JP5926794B2 - 成膜方法、成膜装置、及び、成膜システム - Google Patents
成膜方法、成膜装置、及び、成膜システム Download PDFInfo
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- JP5926794B2 JP5926794B2 JP2014512561A JP2014512561A JP5926794B2 JP 5926794 B2 JP5926794 B2 JP 5926794B2 JP 2014512561 A JP2014512561 A JP 2014512561A JP 2014512561 A JP2014512561 A JP 2014512561A JP 5926794 B2 JP5926794 B2 JP 5926794B2
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- 238000000034 method Methods 0.000 title claims description 96
- 239000007789 gas Substances 0.000 claims description 302
- 239000002243 precursor Substances 0.000 claims description 161
- 239000000758 substrate Substances 0.000 claims description 154
- 238000012545 processing Methods 0.000 claims description 99
- 239000002019 doping agent Substances 0.000 claims description 55
- 239000004065 semiconductor Substances 0.000 claims description 34
- 238000000137 annealing Methods 0.000 claims description 26
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 claims description 23
- 239000000463 material Substances 0.000 claims description 18
- 238000009832 plasma treatment Methods 0.000 claims description 17
- 238000012546 transfer Methods 0.000 claims description 16
- 125000001309 chloro group Chemical group Cl* 0.000 claims description 12
- 239000001257 hydrogen Substances 0.000 claims description 9
- 229910052739 hydrogen Inorganic materials 0.000 claims description 9
- 125000004435 hydrogen atom Chemical group [H]* 0.000 claims description 9
- 229910052801 chlorine Inorganic materials 0.000 claims description 8
- -1 hydrogen ions Chemical class 0.000 claims description 6
- 230000008569 process Effects 0.000 description 47
- 238000002347 injection Methods 0.000 description 42
- 239000007924 injection Substances 0.000 description 42
- 238000007789 sealing Methods 0.000 description 18
- 238000010926 purge Methods 0.000 description 17
- 239000012495 reaction gas Substances 0.000 description 15
- 238000000231 atomic layer deposition Methods 0.000 description 14
- 238000009792 diffusion process Methods 0.000 description 12
- 230000015572 biosynthetic process Effects 0.000 description 11
- 238000011282 treatment Methods 0.000 description 10
- 239000000460 chlorine Substances 0.000 description 7
- MROCJMGDEKINLD-UHFFFAOYSA-N dichlorosilane Chemical compound Cl[SiH2]Cl MROCJMGDEKINLD-UHFFFAOYSA-N 0.000 description 7
- 238000006722 reduction reaction Methods 0.000 description 7
- ZAMOUSCENKQFHK-UHFFFAOYSA-N Chlorine atom Chemical compound [Cl] ZAMOUSCENKQFHK-UHFFFAOYSA-N 0.000 description 6
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 6
- 238000010438 heat treatment Methods 0.000 description 6
- 238000004519 manufacturing process Methods 0.000 description 6
- 238000001816 cooling Methods 0.000 description 5
- 230000006870 function Effects 0.000 description 5
- 239000011261 inert gas Substances 0.000 description 5
- 239000002070 nanowire Substances 0.000 description 5
- 229910052710 silicon Inorganic materials 0.000 description 5
- 239000007790 solid phase Substances 0.000 description 5
