KR101872676B1 - 기판 시트 - Google Patents

기판 시트 Download PDF

Info

Publication number
KR101872676B1
KR101872676B1 KR1020137008896A KR20137008896A KR101872676B1 KR 101872676 B1 KR101872676 B1 KR 101872676B1 KR 1020137008896 A KR1020137008896 A KR 1020137008896A KR 20137008896 A KR20137008896 A KR 20137008896A KR 101872676 B1 KR101872676 B1 KR 101872676B1
Authority
KR
South Korea
Prior art keywords
layer
metal layer
metal
polymer support
barrier
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
KR1020137008896A
Other languages
English (en)
Korean (ko)
Other versions
KR20130106836A (ko
Inventor
허버트 리프카
레나투스 헨드리쿠스 마리아 샌더스
데니 매튜
Original Assignee
코닌클리케 필립스 엔.브이.
네덜란제 오르가니자티에 포오르 토에게파스트-나투우르베텐샤펠리즈크 온데르조에크 테엔오
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 코닌클리케 필립스 엔.브이., 네덜란제 오르가니자티에 포오르 토에게파스트-나투우르베텐샤펠리즈크 온데르조에크 테엔오 filed Critical 코닌클리케 필립스 엔.브이.
Publication of KR20130106836A publication Critical patent/KR20130106836A/ko
Application granted granted Critical
Publication of KR101872676B1 publication Critical patent/KR101872676B1/ko
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/60—Forming conductive regions or layers, e.g. electrodes
    • H10K71/611—Forming conductive regions or layers, e.g. electrodes using printing deposition, e.g. ink jet printing
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/20—Layered products comprising a layer of metal comprising aluminium or copper
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B3/00—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar shape; Layered products comprising a layer having particular features of form
    • B32B3/02—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar shape; Layered products comprising a layer having particular features of form characterised by features of form at particular places, e.g. in edge regions
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B3/00—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar shape; Layered products comprising a layer having particular features of form
    • B32B3/02—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar shape; Layered products comprising a layer having particular features of form characterised by features of form at particular places, e.g. in edge regions
    • B32B3/08—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar shape; Layered products comprising a layer having particular features of form characterised by features of form at particular places, e.g. in edge regions characterised by added members at particular parts
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H10K50/805—Electrodes
    • H10K50/81—Anodes
    • H10K50/814—Anodes combined with auxiliary electrodes, e.g. ITO layer combined with metal lines
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/50—Forming devices by joining two substrates together, e.g. lamination techniques
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/80—Manufacture or treatment specially adapted for the organic devices covered by this subclass using temporary substrates
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2457/00—Electrical equipment
    • B32B2457/20—Displays, e.g. liquid crystal displays, plasma displays
    • B32B2457/206—Organic displays, e.g. OLED
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K2102/00—Constructional details relating to the organic devices covered by this subclass
    • H10K2102/301—Details of OLEDs
    • H10K2102/351—Thickness

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Electroluminescent Light Sources (AREA)
  • Photovoltaic Devices (AREA)
  • Laminated Bodies (AREA)
  • Wire Bonding (AREA)
  • Laser Beam Processing (AREA)
KR1020137008896A 2010-09-06 2011-09-02 기판 시트 Expired - Fee Related KR101872676B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
EP10175346.5 2010-09-06
EP10175346 2010-09-06
PCT/IB2011/053852 WO2012032446A1 (en) 2010-09-06 2011-09-02 Substrate sheet

Publications (2)

Publication Number Publication Date
KR20130106836A KR20130106836A (ko) 2013-09-30
KR101872676B1 true KR101872676B1 (ko) 2018-07-02

Family

ID=44720070

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020137008896A Expired - Fee Related KR101872676B1 (ko) 2010-09-06 2011-09-02 기판 시트

Country Status (7)

