JP5934138B2 - 電子部品の圧縮樹脂封止方法及び圧縮樹脂封止装置 - Google Patents

電子部品の圧縮樹脂封止方法及び圧縮樹脂封止装置 Download PDF

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Publication number
JP5934138B2
JP5934138B2 JP2013083493A JP2013083493A JP5934138B2 JP 5934138 B2 JP5934138 B2 JP 5934138B2 JP 2013083493 A JP2013083493 A JP 2013083493A JP 2013083493 A JP2013083493 A JP 2013083493A JP 5934138 B2 JP5934138 B2 JP 5934138B2
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Japan
Prior art keywords
resin
lower mold
mold cavity
substrate
electronic component
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Active
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JP2013083493A
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English (en)
Japanese (ja)
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JP2014207302A (ja
Inventor
高瀬　慎二
慎二 高瀬
佳久 川本
佳久 川本
衛 砂田
衛 砂田
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Towa Corp
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Towa Corp
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Publication date
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Priority to JP2013083493A priority Critical patent/JP5934138B2/ja
Priority to KR1020140008955A priority patent/KR101610456B1/ko
Priority to CN201410039543.4A priority patent/CN104103530B/zh
Priority to TW103107135A priority patent/TWI592279B/zh
Publication of JP2014207302A publication Critical patent/JP2014207302A/ja
Application granted granted Critical
Publication of JP5934138B2 publication Critical patent/JP5934138B2/ja
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
    • H01L21/565—Moulds
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
    • H01L2224/321—Disposition
    • H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/32225—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73265—Layer and wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/73—Means for bonding being of different types provided for in two or more of groups H01L24/10, H01L24/18, H01L24/26, H01L24/34, H01L24/42, H01L24/50, H01L24/63, H01L24/71

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Casting Or Compression Moulding Of Plastics Or The Like (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
  • Mechanical Engineering (AREA)
JP2013083493A 2013-04-12 2013-04-12 電子部品の圧縮樹脂封止方法及び圧縮樹脂封止装置 Active JP5934138B2 (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2013083493A JP5934138B2 (ja) 2013-04-12 2013-04-12 電子部品の圧縮樹脂封止方法及び圧縮樹脂封止装置
KR1020140008955A KR101610456B1 (ko) 2013-04-12 2014-01-24 전자 부품의 압축 수지 밀봉 방법 및 압축 수지 밀봉 장치
CN201410039543.4A CN104103530B (zh) 2013-04-12 2014-01-27 电子元件的压缩树脂封装方法及压缩树脂封装装置
TW103107135A TWI592279B (zh) 2013-04-12 2014-03-04 Compression resin sealing method for electronic parts and compression resin sealing device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2013083493A JP5934138B2 (ja) 2013-04-12 2013-04-12 電子部品の圧縮樹脂封止方法及び圧縮樹脂封止装置

Publications (2)

Publication Number Publication Date
JP2014207302A JP2014207302A (ja) 2014-10-30
JP5934138B2 true JP5934138B2 (ja) 2016-06-15

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JP2013083493A Active JP5934138B2 (ja) 2013-04-12 2013-04-12 電子部品の圧縮樹脂封止方法及び圧縮樹脂封止装置

Country Status (4)

Country Link
JP (1) JP5934138B2 (ko)
KR (1) KR101610456B1 (ko)
CN (1) CN104103530B (ko)
TW (1) TWI592279B (ko)

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6491508B2 (ja) * 2015-03-23 2019-03-27 Ｔｏｗａ株式会社 樹脂封止装置及び樹脂成形品の製造方法
JP6654861B2 (ja) * 2015-11-09 2020-02-26 Ｔｏｗａ株式会社 樹脂封止装置及び樹脂封止方法
NL2016011B1 (en) 2015-12-23 2017-07-03 Besi Netherlands Bv Press, actuator set and method for encapsulating electronic components with at least two individual controllable actuators.
JP6580519B2 (ja) * 2016-05-24 2019-09-25 Ｔｏｗａ株式会社 圧縮成形装置、樹脂封止品製造装置、圧縮成形方法、及び樹脂封止品の製造方法
JP6861507B2 (ja) * 2016-11-29 2021-04-21 Ｔｏｗａ株式会社 圧縮成形装置、圧縮成形方法、及び圧縮成形品の製造方法
JP6861506B2 (ja) * 2016-11-29 2021-04-21 Ｔｏｗａ株式会社 圧縮成形装置、圧縮成形方法、及び圧縮成形品の製造方法
US10199299B1 (en) 2017-08-07 2019-02-05 Micron Technology, Inc. Semiconductor mold compound transfer system and associated methods
KR102446861B1 (ko) 2017-09-21 2022-09-23 삼성전자주식회사 적층 패키지 및 그의 제조 방법
JP7149238B2 (ja) * 2019-08-09 2022-10-06 Ｔｏｗａ株式会社 樹脂成形装置及び樹脂成形品の製造方法
CN112976666B (zh) * 2019-12-12 2022-07-26 东莞市天贺电子科技有限公司 一种应用于压缩成形的模具上的动平衡缓冲机构
CN111391219B (zh) * 2020-03-20 2021-12-24 东莞市艾尔玛塑件科技有限公司 一种模内转印系统
JP7475215B2 (ja) * 2020-06-29 2024-04-26 Nok株式会社 ガスケットの製造方法
CN114801003B (zh) * 2022-04-25 2024-04-05 浙江瑞然生态科技有限公司 全生物降解型环保餐具模压装置及其制备方法

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100469516B1 (ko) * 1996-07-12 2005-02-02 후지쯔 가부시끼가이샤 반도체 장치의 제조 방법 및 반도체 장치
JP4326786B2 (ja) * 2002-11-26 2009-09-09 Ｔｏｗａ株式会社 樹脂封止装置
JP4336502B2 (ja) * 2003-01-30 2009-09-30 Ｔｏｗａ株式会社 電子部品の樹脂封止成形方法及び装置
US7189601B2 (en) * 2004-03-02 2007-03-13 Texas Instruments Incorporated System and method for forming mold caps over integrated circuit devices
JP2005324341A (ja) * 2004-05-12 2005-11-24 Apic Yamada Corp 樹脂モールド方法および樹脂モールド装置
JP2006245151A (ja) * 2005-03-02 2006-09-14 Matsushita Electric Ind Co Ltd 封止成型方法

Also Published As

Publication number Publication date
TWI592279B (zh) 2017-07-21
KR20140123407A (ko) 2014-10-22
CN104103530B (zh) 2017-06-20
CN104103530A (zh) 2014-10-15
TW201507842A (zh) 2015-03-01
JP2014207302A (ja) 2014-10-30
KR101610456B1 (ko) 2016-04-07

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