- 238000001179 sorption measurement Methods 0.000 description 5
- 238000002513 implantation Methods 0.000 description 4
- 238000010884 ion-beam technique Methods 0.000 description 4
- 229910052751 metal Inorganic materials 0.000 description 4
- 239000002184 metal Substances 0.000 description 4
- 239000010703 silicon Substances 0.000 description 4
- 238000013459 approach Methods 0.000 description 3
- 239000012535 impurity Substances 0.000 description 3
- 150000002500 ions Chemical class 0.000 description 3
- 230000007246 mechanism Effects 0.000 description 3
- 238000003860 storage Methods 0.000 description 3
- 150000001875 compounds Chemical class 0.000 description 2
- 230000005669 field effect Effects 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000000149 penetrating effect Effects 0.000 description 2
- 230000001902 propagating effect Effects 0.000 description 2
- 230000001603 reducing effect Effects 0.000 description 2
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 1
- ZOXJGFHDIHLPTG-UHFFFAOYSA-N Boron Chemical compound [B] ZOXJGFHDIHLPTG-UHFFFAOYSA-N 0.000 description 1
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- 239000005046 Chlorosilane Substances 0.000 description 1
- MYMOFIZGZYHOMD-UHFFFAOYSA-N Dioxygen Chemical compound O=O MYMOFIZGZYHOMD-UHFFFAOYSA-N 0.000 description 1
- CGRVKSPUKAFTBN-UHFFFAOYSA-N N-silylbutan-1-amine Chemical compound CCCCN[SiH3] CGRVKSPUKAFTBN-UHFFFAOYSA-N 0.000 description 1
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 1
- BLRPTPMANUNPDV-UHFFFAOYSA-N Silane Chemical compound [SiH4] BLRPTPMANUNPDV-UHFFFAOYSA-N 0.000 description 1
- 230000003213 activating effect Effects 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 229910052785 arsenic Inorganic materials 0.000 description 1
- RQNWIZPPADIBDY-UHFFFAOYSA-N arsenic atom Chemical compound [As] RQNWIZPPADIBDY-UHFFFAOYSA-N 0.000 description 1
- 125000004429 atom Chemical group 0.000 description 1
- 229910052796 boron Inorganic materials 0.000 description 1
- OYACROKNLOSFPA-UHFFFAOYSA-N calcium;dioxido(oxo)silane Chemical compound [Ca+2].[O-][Si]([O-])=O OYACROKNLOSFPA-UHFFFAOYSA-N 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 238000005229 chemical vapour deposition Methods 0.000 description 1
- KOPOQZFJUQMUML-UHFFFAOYSA-N chlorosilane Chemical compound Cl[SiH3] KOPOQZFJUQMUML-UHFFFAOYSA-N 0.000 description 1
- SLLGVCUQYRMELA-UHFFFAOYSA-N chlorosilicon Chemical compound Cl[Si] SLLGVCUQYRMELA-UHFFFAOYSA-N 0.000 description 1
- 230000006837 decompression Effects 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 239000003989 dielectric material Substances 0.000 description 1
- UBHZUDXTHNMNLD-UHFFFAOYSA-N dimethylsilane Chemical compound C[SiH2]C UBHZUDXTHNMNLD-UHFFFAOYSA-N 0.000 description 1
- 229910001873 dinitrogen Inorganic materials 0.000 description 1
- 229910001882 dioxygen Inorganic materials 0.000 description 1
- PZPGRFITIJYNEJ-UHFFFAOYSA-N disilane Chemical compound [SiH3][SiH3] PZPGRFITIJYNEJ-UHFFFAOYSA-N 0.000 description 1
