CN103858229A - 印刷基板的安装结构以及使用该结构的半导体装置 - Google Patents

印刷基板的安装结构以及使用该结构的半导体装置 Download PDF

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CN103858229A
CN103858229A CN201280048421.0A CN201280048421A CN103858229A CN 103858229 A CN103858229 A CN 103858229A CN 201280048421 A CN201280048421 A CN 201280048421A CN 103858229 A CN103858229 A CN 103858229A
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寺泽德保
百濑康之
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Fuji Electric Co Ltd
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Abstract

本发明提供一种印刷基板的安装结构以及使用该结构的半导体装置。通过利用安装构件（9）将搭载在印刷基板（5）上的重物（3）的正下方固定在主体（1）上，来提高印刷基板（5）的谐振频率，从而避开主体（1）的谐振频带，减小重物（3）的振幅。由此，能防止搭载有重物（3）的印刷基板（5）因谐振而发生损坏。此外，通过利用该印刷基板（5）的安装结构来制作半导体装置，从而能防止搭载有重物（3）的印刷基板（5）因谐振而发生损坏。

Description

印刷基板的安装结构以及使用该结构的半导体装置
技术领域
本发明涉及将搭载有变压器等重物的印刷基板安装于主体时的印刷基板的安装结构以及使用该结构的半导体装置。 
背景技术
在逆变器装置、整流器装置等功率转换装置以及车载用电路等中使用了功率半导体模块等半导体装置或其它各种元器件。这些半导体装置或各种元器件可能会在工作过程中暴露在振动环境下。 
接着，对以下情况下的电路印刷基板的安装结构进行说明，即在印刷基板上搭载有电路元器件即变压器、电容器等重物、且将该印刷基板安装于对功率半导体模块、汽车的发动机进行固定的底板（支承框）的情况。这里将安装有印刷基板的对象物（功率半导体模块、汽车的底板等）称为主体。 
图7是表示现有印刷基板的安装结构的主要部分的剖视图。在主体1的角部固定螺钉止动构件2，并配置印刷基板5，使印刷基板5的角部位于该螺钉止动构件2上。利用螺钉10对该印刷基板5的角部进行螺钉紧固，从而将印刷基板5固定在螺钉止动构件2上。 
然而，当该印刷基板5比主体1大时，则利用螺钉10在印刷基板5的角部以外的部分隔开规定的间隔来进行固定。 
印刷基板5的中央部固定有作为重物3的变压器、电容器或电感器等， 在该重物3的周边固定有作为轻物4的电阻、半导体元件。即，此处的重物3和轻物4为电气元器件。 
在上述那样利用螺钉10和螺钉止动构件2对印刷基板5的角部进行固定的现有印刷基板5的安装结构中，印刷基板5成为两端支承的梁（横梁）模型结构，主体1的振动会使得印刷基板5也产生振动。由于在该印刷基板5的振动的中央部固定有重物3，因此该印刷基板5的振幅变大，其谐振频率降低。 
专利文献1所记载的电子电路装置包括形成有主电路的下侧基板、形成有驱动控制主电路的驱动控制电路的上侧基板、以及树脂壳体。该树脂壳体在周边部的外表面具有主电路以及驱动控制电路的外部导出端子，且在周边部的内侧具有基板收纳空间。在该电子电路装置中，上侧基板配置为位于下侧基板的上方，并利用填充材料填充下侧基板的上方空间。该电子电路装置采用树脂作为该填充材料，包括利用处于固化状态的树脂定位并固定在下侧基板上方的支承体，通过利用该支承体固定并支承上侧基板来提高上侧基板的耐振动性，从而可靠性得以提高。将该支承体（螺栓等）配置在重物周围的例如四个位置，从而将重物固定于上侧基板。 
此外，专利文献2记载有如下内容：在将功率元件封入封装内的功率用半导体装置中，包括封装、固定在封装内的功率元件、与功率元件相连接的接合线、以及覆盖功率元件的凝胶状绝缘体，并且，通过填充发泡材料来填满封装内残留的中空部，从而防止在从外部受到振动的条件下使用功率用半导体装置时、因功率用半导体装置的结构部分的谐振而引起的破损。 
现有技术文献 
专利文献 
专利文献1：日本专利特开2008－166358号公报 
专利文献2：日本专利特开2003－68940号公报 
发明内容
发明所要解决的技术问题 
