JP5931067B2 - 基板シート - Google Patents

基板シート Download PDF

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Publication number
JP5931067B2
JP5931067B2 JP2013526590A JP2013526590A JP5931067B2 JP 5931067 B2 JP5931067 B2 JP 5931067B2 JP 2013526590 A JP2013526590 A JP 2013526590A JP 2013526590 A JP2013526590 A JP 2013526590A JP 5931067 B2 JP5931067 B2 JP 5931067B2
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JP
Japan
Prior art keywords
layer
metal
metal layer
polymer support
support layer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP2013526590A
Other languages
English (en)
Japanese (ja)
Other versions
JP2013539216A (ja
JP2013539216A5 (enExample
Inventor
リフカ，ヘルベルト
ヘンドリキュス マリア サンデルス，レナテュス
ヘンドリキュス マリア サンデルス，レナテュス
マシュー，デニー
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nederlandse Organisatie voor Toegepast Natuurwetenschappelijk Onderzoek TNO
Koninklijke Philips NV
Original Assignee
Nederlandse Organisatie voor Toegepast Natuurwetenschappelijk Onderzoek TNO
Koninklijke Philips NV
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nederlandse Organisatie voor Toegepast Natuurwetenschappelijk Onderzoek TNO, Koninklijke Philips NV filed Critical Nederlandse Organisatie voor Toegepast Natuurwetenschappelijk Onderzoek TNO
Publication of JP2013539216A publication Critical patent/JP2013539216A/ja
Publication of JP2013539216A5 publication Critical patent/JP2013539216A5/ja
Application granted granted Critical
Publication of JP5931067B2 publication Critical patent/JP5931067B2/ja
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/60—Forming conductive regions or layers, e.g. electrodes
    • H10K71/611—Forming conductive regions or layers, e.g. electrodes using printing deposition, e.g. ink jet printing
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/20—Layered products comprising a layer of metal comprising aluminium or copper
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B3/00—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar shape; Layered products comprising a layer having particular features of form
    • B32B3/02—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar shape; Layered products comprising a layer having particular features of form characterised by features of form at particular places, e.g. in edge regions
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B3/00—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar shape; Layered products comprising a layer having particular features of form
    • B32B3/02—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar shape; Layered products comprising a layer having particular features of form characterised by features of form at particular places, e.g. in edge regions
    • B32B3/08—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar shape; Layered products comprising a layer having particular features of form characterised by features of form at particular places, e.g. in edge regions characterised by added members at particular parts
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H10K50/805—Electrodes
    • H10K50/81—Anodes
    • H10K50/814—Anodes combined with auxiliary electrodes, e.g. ITO layer combined with metal lines
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/50—Forming devices by joining two substrates together, e.g. lamination techniques
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/80—Manufacture or treatment specially adapted for the organic devices covered by this subclass using temporary substrates
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2457/00—Electrical equipment
    • B32B2457/20—Displays, e.g. liquid crystal displays, plasma displays
    • B32B2457/206—Organic displays, e.g. OLED
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K2102/00—Constructional details relating to the organic devices covered by this subclass
    • H10K2102/301—Details of OLEDs
    • H10K2102/351—Thickness

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Electroluminescent Light Sources (AREA)
  • Photovoltaic Devices (AREA)
  • Laminated Bodies (AREA)
  • Wire Bonding (AREA)
  • Laser Beam Processing (AREA)
JP2013526590A 2010-09-06 2011-09-02 基板シート Expired - Fee Related JP5931067B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
EP10175346 2010-09-06
EP10175346.5 2010-09-06
PCT/IB2011/053852 WO2012032446A1 (en) 2010-09-06 2011-09-02 Substrate sheet

Publications (3)

Publication Number Publication Date
JP2013539216A JP2013539216A (ja) 2013-10-17
JP2013539216A5 JP2013539216A5 (enExample) 2015-07-16
JP5931067B2 true JP5931067B2 (ja) 2016-06-08