- 238000001704 evaporation Methods 0.000 description 1
- 230000008020 evaporation Effects 0.000 description 1
- 230000005284 excitation Effects 0.000 description 1
- 239000012528 membrane Substances 0.000 description 1
- UIUXUFNYAYAMOE-UHFFFAOYSA-N methylsilane Chemical compound [SiH3]C UIUXUFNYAYAMOE-UHFFFAOYSA-N 0.000 description 1
- 229910052698 phosphorus Inorganic materials 0.000 description 1
- 239000011574 phosphorus Substances 0.000 description 1
- 238000000206 photolithography Methods 0.000 description 1
- 239000010453 quartz Substances 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- 229910000077 silane Inorganic materials 0.000 description 1
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
- 239000012686 silicon precursor Substances 0.000 description 1
- 238000005507 spraying Methods 0.000 description 1
- 238000002230 thermal chemical vapour deposition Methods 0.000 description 1
- ZDHXKXAHOVTTAH-UHFFFAOYSA-N trichlorosilane Chemical compound Cl[SiH](Cl)Cl ZDHXKXAHOVTTAH-UHFFFAOYSA-N 0.000 description 1
- 239000005052 trichlorosilane Substances 0.000 description 1
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- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
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- C23C16/45525—Atomic layer deposition [ALD]
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- C23C16/45523—Pulsed gas flow or change of composition over time
- C23C16/45525—Atomic layer deposition [ALD]
- C23C16/45544—Atomic layer deposition [ALD] characterized by the apparatus
- C23C16/45548—Atomic layer deposition [ALD] characterized by the apparatus having arrangements for gas injection at different locations of the reactor for each ALD half-reaction
- C23C16/45551—Atomic layer deposition [ALD] characterized by the apparatus having arrangements for gas injection at different locations of the reactor for each ALD half-reaction for relative movement of the substrate and the gas injectors or half-reaction reactor compartments
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- H01L29/4232—Gate electrodes for field effect devices for field-effect transistors with insulated gate
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Description
成膜装置10では、まず、載置台14の回転により、被処理基体Wが第1の領域R1に送られる。工程S2の実施時には、第1の領域R1には、第1の前駆体ガスが供給されている。したがって、工程S2では、第1の前駆体ガスが被処理基体Wの表面に化学吸着する。一実施形態においては、第1の前駆体ガスとして、ジクロロシラン(DCS)が、流量30sccmで第1の領域に供給される。
次いで、載置台14の回転に伴い、被処理基体Wが噴射口20aの下方を通過する。工程S3では、このとき、噴射口20aから噴射される不活性ガスにより、被処理基体Wに過剰に吸着した第1の前駆体ガスが除去される。一実施形態においては、不活性ガスはArガスであり、その流量は540sccmである。
次いで、載置台14の回転に伴い、被処理基体Wは第2の領域R2に至る。工程S4の実施時には、第2の領域R2に、反応ガスが供給されており、また、プラズマ源としてマイクロ波が供給されている。一実施形態においては、反応ガスとして水素ガス、即ちH2ガスが60sccmの流量で第2の領域R2に供給されており、また、2.45GHzの周波数を有し3kWのパワーを有するマイクロ波が第2の領域に供給されている。これにより、第2の領域R2では水素ガスのプラズマが生成されている。第2の領域R2においては、プラズマ中の水素イオンによる還元反応により、被処理基体Wに吸着されている第1の前駆体ガスの層から塩素が引き出される。これにより、被処理基体Wにはシリコン原子の層が形成される。なお、第2の領域R2の圧力は、1Torr(133.3Pa)以上であることが好ましい。例えば、第2の領域R2の圧力は、1Torr(133.3Pa)〜50Torr(6666Pa)であることが好ましく、1Torr(133.3Pa)〜10Torr(1333Pa)であることがより好ましい。かかる高圧下では水素イオンが多量に発生するので、第1の前駆体ガスの層から塩素を引き抜く還元作用がより好適に発揮される。