如利用图7所说明的那样，在现有的印刷基板5的安装结构中，印刷基板5的谐振频率较低，因此该谐振频率会进入到主体1的谐振频带中。 
因此，印刷基板5会产生谐振，导致重物3的振幅变大，从而产生激烈振动，搭载有重物3的印刷基板5会因振动而被发生损坏。该印刷基板5的振动会在X、Y、Z的方向上产生。上述搭载有重物3的印刷基板5因振动而引起的损坏具体而言例如是作为重物3的变压器、电容器的端子与印刷基板5之间的连接部位的损坏、端子的断裂等。 
为了防止上述损坏，已有如上述专利文献1那样利用螺栓对重物的周边进行止动的方法。然而，螺栓与重物之间始终会存在稍许距离，虽然谐振频率上升，但重物还是会振动，因此无法完全防止振动损坏。而且，由于利用螺栓对重物的周围进行止动，因此死角空间会变大。 
此外，即使如上述专利文献2那样利用聚氨酯等发泡材料包围重物的周围来避开谐振频率，但对于高温环境下使用的主体而言，则无法应用发泡材料。 
此外，虽然也考虑采用能耐受高温环境下使用的硅树脂、环氧树脂的方法，但由于硅树脂较柔软，因此抑制振动的效果较小而无法使用。另一方面，虽然较硬的环氧树脂具有抑制振动的效果，但环氧树脂会进入搭载在印刷基板上的元器件与印刷基板的间隙内，从而导致元器件会因热膨胀系数的差异而从基板剥离，或者元器件本身发生损坏，因此也无法使用。 
本发明的目的在于解决上述问题，提供一种能提高搭载有重物的印刷基板的谐振频率、从而避开主体的谐振频率、防止因谐振引起的损坏的印刷基板的安装结构以及使用该结构的半导体装置。 
解决技术问题的技术方案 
为实现上述目的，本发明所涉及的印刷基板的安装结构具有如下特征。包括：固定有重物的印刷基板；固定在所述重物的正下方的印刷基板上的固定构件；以及固定在主体上的支承构件，所述固定构件的底部设置在所述支承构件上，并利用树脂粘接剂来固定固定构件的底部和支承构件。 
此外，本发明所涉及的印刷基板的安装结构在于，在上述发明中，所述固定构件为金属制的固定部（anchor），所述支承构件为树脂制的托盘，所述树脂粘接剂为环氧树脂。 
此外，本发明所涉及的印刷基板的安装结构在于，在上述发明中，在所述固定构件的底部侧面设有突起。 
此外，本发明所涉及的印刷基板的安装结构在于，在上述发明中，所述支承构件为所述主体的一部分。 
此外，为解决上述问题，实现本发明的目的，本发明所涉及的半导体装置具有下述特征，包括：散热基底；固定在该散热基底上的带有导电图案的绝缘基板；固定在该带有导电图案的绝缘基板上的半导体芯片；连接该半导体芯片与外部导出端子的导电体；对固定有所述半导体芯片的所述带有导电图案的绝缘基板进行收纳并被固定在所述散热基底上的树脂壳体；固定在该树脂壳体上的盖；固定在该盖上的支承构件；底部通过树脂粘接剂固定在该支承构件上的固定构件；固定有该固定构件的上部的印刷基板；以及用于将该印刷基板的角部固定在所述树脂壳体上的螺钉构件，利用所述印刷基板、所述固定构件、所述支承构件以及树脂粘接剂来构成印刷基板的安装结构。 
此外，为解决上述问题，实现本发明的目的，本发明所涉及的半导体装置具有下述特征，包括：散热基底；固定在该散热基底上的带有导电图 案的绝缘基板；固定在该带有导电图案的绝缘基板上的半导体芯片；连接该半导体芯片与外部导出端子的导电体；固定在所述带有导电图案的绝缘基板上的支承构件；底部通过树脂粘接剂固定在该支承构件上的固定构件；固定有该固定构件的上部的印刷基板；将该印刷基板的角部固定在所述带有导电图案的绝缘基板上的螺钉构件；对固定有所述半导体芯片的所述带有导电图案的绝缘基板、所述支承构件、所述固定构件、以及所述印刷基板进行收纳并被固定在所述散热基底上的树脂壳体；以及固定在该树脂壳体上的盖，由所述印刷基板、所述固定构件、所述支承构件以及所述树脂粘接剂来构成印刷基板的安装结构。 
此外，本发明所涉及的半导体装置在于，在上述发明中，所述固定构件为金属制的固定部，所述支承构件为树脂制的托盘，所述树脂粘接剂为环氧树脂。 
此外，本发明所涉及的半导体装置在于，在上述发明中，在所述固定部的底部配置有水平方向的突起。 
此外，本发明所涉及的半导体装置在于，在上述发明中，所述支承构件为所述盖的一部分。 
发明效果 
根据本发明，通过使用安装构件将搭载在印刷基板上的重物的正下方固定在主体上，来提高印刷基板的谐振频率，从而避开主体的谐振频带，减小重物的振幅。由此，能防止搭载有重物的印刷基板因谐振而发生损坏。 
此外，通过利用该印刷基板的安装结构来制作半导体装置，能防止搭载有重物的印刷基板因谐振而发生损坏。 
附图说明
图1是本发明的实施例1的印刷基板的安装结构的结构图，图1(a)是主要部分的剖视图，图1(b)是固定部6的放大图。 
图2是表示存在多个重物的情况的主要部分的剖视图。 
