JP5931006B2 - 発光装置 - Google Patents

発光装置 Download PDF

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Publication number
JP5931006B2
JP5931006B2 JP2013116842A JP2013116842A JP5931006B2 JP 5931006 B2 JP5931006 B2 JP 5931006B2 JP 2013116842 A JP2013116842 A JP 2013116842A JP 2013116842 A JP2013116842 A JP 2013116842A JP 5931006 B2 JP5931006 B2 JP 5931006B2
Authority
JP
Japan
Prior art keywords
light
light emitting
emitting device
covering member
emitting element
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2013116842A
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English (en)
Japanese (ja)
Other versions
JP2013239712A (ja
JP2013239712A5 (https=
Inventor
将嗣 市川
将嗣 市川
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nichia Corp
Original Assignee
Nichia Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nichia Corp filed Critical Nichia Corp
Priority to JP2013116842A priority Critical patent/JP5931006B2/ja
Publication of JP2013239712A publication Critical patent/JP2013239712A/ja
Publication of JP2013239712A5 publication Critical patent/JP2013239712A5/ja
Application granted granted Critical
Publication of JP5931006B2 publication Critical patent/JP5931006B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/851—Dispositions of multiple connectors or interconnections
    • H10W72/874—On different surfaces
    • H10W72/884—Die-attach connectors and bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H10W74/15—Encapsulations, e.g. protective coatings characterised by their shape or disposition on active surfaces of flip-chip devices, e.g. underfills
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/721—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors
    • H10W90/724—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors between a chip and a stacked insulating package substrate, interposer or RDL
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/731—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors
    • H10W90/734—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors between a chip and a stacked insulating package substrate, interposer or RDL
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/754—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked insulating package substrate, interposer or RDL

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  • Led Device Packages (AREA)
JP2013116842A 2013-06-03 2013-06-03 発光装置 Active JP5931006B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2013116842A JP5931006B2 (ja) 2013-06-03 2013-06-03 発光装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2013116842A JP5931006B2 (ja) 2013-06-03 2013-06-03 発光装置

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
JP2009084101A Division JP5689225B2 (ja) 2009-03-31 2009-03-31 発光装置

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2015032797A Division JP2015099940A (ja) 2015-02-23 2015-02-23 発光装置

Publications (3)

Publication Number Publication Date
JP2013239712A JP2013239712A (ja) 2013-11-28
JP2013239712A5 JP2013239712A5 (https=) 2014-01-16
JP5931006B2 true JP5931006B2 (ja) 2016-06-08

Family

ID=49764455

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2013116842A Active JP5931006B2 (ja) 2013-06-03 2013-06-03 発光装置

Country Status (1)

Country Link
JP (1) JP5931006B2 (https=)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6544076B2 (ja) * 2014-12-26 2019-07-17 日亜化学工業株式会社 発光装置
JP2017034218A (ja) 2015-08-03 2017-02-09 株式会社東芝 半導体発光装置
JP2018067618A (ja) * 2016-10-19 2018-04-26 日本電気硝子株式会社 発光デバイス
JP7007598B2 (ja) * 2018-12-14 2022-02-10 日亜化学工業株式会社 発光装置、発光モジュール及び発光装置の製造方法

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4081985B2 (ja) * 2001-03-02 2008-04-30 日亜化学工業株式会社 発光装置およびその製造方法
JP4529319B2 (ja) * 2001-06-27 2010-08-25 日亜化学工業株式会社 半導体チップとその製造方法
JP4214704B2 (ja) * 2002-03-20 2009-01-28 日亜化学工業株式会社 半導体素子
JP4386789B2 (ja) * 2004-05-12 2009-12-16 ローム株式会社 発光ダイオード素子の製造方法
DE102004053116A1 (de) * 2004-11-03 2006-05-04 Tridonic Optoelectronics Gmbh Leuchtdioden-Anordnung mit Farbkonversions-Material
JP2006156662A (ja) * 2004-11-29 2006-06-15 Matsushita Electric Ind Co Ltd 発光装置
JP2007019096A (ja) * 2005-07-05 2007-01-25 Toyoda Gosei Co Ltd 発光装置及びその製造方法
WO2007148829A1 (ja) * 2006-06-22 2007-12-27 Ube Industries, Ltd. 光変換用複合体、それを用いた発光装置および色調制御方法
KR101113878B1 (ko) * 2006-06-23 2012-03-09 엘지이노텍 주식회사 수직형 발광 소자 및 그 제조방법

Also Published As

Publication number Publication date
JP2013239712A (ja) 2013-11-28

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