Family

ID=44720070

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2013526590A Expired - Fee Related JP5931067B2 (ja) 2010-09-06 2011-09-02 基板シート

Country Status (7)

Country Link
US (1) US8664096B2 (enExample)
EP (1) EP2614544B1 (enExample)
JP (1) JP5931067B2 (enExample)
KR (1) KR101872676B1 (enExample)
CN (1) CN103098255B (enExample)
TW (1) TWI536517B (enExample)
WO (1) WO2012032446A1 (enExample)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9991463B2 (en) * 2012-06-14 2018-06-05 Universal Display Corporation Electronic devices with improved shelf lives
CN103236504A (zh) * 2013-05-10 2013-08-07 合肥京东方光电科技有限公司 柔性基板及制造方法、oled显示装置
KR101461437B1 (ko) * 2013-05-27 2014-11-18 에이피시스템 주식회사 포토마스크 세정 장치 및 이를 이용한 포토마스크 세정 방법
US9577196B2 (en) * 2014-02-28 2017-02-21 International Business Machines Corporation Optoelectronics integration by transfer process
KR20160025152A (ko) * 2014-08-26 2016-03-08 삼성디스플레이 주식회사 보호 구조물 및 보호 구조물을 포함하는 유기 발광 표시 장치
KR102325514B1 (ko) * 2015-02-26 2021-11-15 삼성디스플레이 주식회사 표시 장치 및 표시 장치의 제조 방법
CN112968144B (zh) * 2021-03-09 2022-05-20 华中科技大学 基于丝网状衬底层的pi柔性基板剥离方法、柔性基板和oled

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3324014A (en) 1962-12-03 1967-06-06 United Carr Inc Method for making flush metallic patterns
DE69500415T2 (de) 1994-02-22 1998-02-05 Philips Electronics Nv Laserätzverfahren
DE19512157C1 (de) 1995-03-31 1996-05-23 Klaus Kall Verfahren zum Beschichten einer transparenten Trägerplatte sowie danach hergestellte beschichtete Trägerplatte
JPH0964514A (ja) * 1995-08-29 1997-03-07 Matsushita Electric Works Ltd プリント配線板の製造方法
JP2000216394A (ja) 1999-01-27 2000-08-04 Sony Corp 電気光学装置、電気光学装置用の駆動基板、及びこれらの製造方法
JP4493933B2 (ja) 2002-05-17 2010-06-30 株式会社半導体エネルギー研究所 表示装置
US6946178B2 (en) 2003-05-23 2005-09-20 James Sheats Lamination and delamination technique for thin film processing
US20070210420A1 (en) 2006-03-11 2007-09-13 Nelson Curt L Laser delamination of thin metal film using sacrificial polymer layer
JP5136039B2 (ja) * 2007-12-12 2013-02-06 コニカミノルタホールディングス株式会社 導電性材料の製造方法、透明導電膜、有機エレクトロルミネッセンス素子
US20090202857A1 (en) 2008-02-08 2009-08-13 Roger Stanley Kerr Method for forming an electronic device on a flexible metallic substrate and resultant device
EP2284922A1 (en) * 2009-08-06 2011-02-16 Nederlandse Organisatie voor toegepast -natuurwetenschappelijk onderzoek TNO Method of manufacturing an opto-electric device

Also Published As

Publication number Publication date
TWI536517B (zh) 2016-06-01
KR20130106836A (ko) 2013-09-30
US20130157446A1 (en) 2013-06-20
EP2614544A1 (en) 2013-07-17
WO2012032446A1 (en) 2012-03-15
CN103098255B (zh) 2016-04-13
KR101872676B1 (ko) 2018-07-02
JP2013539216A (ja) 2013-10-17
EP2614544B1 (en) 2015-04-22
US8664096B2 (en) 2014-03-04
CN103098255A (zh) 2013-05-08
TW201220448A (en) 2012-05-16

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