图3是图1的安装构件9的图，图3(a)是固定部6的主要部分的俯视图，图3(b)是从箭头B的方向观察图3(a)而得到的主要部分的侧视图，图3(c)是托盘7的主要部分的俯视图，图3(d)是沿图3(c)的X-X线切断而得到的主要部分的剖视图，图3(e)是其它固定部11的主要部分的俯视图，图3(f)是图3(e)的固定部11的托盘12的主要部分的俯视图，图3(g)是以与图3(b)中从箭头D的方向观察C部位时相同的部位和方向观察其它固定部13而得到的主要部分的俯视图，图3(h)是图3(g)的固定部13的主要部分的侧视图。 
图4是表示印刷基板的安装结构的一个示例的主要部分的结构图。 
图5是本发明实施例2的半导体装置的主要部分的剖视图。 
图6是本发明实施例3的半导体装置的主要部分的剖视图。 
图7是表示现有印刷基板的安装结构的主要部分的剖视图。 
具体实施方式
利用以下实施例来说明实施方式。对与现有技术相同的部分标注相同的标号。 
<实施例1> 
图1是本发明的实施例1的印刷基板的安装结构的结构图，图1(a)是主要部分的剖视图，图1(b)是固定部6的放大图。本发明的印刷基板的安装结构是由虚线所包围的A部位。在主体1的角部固定螺钉止动构件2，并配置印刷基板5，使印刷基板5的角部位于该螺钉止动构件2上。利用螺钉10对该印刷基板5的角部进行螺钉紧固，从而将印刷基板5固定在螺钉止动构件2上。该螺钉止动构件2和螺钉10构成螺钉构件14。 
在印刷基板5表面的中央部固定有作为重物3的变压器、电抗器、电容器（尤其是电解电容器）、电感器或连接器等，在该重物3的周边固定有作 为轻物4的电阻、半导体元件等。重物3可以是电气元器件中具有大约2.5克以上重量的元器件，更详细而言，为2.5～10克左右，但也取决于印刷基板。轻物4是电气元器件中比重物3要轻的元器件。 
利用焊料等将固定部6（金属制的固定构件）固定在该重物3正下方的印刷基板5的背面，并利用树脂粘接剂等将托盘7（树脂制的支承构件）固定在主体1上。当然，该托盘7也可以在形成构成主体1的构件时一体形成。在将印刷基板5放置于螺钉止动构件2上时，将固定部6插入到托盘7中。之后将螺钉10插入到螺钉止动构件2中，从而将印刷基板5固定在螺钉止动构件2上。此外，利用环氧树脂等较硬材料的树脂粘接剂8将固定部6固定在托盘7上。 
可以使上述固定部6的底面6d与凹状的托盘7的底面7a之间具有间隙T。该间隙T为0.1mm左右，由于该间隙T的存在，即使印刷基板5与主体1之间存在尺寸偏差，也能以固定部6的底面6d不与托盘7的底面7a相接触的方式进行配置。固定部6由中心的柱部6a、配置在柱部6a的底部四周的凸部6b、以及配置在柱部6a的上部四周的檐部6c构成。此外，如图2所示，当存在多个重物3时，与此相应地也需要设置多个固定部6和托盘7。即使在重物3正下方的印刷基板5与主体1之间的距离P1、P2、P3存在偏差的情况、或固定部6与托盘7之间的各个距离Q1、Q2、Q3存在偏差的情况下，由于固定部6的底面6d与托盘7的底面7a之间存在间隙T，因此该间隙T会将偏差吸收，固定部6的底面6d不会与托盘7的底面7a相抵接，从而能可靠地将固定部6配置在托盘7上。 
另外，上述固定部6例如由金属制成，托盘7例如由树脂制成。此外，可以利用环氧树脂那样的树脂粘接剂来将固定部6固定到印刷基板5背面，但利用焊料进行的接合强度更大，因此较为优选。此外，可以利用树脂粘接剂或焊料来将托盘7固定于主体1。在利用焊料进行固定时，需要利用金属膜对要接合的树脂面进行涂覆。 
此外，由于重物3经由印刷基板5、固定部6以及托盘7固定在主体1上，因此重物3的振幅与主体1的振幅相同。此外，由于印刷基板5在重物3的部位固定于主体1，因此固定印刷基板5的螺钉10的部位与重物3的部位之间的横向距离变短。因此，印刷基板5的谐振频率比主体1的谐振频率要高，从而能防止搭载有重物3的印刷基板5因谐振而发生损坏。 
图3是图1的安装构件9的图，图3(a)是固定部6的主要部分的俯视图，图3(b)是从箭头B的方向观察图3(a)而得到的主要部分的侧视图，图3(c)是托盘7的主要部分的俯视图，图3(d)是沿图3(c)的X-X线切断而得到的主要部分的剖视图，图3(e)是其它固定部11的主要部分的俯视图，图3(f)是图3(e)的固定部11的托盘12的主要部分的俯视图，图3(g)是其它固定部13中从箭头D的方向观察图3(b)的C部位而得到的主要部分的俯视图，图3(h)是图3(g)的固定部13的主要部分的侧视图。另外，图中的7a、12a为托盘7、12的底面，7b、12b为托盘7、12的侧壁。 
