JP5925740B2 - トンネル電界効果トランジスタ - Google Patents
トンネル電界効果トランジスタ Download PDFInfo
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- JP5925740B2 JP5925740B2 JP2013190889A JP2013190889A JP5925740B2 JP 5925740 B2 JP5925740 B2 JP 5925740B2 JP 2013190889 A JP2013190889 A JP 2013190889A JP 2013190889 A JP2013190889 A JP 2013190889A JP 5925740 B2 JP5925740 B2 JP 5925740B2
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- 230000005669 field effect Effects 0.000 title claims description 7
- 239000004065 semiconductor Substances 0.000 claims description 74
- 239000012535 impurity Substances 0.000 claims description 44
- 239000010410 layer Substances 0.000 description 224
- 238000000034 method Methods 0.000 description 20
- 239000000758 substrate Substances 0.000 description 18
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 17
- 229910052710 silicon Inorganic materials 0.000 description 17
- 239000010703 silicon Substances 0.000 description 17
- 238000009792 diffusion process Methods 0.000 description 14
- 229910052751 metal Inorganic materials 0.000 description 13
- 239000002184 metal Substances 0.000 description 13
- 229920002120 photoresistant polymer Polymers 0.000 description 13
- 125000006850 spacer group Chemical group 0.000 description 12
- 238000004519 manufacturing process Methods 0.000 description 11
- 239000013078 crystal Substances 0.000 description 10
- 239000011229 interlayer Substances 0.000 description 8
- 239000000463 material Substances 0.000 description 8
- BOTDANWDWHJENH-UHFFFAOYSA-N Tetraethyl orthosilicate Chemical compound CCO[Si](OCC)(OCC)OCC BOTDANWDWHJENH-UHFFFAOYSA-N 0.000 description 7
- 230000000694 effects Effects 0.000 description 7
- 238000001020 plasma etching Methods 0.000 description 7
- 229910021332 silicide Inorganic materials 0.000 description 7
- FVBUAEGBCNSCDD-UHFFFAOYSA-N silicide(4-) Chemical compound [Si-4] FVBUAEGBCNSCDD-UHFFFAOYSA-N 0.000 description 7
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 6
- 229910000577 Silicon-germanium Inorganic materials 0.000 description 6
- 229910052785 arsenic Inorganic materials 0.000 description 6
- RQNWIZPPADIBDY-UHFFFAOYSA-N arsenic atom Chemical compound [As] RQNWIZPPADIBDY-UHFFFAOYSA-N 0.000 description 6
- 229910052698 phosphorus Inorganic materials 0.000 description 6
- 239000011574 phosphorus Substances 0.000 description 6
- 238000000137 annealing Methods 0.000 description 5
- 238000005229 chemical vapour deposition Methods 0.000 description 5
- 238000010586 diagram Methods 0.000 description 5
- 229910052814 silicon oxide Inorganic materials 0.000 description 5
- 238000001459 lithography Methods 0.000 description 4
- 238000004151 rapid thermal annealing Methods 0.000 description 4
- 230000005641 tunneling Effects 0.000 description 4
- 229910052581 Si3N4 Inorganic materials 0.000 description 3
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 3
- 230000004913 activation Effects 0.000 description 3
- 238000005468 ion implantation Methods 0.000 description 3
- 238000005240 physical vapour deposition Methods 0.000 description 3
- 229910021420 polycrystalline silicon Inorganic materials 0.000 description 3
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 3
- ZOXJGFHDIHLPTG-UHFFFAOYSA-N Boron Chemical compound [B] ZOXJGFHDIHLPTG-UHFFFAOYSA-N 0.000 description 2
- 229910052796 boron Inorganic materials 0.000 description 2
- 239000012212 insulator Substances 0.000 description 2
- 229920005591 polysilicon Polymers 0.000 description 2
- 238000001039 wet etching Methods 0.000 description 2
- 229910004143 HfON Inorganic materials 0.000 description 1
- 229910003070 TaOx Inorganic materials 0.000 description 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- 230000001133 acceleration Effects 0.000 description 1
- 230000004888 barrier function Effects 0.000 description 1
- 230000015556 catabolic process Effects 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 238000006731 degradation reaction Methods 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 239000003989 dielectric material Substances 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 239000002070 nanowire Substances 0.000 description 1
- 230000001590 oxidative effect Effects 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 230000007704 transition Effects 0.000 description 1
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- H—ELECTRICITY
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- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. PN junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/66977—Quantum effect devices, e.g. using quantum reflection, diffraction or interference effects, i.e. Bragg- or Aharonov-Bohm effects