本方法では、工程S2〜S4が1回以上繰り返された後、工程S5が実施される。工程S5では、載置台14の回転に伴い、被処理基体Wが第1の領域R1に至り、このとき、第1の領域R1には、第2の前駆体ガスが供給されており、当該第2の前駆体ガスが被処理基体Wの表面に化学吸着する。一実施形態では、第2の前駆体ガスは、AsClH2ガスであり、流量30sccmで第1の領域R1に供給される。
次いで、載置台14の回転に伴い、被処理基体Wが噴射口20aの下方を通過する。工程S6では、噴射口20aから噴射される不活性ガスにより、被処理基体Wに過剰に吸着した第2の前駆体ガスが除去される。一実施形態においては、不活性ガスはArガスであり、その流量は540sccmである。
次いで、載置台14の回転に伴い、被処理基体Wは第2の領域R2に至る。工程S7では、工程S4と同様に、被処理基体Wに対するプラズマ処理が行われる。一実施形態においては、反応ガスとして水素ガス、即ちH2ガスが60sccmの流量で第2の領域R2に供給されており、また、2.45GHzの周波数を有し3kWのパワーを有するマイクロ波が第2の領域に供給されている。これにより、第2の領域R2では水素ガスのプラズマが生成されている。第2の領域R2においては、プラズマ中の水素イオンによる還元反応により、被処理基体Wに吸着されている第2の前駆体ガスの層から塩素が引き出される。これにより、被処理基体Wにはドーパント材料の層が形成される。本実施形態では、Asの層が形成される。なお、工程S7における第2の領域R2の圧力も、工程S4と同様に、1Torr以上であることが好ましい。
Claims (20)
- その内部に被処理基体が配置された処理容器内に半導体材料及び塩素原子を含む第1の前駆体ガスを供給する工程であり、該第1の前駆体ガスを前記被処理基体に吸着させる、該工程と、
前記処理容器内にドーパント材料及び塩素原子を含む第2の前駆体ガスを供給する工程であり、該第2の前駆体ガスを前記被処理基体に吸着させる、該工程と、
前記処理容器内において水素ガスのプラズマを生成する工程であり、該プラズマ中の水素イオンによって前記被処理基体に吸着した層から塩素原子を除去するようプラズマ処理を行う、該工程と、
を含む成膜方法。 - 前記第1の前駆体ガスを供給する工程と前記第2の前駆体ガスを供給する工程が別個に行われる、請求項1に記載の成膜方法。
- 前記プラズマを生成する工程は、第1のプラズマ処理を行う工程と第2のプラズマ処理を行う工程を含み、
前記第1のプラズマ処理を行う工程では、前記第1の前駆体ガスを供給する工程により前記被処理基体に吸着した層に対して、前記水素ガスのプラズマによるプラズマ処理が行われ、
前記第2のプラズマ処理を行う工程では、前記第2の前駆体ガスを供給する工程により前記被処理基体に吸着した層に対して前記水素ガスのプラズマによるプラズマ処理が行われる、
請求項2に記載の成膜方法。 - 前記第1の前駆体ガス及び前記第2の前駆体ガスはそれぞれ、水素原子を更に含む、請求項3に記載の成膜方法。
- 前記第1の前駆体ガスを供給する工程と前記第2の前駆体ガスを供給する工程とを同時に実施することにより、前記被処理基体に前記第1の前駆体ガスと前記第2の前駆体ガスの混合ガスを吸着させる、請求項1に記載の成膜方法。
- 前記第1の前駆体ガス及び前記第2の前駆体ガスはそれぞれ、水素原子を更に含む、請求項5に記載の成膜方法。
- 前記プラズマ処理を行う工程では、マイクロ波によってプラズマが励起される、請求項1〜6の何れか一項に記載の成膜方法。
- 前記プラズマ処理を行う工程では、前記処理容器内の圧力が133.3Pa〜6666Paの範囲内の圧力に設定される、請求項7に記載の成膜方法。
- 前記第1の前駆体ガスを吸着させる工程、前記第2の前駆体ガスを吸着させる工程、及び、前記プラズマを生成する工程を含む一連の工程を一回以上繰り返した後に、前記被処理基体をアニールする工程を更に含む、請求項1〜8の何れか一項に記載の成膜方法。
- 前記被処理基体をアニールする工程は、0.1〜10秒間行われる請求項9に記載の成膜方法。
- 前記被処理基体をアニールする工程の前に、前記被処理基体の上に形成された膜の表面にキャップ層を形成する工程を更に含む、請求項9又は10に記載の成膜方法。
- その内部に被処理基体が配置される処理容器と、
半導体材料及び塩素原子を含む第1の前駆体ガス、並びに、ドーパント材料及び塩素原子を含む第2の前駆体ガスを前記被処理基体に吸着させるよう前記処理容器内に該第1の前駆体ガス及び該第2の前駆体ガスを供給する供給部と、
前記被処理基体に吸着した層から、プラズマ中の水素イオンによって塩素原子を除去するようにプラズマ処理を行うために、前記処理容器内において水素ガスのプラズマを生成するプラズマ生成部と、
を備える成膜装置。 - 前記供給部及び前記プラズマ生成部を制御する制御部を更に備える、請求項12に記載の成膜装置。
- 前記制御部は、
前記処理容器内に前記第1の前駆体ガスを供給するよう前記供給部を制御し、
前記第1の前駆体ガスの供給により前記被処理基体に吸着した層に対してプラズマ処理を行うために前記水素ガスのプラズマを生成するよう前記プラズマ生成部を制御し、
前記処理容器内に前記第2の前駆体ガスを供給するよう前記供給部を制御し、
前記第2の前駆体ガスの供給により前記被処理基体に吸着した層に対してプラズマ処理を行うために前記水素ガスのプラズマを生成するよう前記プラズマ生成部を制御する、
請求項13に記載の成膜装置。 - 前記供給部は、前記第1の前駆体ガスと前記第2の前駆体ガスの混合ガスを前記処理容器内に供給し、
前記制御部は、
前記処理容器内に前記混合ガスを供給するよう前記供給部を制御し、
前記混合ガスの供給により前記被処理基体に吸着した層に対してプラズマ処理を行うために前記水素ガスのプラズマを生成するよう前記プラズマ生成部を制御する、
請求項13又は14に記載の成膜装置。 - 前記第1の前駆体ガス及び前記第2の前駆体ガスはそれぞれ、水素原子を更に含む、請求項12〜15の何れか一項に記載の成膜装置。
- 前記プラズマ生成部は、マイクロ波により前記水素ガスのプラズマを励起する、請求項12〜16の何れか一項に記載の成膜装置。
- 前記成膜装置は、ALD成膜を利用したドーピングシステムの成膜装置である、請求項12〜17の何れか一項に記載の成膜装置。
- 請求項12〜18の何れか一項に記載の成膜装置と、
前記成膜装置によって処理された被処理基体を受け入れて、該被処理基体をアニールするアニール装置と、
を備える成膜システム。 - 前記成膜装置と真空搬送系を介して接続されており、前記成膜装置から被処理基体を受け入れて、該被処理基体の表面にキャップ層を形成する別の成膜装置を更に備え、
前記アニール装置は前記別の成膜装置から搬送された被処理基体をアニールするよう該別の成膜装置に接続されている、
請求項19に記載の成膜システム。
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