图示的固定部6、11、13是在上部设有檐部6c、11c、13c的示例，通过檐部6c、11c、13c使得与印刷基板5的接合面积得以扩大。当固定部6、11、13的柱部6a、11a、13a的上端部面积较大时，则不一定需要设置该檐部6c、11c、13c。此外，在固定部6、11、13的底部沿水平方向形成有凸部6b、11b、13b，利用该凸部6b、11b、13b来阻止固定部6在上下方向移动。因此，凸部6b、11b、13b的设置较为重要。 
此外，由于固定部6、11、13的底部被托盘7、12内的环氧树脂等树脂粘接剂8固定，因此固定部6、11、13不会在前后左右方向上移动。这里，固定部13的托盘与固定部6的托盘相同。 
例如，若利用图1进行说明，则通过使用由固定部6、托盘7、环氧树脂等树脂粘接剂8构成的安装构件9，使得搭载有重物3的印刷基板5相对于主 体1在X、Y、Z方向上固定，从而使得印刷基板5进行与谐振频率较低的主体1相同的动作。 
图4是表示印刷基板的安装结构的一个示例的主要部分的结构图。该示例中，将搭载有重物3的印刷基板5固定在安装于汽车的底板21（安装发动机或轮胎的支承框）上的保护箱22内。底板21与保护箱22相当于权利要求1所记载的主体。重物3正下方的印刷基板5经由安装构件9固定在保护箱22内，该保护箱22安装在底板21上。由于重物3正下方的印刷基板5固定在底板21上，因此不会因谐振而产生损坏。 
<实施例2> 
图5是本发明实施例2的半导体装置的主要部分的剖视图。以功率半导体模块为例来作为该半导体装置。此外，该图为示意图。 
利用未图示的焊料将带有导电图案的绝缘基板32接合在散热基底31上，并利用未图示的焊料将半导体芯片33接合在带有导电图案的绝缘基板32上。半导体芯片33上连接有接合线34等连接导体，接合线34与外部导出端子35相连接。利用未图示的粘接剂将树脂壳体36固定在散热基底31上，盖37固定在树脂壳体36上。 
盖37的上方配置有印刷基板5，该印刷基板5通过螺钉10旋紧在螺钉止动构件2上，该螺钉止动构件2固定在树脂壳体36上。在该印刷基板5上形成有对半导体芯片33进行控制、驱动、保护的未图示的驱动电路。该驱动电路搭载有作为重物3的变压器、电容器和电感器、以及作为轻物4的半导体元件、电阻等电气电路元器件。在搭载有重物3的印刷基板5的正下方固定图3(a)所示的固定部6，并在盖37上固定图3(b)所示的托盘7。将固定部8嵌入到该托盘7中，并在托盘7中填充环氧树脂等树脂粘接剂8，从而利用环氧树脂等树脂粘接剂8对固定部6和托盘7进行固定。 
由于重物3经由印刷基板5、固定部6以及托盘7固定在功率半导体模块 的盖37上，因此重物3的振幅与盖37的振幅相同。此外，由于印刷基板5也在重物3的位置固定于盖37，因此印刷基板5的固定位置的间隔与仅在螺钉10的部位进行固定的情况相比要小。因此，印刷基板5的谐振频率比盖37的谐振频率高，搭载有重物3的印刷基板5不会因谐振而发生损坏。 
此外，虽然经由印刷基板5、固定部6以及托盘7将重物3固定在功率半导体模块的盖37上，但由于使用了树脂粘接剂、焊料，因此与聚氨酯等发泡材料不同，使得功率半导体模块也能够耐受高温。 
<实施例3> 
图6是本发明实施例3的半导体装置的主要部分的剖视图。以功率半导体模块为例来作为该半导体装置。此外，该图为示意图。 
图6与图5的不同之处在于印刷基板5配置在树脂壳体36内。利用未图示的焊料将带有导电图案的绝缘基板32接合在散热基底31上，并利用未图示的焊料将半导体芯片33接合在带有导电图案的绝缘基板32上。半导体芯片33上例如连接有接合线34，接合线34与外部导出端子35相连接。树脂壳体36通过未图示的粘接剂固定在散热基底31上。半导体芯片33的上方配置有印刷基板5，该印刷基板5通过螺钉10旋紧在螺钉止动构件2上，该螺钉止动构件2固定在带有导电图案的绝缘基板32上。在该印刷基板5上形成有对半导体芯片33进行控制、驱动、保护的未图示的驱动电路。该驱动电路搭载有作为重物3的电容器、电感器、以及作为轻物4的半导体元件、电阻等。在该情况下，固定印刷基板5的螺钉止动部位的间隔配置在四个部位，而且，固定部6被固定在重物3正下方的印刷基板5的背面，固定部6通过树脂粘接剂8固定在托盘7上，托盘7固定在带有导电图案的绝缘基板32上。固定部6与托盘7的结构与图3相同。在这种情况下也能获得与上述实施例相同的效果。 
标号说明 
1  主体 
2  螺钉止动构件 
3  重物 
4  轻物 
5  印刷基板 
6，11，13  固定部 
6a，11a，13a  柱部 
6b，11b，13b  凸部 
6c，11c，13c  檐部 
6d柱部6a的底面 
7，12  托盘 
7a  托盘6的底面 
8  树脂粘接剂 
9  安装构件 
10  螺钉 
21  底板 
22  保护箱 
31  散热基底 
32  带有导电图案的绝缘基板 
33  半导体芯片 
34  接合线 
35  外部导出端子 。

