締めしてネジ止め部材2にプリント基板5を固定する。このネジ止め部材2とネジ10でネジ部材14を構成する。
<実施例2>
図5は、この発明の第2実施例の半導体装置の要部断面図である。この半導体装置はパワー半導体モジュールを例に挙げた。また図は概念図である。
<実施例3>
図6は、この発明の第3実施例の半導体装置の要部断面図である。この半導体装置はパワー半導体モジュールを例に挙げた。また図は概念図である。
2 ネジ止め部材
3 重量物
4 軽量物
5 プリント基板
6,11,13 アンカー
6a、11a,13a 柱部
6b,11b,13b 凸部
6c,11c,13c 庇部
6d 柱部6aの底面
7,12 受け皿
7a 受け皿7の底面
8 樹脂接着剤
9 取り付け部材
10 ネジ
21 シャーシ
22 保護箱
31 放熱ベース
32 導電パターン付絶縁基板
33 半導体チップ
34 ボンディングワイヤ
35 外部導出端子
Claims (9)
- 重量物が固定されたプリント基板と、前記重量物の直下のプリント基板に固定された固定部材と、本体に固定された受け部材とを備え、前記固定部材の底部を前記受け部材に配設し、樹脂接着剤で固定部材の底部と受け部材を固定していることを特徴とするプリント基板の取り付け構造。
- 前記固定部材が金属製のアンカーであり、前記受け部材が樹脂製の受け皿であり、前記樹脂接着剤がエポキシ樹脂であることを特徴とする請求項1に記載のプリント基板の取り付け構造。
- 前記固定部材の底部側面に突起を設けたことを特徴とする請求項1に記載のプリント基板の取り付け構造。
- 前記受け部材が前記本体の一部であることを特徴とする請求項1に記載のプリント基板の取り付け構造。
- 放熱ベースと、該放熱ベース上に固定された導電パターン付絶縁基板と、該導電パターン付絶縁基板に固定された半導体チップと、該半導体チップと外部導出端子を接続している導電体と、前記半導体チップが固定された前記導電パターン付絶縁基板を収納するとともに前記放熱ベースに固定された樹脂ケースと、該樹脂ケースに固定された蓋と、該蓋上に固定された受け部材と、該受け部材に樹脂接着剤でその底部が固定された固定部材と、該固定部材の上部が固定されたプリント基板と、該プリント基板の隅を前記樹脂ケースに固定するためのネジ部材と、を具備し、前記プリント基板に重量物が固定され、前記固定部材が前記重量物の直下のプリント基板に固定され、前記プリント基板、前記固定部材、前記受け部材および樹脂接着剤でプリント基板の取り付け構造を構成していることを特徴とする半導体装置。
- 放熱ベースと、該放熱ベース上に固定された導電パターン付絶縁基板と、該導電パターン付絶縁基板に固定された半導体チップと、該半導体チップと外部導出端子を接続している導電体と、前記導電パターン付絶縁基板上に固定された受け部材と、該受け部材に樹脂接着剤でその底部が固定された固定部材と、該固定部材の上部が固定されたプリント基板と、該プリント基板の隅を前記導電パターン付絶縁基板に固定しているネジ部材と、前記半導体チップが固定された前記導電パターン付絶縁基板、前記受け部材、前記固定部材および前記プリント基板を収納するとともに前記放熱ベースに固定された樹脂ケースと、該樹脂ケースに固定された蓋と、を具備し、前記プリント基板に重量物が固定され、前記固定部材が前記重量物の直下のプリント基板に固定され、前記プリント基板、前記固定部材、前記受け部材および前記樹脂接着剤でプリント基板の取り付け構造を構成していることを特徴とする半導体装置。
- 前記固定部材が金属製のアンカーであり、前記受け部材が樹脂製の受け皿であり、前記樹脂接着剤がエポキシ樹脂であることを特徴とする請求項5または6に記載の半導体装置。
- 前記固定部材の底部に水平方向の突起を配置したことを特徴とする請求項5または6に記載の半導体装置。
- 前記受け部材が前記蓋の一部であることを特徴とする請求項5に記載の半導体装置。
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US9445532B2 (en) * | 2013-05-09 | 2016-09-13 | Ford Global Technologies, Llc | Integrated electrical and thermal solution for inverter DC-link capacitor packaging |
JP6299120B2 (ja) * | 2013-09-05 | 2018-03-28 | 富士電機株式会社 | 半導体モジュール |
US9397015B2 (en) * | 2014-03-28 | 2016-07-19 | Fuji Electric Co., Ltd. | Semiconductor device and semiconductor device casing |
CN107110341B (zh) * | 2015-01-14 | 2019-04-19 | 日立汽车系统株式会社 | 电子控制装置 |
EP3329752B1 (en) * | 2015-07-31 | 2022-03-30 | Hewlett-Packard Development Company, L.P. | Printed circuit board to molded compound interface |
ITUB20153344A1 (it) * | 2015-09-02 | 2017-03-02 | St Microelectronics Srl | Modulo di potenza elettronico con migliorata dissipazione termica e relativo metodo di fabbricazione |
JP6711098B2 (ja) * | 2016-04-15 | 2020-06-17 | オムロン株式会社 | 半導体装置の放熱構造 |
JP2021052094A (ja) * | 2019-09-25 | 2021-04-01 | 株式会社ミツバ | ドライバ |
US20230217585A1 (en) * | 2021-12-29 | 2023-07-06 | Microsoft Technology Licensing, Llc | Systems and methods for noninvasive acoustic noise reduction in electronic devices |
US20230337353A1 (en) * | 2022-04-14 | 2023-10-19 | Hamilton Sundstrand Corporation | Devices and methods to improve thermal conduction from smt and chip on board components to chassis heat sinking |
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JPH1065362A (ja) * | 1996-08-14 | 1998-03-06 | Hochiki Corp | 基板取付構造 |
JP3986648B2 (ja) * | 1998-02-03 | 2007-10-03 | 四変テック株式会社 | 電源装置 |
JP2000068446A (ja) * | 1998-08-25 | 2000-03-03 | Hitachi Ltd | パワー半導体モジュール |
US6958535B2 (en) * | 2000-09-22 | 2005-10-25 | Matsushita Electric Industrial Co., Ltd. | Thermal conductive substrate and semiconductor module using the same |
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JP5028085B2 (ja) | 2006-12-27 | 2012-09-19 | アイシン・エィ・ダブリュ株式会社 | 電子回路装置とその製造方法 |
JP4969388B2 (ja) * | 2007-09-27 | 2012-07-04 | オンセミコンダクター・トレーディング・リミテッド | 回路モジュール |
US8207607B2 (en) * | 2007-12-14 | 2012-06-26 | Denso Corporation | Semiconductor device with resin mold |
US8115293B2 (en) * | 2009-12-08 | 2012-02-14 | Stats Chippac Ltd. | Integrated circuit packaging system with interconnect and method of manufacture thereof |
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