CN103098255B - 衬底片 - Google Patents

衬底片 Download PDF

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Publication number
CN103098255B
CN103098255B CN201180042954.3A CN201180042954A CN103098255B CN 103098255 B CN103098255 B CN 103098255B CN 201180042954 A CN201180042954 A CN 201180042954A CN 103098255 B CN103098255 B CN 103098255B
Authority
CN
China
Prior art keywords
layer
metal level
metal
support layer
hardware
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CN201180042954.3A
Other languages
English (en)
Chinese (zh)
Other versions
CN103098255A (zh
Inventor
H.利夫卡
R.H.M.桑德斯
D.马修
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nederlandse Organisatie voor Toegepast Natuurwetenschappelijk Onderzoek TNO
Koninklijke Philips NV
Original Assignee
Nederlandse Organisatie voor Toegepast Natuurwetenschappelijk Onderzoek TNO
Koninklijke Philips Electronics NV
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nederlandse Organisatie voor Toegepast Natuurwetenschappelijk Onderzoek TNO, Koninklijke Philips Electronics NV filed Critical Nederlandse Organisatie voor Toegepast Natuurwetenschappelijk Onderzoek TNO
Publication of CN103098255A publication Critical patent/CN103098255A/zh
Application granted granted Critical
Publication of CN103098255B publication Critical patent/CN103098255B/zh
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/60—Forming conductive regions or layers, e.g. electrodes
    • H10K71/611—Forming conductive regions or layers, e.g. electrodes using printing deposition, e.g. ink jet printing
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/20—Layered products comprising a layer of metal comprising aluminium or copper
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B3/00—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar shape; Layered products comprising a layer having particular features of form
    • B32B3/02—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar shape; Layered products comprising a layer having particular features of form characterised by features of form at particular places, e.g. in edge regions
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B3/00—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar shape; Layered products comprising a layer having particular features of form
    • B32B3/02—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar shape; Layered products comprising a layer having particular features of form characterised by features of form at particular places, e.g. in edge regions
    • B32B3/08—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar shape; Layered products comprising a layer having particular features of form characterised by features of form at particular places, e.g. in edge regions characterised by added members at particular parts
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H10K50/805—Electrodes
    • H10K50/81—Anodes
    • H10K50/814—Anodes combined with auxiliary electrodes, e.g. ITO layer combined with metal lines
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/50—Forming devices by joining two substrates together, e.g. lamination techniques
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/80—Manufacture or treatment specially adapted for the organic devices covered by this subclass using temporary substrates
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2457/00—Electrical equipment
    • B32B2457/20—Displays, e.g. liquid crystal displays, plasma displays
    • B32B2457/206—Organic displays, e.g. OLED
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K2102/00—Constructional details relating to the organic devices covered by this subclass
    • H10K2102/301—Details of OLEDs
    • H10K2102/351—Thickness

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Electroluminescent Light Sources (AREA)
  • Photovoltaic Devices (AREA)
  • Laminated Bodies (AREA)
  • Wire Bonding (AREA)
  • Laser Beam Processing (AREA)
CN201180042954.3A 2010-09-06 2011-09-02 衬底片 Expired - Fee Related CN103098255B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
EP10175346.5 2010-09-06
EP10175346 2010-09-06
PCT/IB2011/053852 WO2012032446A1 (en) 2010-09-06 2011-09-02 Substrate sheet

Publications (2)

Publication Number Publication Date
CN103098255A CN103098255A (zh) 2013-05-08
CN103098255B true CN103098255B (zh) 2016-04-13

Family

ID=44720070

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201180042954.3A Expired - Fee Related CN103098255B (zh) 2010-09-06 2011-09-02 衬底片

Country Status (7)