Claims (9)

1.一种印刷基板的安装结构，其特征在于，包括：
固定有重物的印刷基板；固定在所述重物的正下方的印刷基板上的固定构件；以及固定在主体上的支承构件，所述固定构件的底部设置在所述支承构件上，并利用树脂粘接剂来固定固定构件的底部和支承构件。
2.如权利要求1所述的印刷基板的安装结构，其特征在于，
所述固定构件为金属制的固定部，所述支承构件为树脂制的托盘，所述树脂粘接剂为环氧树脂。
3.如权利要求1所述的印刷基板的安装结构，其特征在于，
在所述固定构件的底部侧面设有突起。
4.如权利要求1所述的印刷基板的安装结构，其特征在于，
所述支承构件为所述主体的一部分。
5.一种半导体装置，其特征在于，包括：
散热基底；固定在该散热基底上的带有导电图案的绝缘基板；固定在该带有导电图案的绝缘基板上的半导体芯片；连接该半导体芯片与外部导出端子的导电体；对固定有所述半导体芯片的所述带有导电图案的绝缘基板进行收纳、并被固定在所述散热基底上的树脂壳体；固定在该树脂壳体上的盖；固定在该盖上的支承构件；其底部通过树脂粘接剂固定在该支承构件上的固定构件；固定有该固定构件的上部的印刷基板；以及用于将该印刷基板的角部固定在所述树脂壳体上的螺钉构件，利用所述印刷基板、所述固定构件、所述支承构件以及树脂粘接剂来构成印刷基板的安装结构。
6.一种半导体装置，其特征在于，包括：
散热基底；固定在该散热基底上的带有导电图案的绝缘基板；固定在该带有导电图案的绝缘基板上的半导体芯片；连接该半导体芯片与外部导出端子的导电体；固定在所述带有导电图案的绝缘基板上的支承构件；其底部通过树脂粘接剂固定在该支承构件上的固定构件；固定有该固定构件的上部的印刷基板；将该印刷基板的角部固定在所述带有导电图案的绝缘基板上的螺钉构件；对固定有所述半导体芯片的所述带有导电图案的绝缘基板、所述支承构件、所述固定构件、以及所述印刷基板进行收纳、并被固定在所述散热基底上的树脂壳体；以及固定在该树脂壳体上的盖，利用所述印刷基板、所述固定构件、所述支承构件以及所述树脂粘接剂构成印刷基板的安装结构。
7.如权利要求5或6所述的半导体装置，其特征在于，
所述固定构件为金属制的固定部，所述支承构件为树脂制的托盘，所述树脂粘接剂为环氧树脂。
8.如权利要求5或6所述的半导体装置，其特征在于，
在所述固定部的底部配置有水平方向的突起。
9.如权利要求5所述的半导体装置，其特征在于，
所述支承构件为所述盖的一部分。
CN201280048421.0A 2011-10-07 2012-09-18 印刷基板的安装结构以及使用该结构的半导体装置 Active CN103858229B (zh)