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- H01L29/00—Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. PN junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/68—Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
- H01L29/76—Unipolar devices, e.g. field effect transistors
- H01L29/772—Field effect transistors
- H01L29/78—Field effect transistors with field effect produced by an insulated gate
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- H01L29/00—Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. PN junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/66007—Multistep manufacturing processes
- H01L29/66075—Multistep manufacturing processes of devices having semiconductor bodies comprising group 14 or group 13/15 materials
- H01L29/66227—Multistep manufacturing processes of devices having semiconductor bodies comprising group 14 or group 13/15 materials the devices being controllable only by the electric current supplied or the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched, e.g. three-terminal devices
- H01L29/66356—Gated diodes, e.g. field controlled diodes [FCD], static induction thyristors [SITh], field controlled thyristors [FCTh]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. PN junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/02—Semiconductor bodies ; Multistep manufacturing processes therefor
- H01L29/06—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions
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- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. PN junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/02—Semiconductor bodies ; Multistep manufacturing processes therefor
- H01L29/06—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions
- H01L29/08—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions with semiconductor regions connected to an electrode carrying current to be rectified, amplified or switched and such electrode being part of a semiconductor device which comprises three or more electrodes
- H01L29/0843—Source or drain regions of field-effect devices
- H01L29/0847—Source or drain regions of field-effect devices of field-effect transistors with insulated gate
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- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. PN junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/66007—Multistep manufacturing processes
- H01L29/66075—Multistep manufacturing processes of devices having semiconductor bodies comprising group 14 or group 13/15 materials
- H01L29/66227—Multistep manufacturing processes of devices having semiconductor bodies comprising group 14 or group 13/15 materials the devices being controllable only by the electric current supplied or the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched, e.g. three-terminal devices
- H01L29/66409—Unipolar field-effect transistors
- H01L29/66477—Unipolar field-effect transistors with an insulated gate, i.e. MISFET
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- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. PN junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/66007—Multistep manufacturing processes
- H01L29/66075—Multistep manufacturing processes of devices having semiconductor bodies comprising group 14 or group 13/15 materials
- H01L29/66227—Multistep manufacturing processes of devices having semiconductor bodies comprising group 14 or group 13/15 materials the devices being controllable only by the electric current supplied or the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched, e.g. three-terminal devices
- H01L29/66409—Unipolar field-effect transistors
- H01L29/66477—Unipolar field-effect transistors with an insulated gate, i.e. MISFET
- H01L29/66568—Lateral single gate silicon transistors
- H01L29/66659—Lateral single gate silicon transistors with asymmetry in the channel direction, e.g. lateral high-voltage MISFETs with drain offset region, extended drain MISFETs
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- H—ELECTRICITY
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- H01L29/00—Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. PN junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/68—Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
- H01L29/70—Bipolar devices
- H01L29/72—Transistor-type devices, i.e. able to continuously respond to applied control signals
- H01L29/739—Transistor-type devices, i.e. able to continuously respond to applied control signals controlled by field-effect, e.g. bipolar static induction transistors [BSIT]
- H01L29/7391—Gated diode structures
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- H01L29/00—Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. PN junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/68—Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