Country Link
US (1) US8664096B2 (enExample)
EP (1) EP2614544B1 (enExample)
JP (1) JP5931067B2 (enExample)
KR (1) KR101872676B1 (enExample)
CN (1) CN103098255B (enExample)
TW (1) TWI536517B (enExample)
WO (1) WO2012032446A1 (enExample)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9991463B2 (en) * 2012-06-14 2018-06-05 Universal Display Corporation Electronic devices with improved shelf lives
CN103236504A (zh) * 2013-05-10 2013-08-07 合肥京东方光电科技有限公司 柔性基板及制造方法、oled显示装置
KR101461437B1 (ko) * 2013-05-27 2014-11-18 에이피시스템 주식회사 포토마스크 세정 장치 및 이를 이용한 포토마스크 세정 방법
US9577196B2 (en) * 2014-02-28 2017-02-21 International Business Machines Corporation Optoelectronics integration by transfer process
KR20160025152A (ko) * 2014-08-26 2016-03-08 삼성디스플레이 주식회사 보호 구조물 및 보호 구조물을 포함하는 유기 발광 표시 장치
KR102325514B1 (ko) * 2015-02-26 2021-11-15 삼성디스플레이 주식회사 표시 장치 및 표시 장치의 제조 방법
CN112968144B (zh) * 2021-03-09 2022-05-20 华中科技大学 基于丝网状衬底层的pi柔性基板剥离方法、柔性基板和oled

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3324014A (en) 1962-12-03 1967-06-06 United Carr Inc Method for making flush metallic patterns
JP2000216394A (ja) 1999-01-27 2000-08-04 Sony Corp 電気光学装置、電気光学装置用の駆動基板、及びこれらの製造方法
JP2004079509A (ja) 2002-05-17 2004-03-11 Semiconductor Energy Lab Co Ltd 表示装置

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0699375B1 (en) 1994-02-22 1997-07-09 Koninklijke Philips Electronics N.V. Laser etching method
DE19512157C1 (de) 1995-03-31 1996-05-23 Klaus Kall Verfahren zum Beschichten einer transparenten Trägerplatte sowie danach hergestellte beschichtete Trägerplatte
JPH0964514A (ja) * 1995-08-29 1997-03-07 Matsushita Electric Works Ltd プリント配線板の製造方法
US6946178B2 (en) 2003-05-23 2005-09-20 James Sheats Lamination and delamination technique for thin film processing
US20070210420A1 (en) 2006-03-11 2007-09-13 Nelson Curt L Laser delamination of thin metal film using sacrificial polymer layer
JP5136039B2 (ja) 2007-12-12 2013-02-06 コニカミノルタホールディングス株式会社 導電性材料の製造方法、透明導電膜、有機エレクトロルミネッセンス素子
US20090202857A1 (en) 2008-02-08 2009-08-13 Roger Stanley Kerr Method for forming an electronic device on a flexible metallic substrate and resultant device
EP2284922A1 (en) * 2009-08-06 2011-02-16 Nederlandse Organisatie voor toegepast -natuurwetenschappelijk onderzoek TNO Method of manufacturing an opto-electric device

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3324014A (en) 1962-12-03 1967-06-06 United Carr Inc Method for making flush metallic patterns
JP2000216394A (ja) 1999-01-27 2000-08-04 Sony Corp 電気光学装置、電気光学装置用の駆動基板、及びこれらの製造方法
JP2004079509A (ja) 2002-05-17 2004-03-11 Semiconductor Energy Lab Co Ltd 表示装置

Also Published As

Publication number Publication date
JP5931067B2 (ja) 2016-06-08
EP2614544B1 (en) 2015-04-22
EP2614544A1 (en) 2013-07-17
CN103098255B (zh) 2016-04-13
TWI536517B (zh) 2016-06-01
WO2012032446A1 (en) 2012-03-15
TW201220448A (en) 2012-05-16
US8664096B2 (en) 2014-03-04
CN103098255A (zh) 2013-05-08
US20130157446A1 (en) 2013-06-20
KR20130106836A (ko) 2013-09-30
JP2013539216A (ja) 2013-10-17