Country Link
US (1) US8664096B2 (enExample)
EP (1) EP2614544B1 (enExample)
JP (1) JP5931067B2 (enExample)
KR (1) KR101872676B1 (enExample)
CN (1) CN103098255B (enExample)
TW (1) TWI536517B (enExample)
WO (1) WO2012032446A1 (enExample)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9991463B2 (en) * 2012-06-14 2018-06-05 Universal Display Corporation Electronic devices with improved shelf lives
CN103236504A (zh) * 2013-05-10 2013-08-07 合肥京东方光电科技有限公司 柔性基板及制造方法、oled显示装置
KR101461437B1 (ko) * 2013-05-27 2014-11-18 에이피시스템 주식회사 포토마스크 세정 장치 및 이를 이용한 포토마스크 세정 방법
US9577196B2 (en) * 2014-02-28 2017-02-21 International Business Machines Corporation Optoelectronics integration by transfer process
KR20160025152A (ko) * 2014-08-26 2016-03-08 삼성디스플레이 주식회사 보호 구조물 및 보호 구조물을 포함하는 유기 발광 표시 장치
KR102325514B1 (ko) * 2015-02-26 2021-11-15 삼성디스플레이 주식회사 표시 장치 및 표시 장치의 제조 방법
CN112968144B (zh) * 2021-03-09 2022-05-20 华中科技大学 基于丝网状衬底层的pi柔性基板剥离方法、柔性基板和oled

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3324014A (en) * 1962-12-03 1967-06-06 United Carr Inc Method for making flush metallic patterns
JP2009146640A (ja) * 2007-12-12 2009-07-02 Konica Minolta Holdings Inc 導電性材料の製造方法、透明導電膜、有機エレクトロルミネッセンス素子

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0699375B1 (en) 1994-02-22 1997-07-09 Koninklijke Philips Electronics N.V. Laser etching method
DE19512157C1 (de) 1995-03-31 1996-05-23 Klaus Kall Verfahren zum Beschichten einer transparenten Trägerplatte sowie danach hergestellte beschichtete Trägerplatte
JPH0964514A (ja) * 1995-08-29 1997-03-07 Matsushita Electric Works Ltd プリント配線板の製造方法
JP2000216394A (ja) 1999-01-27 2000-08-04 Sony Corp 電気光学装置、電気光学装置用の駆動基板、及びこれらの製造方法
JP4493933B2 (ja) 2002-05-17 2010-06-30 株式会社半導体エネルギー研究所 表示装置
US6946178B2 (en) 2003-05-23 2005-09-20 James Sheats Lamination and delamination technique for thin film processing
US20070210420A1 (en) 2006-03-11 2007-09-13 Nelson Curt L Laser delamination of thin metal film using sacrificial polymer layer
US20090202857A1 (en) 2008-02-08 2009-08-13 Roger Stanley Kerr Method for forming an electronic device on a flexible metallic substrate and resultant device
EP2284922A1 (en) * 2009-08-06 2011-02-16 Nederlandse Organisatie voor toegepast -natuurwetenschappelijk onderzoek TNO Method of manufacturing an opto-electric device

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3324014A (en) * 1962-12-03 1967-06-06 United Carr Inc Method for making flush metallic patterns
JP2009146640A (ja) * 2007-12-12 2009-07-02 Konica Minolta Holdings Inc 導電性材料の製造方法、透明導電膜、有機エレクトロルミネッセンス素子

Also Published As

Publication number Publication date
JP5931067B2 (ja) 2016-06-08
EP2614544B1 (en) 2015-04-22
EP2614544A1 (en) 2013-07-17
TWI536517B (zh) 2016-06-01
WO2012032446A1 (en) 2012-03-15
TW201220448A (en) 2012-05-16
US8664096B2 (en) 2014-03-04
CN103098255A (zh) 2013-05-08
KR101872676B1 (ko) 2018-07-02
US20130157446A1 (en) 2013-06-20
KR20130106836A (ko) 2013-09-30
JP2013539216A (ja) 2013-10-17

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CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20160413

Termination date: 20200902