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Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN106461439A (zh) * 2014-07-30 2017-02-22 日立汽车系统株式会社 电路基板的安装构造、使用了该结构的传感器
CN107110341A (zh) * 2015-01-14 2017-08-29 日立汽车系统株式会社 电子控制装置
CN111741619A (zh) * 2019-03-25 2020-10-02 株式会社京滨 电子装置

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH1065362A (ja) * 1996-08-14 1998-03-06 Hochiki Corp 基板取付構造
JPH11220274A (ja) * 1998-02-03 1999-08-10 Shikoku Henatsuki Kk 電源装置
US20110133325A1 (en) * 2009-12-08 2011-06-09 Moon Dongsoo Integrated circuit packaging system with interconnect and method of manufacture thereof

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH1065362A (ja) * 1996-08-14 1998-03-06 Hochiki Corp 基板取付構造
JPH11220274A (ja) * 1998-02-03 1999-08-10 Shikoku Henatsuki Kk 電源装置
US20110133325A1 (en) * 2009-12-08 2011-06-09 Moon Dongsoo Integrated circuit packaging system with interconnect and method of manufacture thereof

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN106461439A (zh) * 2014-07-30 2017-02-22 日立汽车系统株式会社 电路基板的安装构造、使用了该结构的传感器
CN106461439B (zh) * 2014-07-30 2019-08-16 日立汽车系统株式会社 传感器及其制造方法
CN107110341A (zh) * 2015-01-14 2017-08-29 日立汽车系统株式会社 电子控制装置
CN107110341B (zh) * 2015-01-14 2019-04-19 日立汽车系统株式会社 电子控制装置
CN111741619A (zh) * 2019-03-25 2020-10-02 株式会社京滨 电子装置
CN111741619B (zh) * 2019-03-25 2023-05-26 日立安斯泰莫株式会社 电力转换装置

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