Similar Documents

Publication Publication Date Title
KR101872676B1 (ko) 기판 시트
CN107405880B (zh) 透明导电层叠层用膜、其制造方法及透明导电膜
KR101191865B1 (ko) 금속 배선이 함몰된 유연 기판의 제조방법 및 이에 따라 제조되는 유연 기판
JP5097172B2 (ja) グラフェン層の剥離方法、グラフェンウエハの製造方法、及び、グラフェン素子の製造方法
KR101161301B1 (ko) 플라즈마를 이용한 금속 배선이 함몰된 유연 기판의 제조방법 및 이에 따라 제조되는 유연 기판
US20160304352A1 (en) Graphene tape
JP2013539216A5 (enExample)
US10580649B2 (en) Tools and methods for producing nanoantenna electronic devices
EP2410379A3 (en) Substrate to be processed having laminated thereon resist film for electron beam and organic conductive film, method for manufacturing the same, and resist pattering process
CN104029431B (zh) 扭曲角度可控的多层石墨烯结构制备方法
JP2008311665A (ja) 光起電力シリコンウェファ上に導体路を形成する方法
KR101463227B1 (ko) 금속배선이 함입된 유연기판 제조 장치
KR20230118899A (ko) 중간 폴리머 전사층 상의 2차원 재료 및 이종 구조및 이의 제조
KR101367292B1 (ko) 배선 패턴의 제조 방법
KR20150047002A (ko) 금속 박막을 포함하는 캐리어 필름 제조 방법 및 이를 이용한 복합필름.
CN106624371A (zh) 一种在目标器件上形成图案化的石墨烯的方法
TW201942418A (zh) 可撓性聚合物片材之金屬化
KR101403254B1 (ko) 나노 구조체를 구비한 소자의 제조방법
US10411142B2 (en) Method for production of components comprising a schottky diode by means of printing technology
JP2017507486A (ja) 基板から剥離可能な薄膜積層体を製造するための方法
US10040271B1 (en) Metalization of flexible polymer sheets
WO2017112932A1 (en) Patterning and inverted deposition engineering for solution-processed electrodes and semiconducting films
WO2012144827A2 (ko) 금속 배선이 함몰된 유연 기판의 제조방법 및 이에 따라 제조되는 유연 기판
KR20150040237A (ko) 그래핀 회로 패턴의 형성 방법, 및 그래핀 회로 패턴을 갖는 제품

Legal Events

Date Code Title Description
PA0105 International application

St.27 status event code: A-0-1-A10-A15-nap-PA0105

E13-X000 Pre-grant limitation requested

St.27 status event code: A-2-3-E10-E13-lim-X000

P11-X000 Amendment of application requested

St.27 status event code: A-2-2-P10-P11-nap-X000

P13-X000 Application amended

St.27 status event code: A-2-2-P10-P13-nap-X000

PG1501 Laying open of application

St.27 status event code: A-1-1-Q10-Q12-nap-PG1501

R18-X000 Changes to party contact information recorded

St.27 status event code: A-3-3-R10-R18-oth-X000

R18-X000 Changes to party contact information recorded

St.27 status event code: A-3-3-R10-R18-oth-X000

A201 Request for examination
PA0201 Request for examination

St.27 status event code: A-1-2-D10-D11-exm-PA0201

D13-X000 Search requested

St.27 status event code: A-1-2-D10-D13-srh-X000

D14-X000 Search report completed

St.27 status event code: A-1-2-D10-D14-srh-X000

E902 Notification of reason for refusal
PE0902 Notice of grounds for rejection

St.27 status event code: A-1-2-D10-D21-exm-PE0902

T11-X000 Administrative time limit extension requested

St.27 status event code: U-3-3-T10-T11-oth-X000

T11-X000 Administrative time limit extension requested

St.27 status event code: U-3-3-T10-T11-oth-X000

T11-X000 Administrative time limit extension requested

St.27 status event code: U-3-3-T10-T11-oth-X000

P11-X000 Amendment of application requested

St.27 status event code: A-2-2-P10-P11-nap-X000

P13-X000 Application amended

St.27 status event code: A-2-2-P10-P13-nap-X000

E701 Decision to grant or registration of patent right
PE0701 Decision of registration

St.27 status event code: A-1-2-D10-D22-exm-PE0701

GRNT Written decision to grant
PR0701 Registration of establishment

St.27 status event code: A-2-4-F10-F11-exm-PR0701

PR1002 Payment of registration fee

St.27 status event code: A-2-2-U10-U12-oth-PR1002

Fee payment year number: 1

PG1601 Publication of registration

St.27 status event code: A-4-4-Q10-Q13-nap-PG1601

PC1903 Unpaid annual fee

St.27 status event code: A-4-4-U10-U13-oth-PC1903

Not in force date: 20210626

Payment event data comment text: Termination Category : DEFAULT_OF_REGISTRATION_FEE

R18-X000 Changes to party contact information recorded

St.27 status event code: A-5-5-R10-R18-oth-X000

PC1903 Unpaid annual fee

St.27 status event code: N-4-6-H10-H13-oth-PC1903

Ip right cessation event data comment text: Termination Category : DEFAULT_OF_REGISTRATION_FEE

Not in force date: 20210626

P22-X000 Classification modified

St.27 status event code: A-4-4-P10-P22-nap-X000

P22-X000 Classification modified

St.27 status event code: A-4-4-P10-P22-nap-X000