- H01L29/76—Unipolar devices, e.g. field effect transistors
- H01L29/772—Field effect transistors
- H01L29/78—Field effect transistors with field effect produced by an insulated gate
- H01L29/7833—Field effect transistors with field effect produced by an insulated gate with lightly doped drain or source extension, e.g. LDD MOSFET's; DDD MOSFET's
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. PN junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/02—Semiconductor bodies ; Multistep manufacturing processes therefor
- H01L29/12—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by the materials of which they are formed
- H01L29/16—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by the materials of which they are formed including, apart from doping materials or other impurities, only elements of Group IV of the Periodic System
- H01L29/161—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by the materials of which they are formed including, apart from doping materials or other impurities, only elements of Group IV of the Periodic System including two or more of the elements provided for in group H01L29/16, e.g. alloys
- H01L29/165—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by the materials of which they are formed including, apart from doping materials or other impurities, only elements of Group IV of the Periodic System including two or more of the elements provided for in group H01L29/16, e.g. alloys in different semiconductor regions, e.g. heterojunctions
Description
図1は、第1の実施形態によるTFET100の構成の一例を示す断面図である。TFET100は、マイクロプロセッサまたはASIC(Application Specific Integrated Circuit)等のロジック型半導体集積回路に用いられ得る。
図9は、第2の実施形態によるTFET200の構成の一例を示す断面図である。第2の実施形態によるTFET200は、ドレイン層50とソース層60との間に低濃度層80が設けられている。低濃度層80は、例えば、エピタキシャル成長されたシリコン結晶層を用いて形成されている。低濃度層80は、ソース層60、ドレイン層50およびチャネル部CHよりも不純物濃度の低い半導体層である。低濃度層80は、例えば、不純物ドーピングの無いシリコン層を成膜することで形成される。さらに、TFET200は、エクステンション層55を有さない。従って、ドレイン層50は、ゲート電極40の直下から離隔しており、ソース層60は、ゲート電極40の一端側の領域において低濃度層80と接合している。即ち、ドレイン層50は、チャネル部CHからオフセットしている。
図12は、第3の実施形態によるTFET300の構成の一例を示す断面図である。第3の実施形態によるTFET300は、バルク半導体基板12上に形成されている。第3の実施形態において、半導体層20は、バルク半導体基板12の表面に形成されている。バルク半導体基板12は、例えば、バルクシリコン基板またはバルクSiGe基板でよい。半導体層20は、バルクシリコン基板上に形成されたシリコン層またはSiGe層でもよく、バルクSiGe基板上に形成されたシリコン層またはSiGe層でもよい。第3の実施形態のその他の構成は、第1の実施形態の対応する構成と同様でよい。従って、第3の実施形態は、第1の実施形態と同様の効果を得ることができる。
Claims (4)
- 半導体層と、
前記半導体層表面上に設けられたゲート絶縁膜と、
前記半導体層上に前記ゲート絶縁膜を介して設けられたゲート電極と、
前記ゲート電極の一端側にある前記半導体層内に設けられた第1導電型のドレイン層と、
前記ゲート電極の他端側にある前記半導体層内に設けられた第2導電型のソース層と、
前記ゲート電極の下側の前記半導体層内に設けられ、不純物濃度が前記ソース層の不純物濃度と略均一または実質的に等しい第2導電型のチャネル部と、を備え、
前記ゲート電極および前記ドレイン層には同一符号の電圧が印加される、トンネル電界効果トランジスタ。 - 前記ソース層または前記チャネル部は、前記ゲート電極の下側で少なくとも該ゲート電極の前記一端側近傍まで延伸する、請求項1に記載のトンネル電界効果トランジスタ。
- 半導体層と、
前記半導体層表面上に設けられたゲート絶縁膜と、
前記ゲート絶縁膜上に設けられたゲート電極と、
前記ゲート電極の一端側にある前記半導体層内に設けられた第1導電型のドレイン層と、
前記ドレイン層から前記ゲート電極へ延伸するように前記半導体層の表面側に設けられた第1導電型のエクステンション層と、
前記ゲート電極の他端側にある前記半導体層内に設けられた第2導電型のソース層と、
前記ゲート電極の下側の前記半導体層内に設けられ、不純物濃度が前記ソース層の不純物濃度と略均一または実質的に等しい第2導電型のチャネル部と、を備え、
前記ソース層は、前記ゲート電極の前記他端側および前記下側に亘って設けられており、前記ゲート電極の前記一端側近傍で前記エクステンション層と接合している、トンネル電界効果トランジスタ。 - 半導体層と、
前記半導体層表面上に設けられたゲート絶縁膜と、
前記半導体層上に前記ゲート絶縁膜を介して設けられたゲート電極と、
前記ゲート電極の一端側にある前記半導体層内に設けられた第1導電型のドレイン層と、
前記ゲート電極の他端側にある前記半導体層内に設けられた第2導電型のソース層と、
前記ソース層と前記ドレイン層との間の前記半導体層に設けられ、前記ソース層および前記ドレイン層よりも不純物濃度の低い低濃度層と、
前記ゲート電極の下側の前記半導体層内に設けられ、不純物濃度が前記ソース層の不純物濃度と略均一または実質的に等しい第2導電型のチャネル部と、を備え、
前記ソース層は、前記ゲート電極の前記他端側および前記下側に亘って設けられており、前記ゲート電極の前記一端側近傍で前記低濃度層と接合している、トンネル電界効果トランジスタ。
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JP2013190889A JP5925740B2 (ja) | 2013-09-13 | 2013-09-13 | トンネル電界効果トランジスタ |
US14/145,141 US9048267B2 (en) | 2013-09-13 | 2013-12-31 | Semiconductor device |
CN201410082105.6A CN104465760A (zh) | 2013-09-13 | 2014-03-07 | 半导体器件 |
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US9412848B1 (en) * | 2015-02-06 | 2016-08-09 | Globalfoundries Inc. | Methods of forming a complex GAA FET device at advanced technology nodes |
JP2016213408A (ja) | 2015-05-13 | 2016-12-15 | 株式会社東芝 | トンネルfet |
US9876074B2 (en) * | 2015-05-22 | 2018-01-23 | International Business Machines Corporation | Structure and process to tuck fin tips self-aligned to gates |
CN104900504B (zh) * | 2015-05-25 | 2018-02-06 | 上海华虹宏力半导体制造有限公司 | 降低mos晶体管gidl电流的方法 |
EP3185300A1 (en) | 2015-12-21 | 2017-06-28 | IMEC vzw | Drain extension region for tunnel fet |
WO2018000133A1 (zh) * | 2016-06-27 | 2018-01-04 | 华为技术有限公司 | 一种隧穿场效应晶体管及其制作方法 |
CN111613534B (zh) * | 2019-02-26 | 2024-03-22 | 中芯国际集成电路制造(上海)有限公司 | 半导体结构及其形成方法 |
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JPH03169079A (ja) * | 1989-11-29 | 1991-07-22 | Nec Corp | 絶縁ゲート型電界効果トランジスター |
JPH04370977A (ja) * | 1991-06-20 | 1992-12-24 | Seiko Epson Corp | 量子化電界効果トランジスタ |
JPH05190847A (ja) * | 1992-01-08 | 1993-07-30 | Kawasaki Steel Corp | Mos型半導体装置 |
JP2006147805A (ja) * | 2004-11-18 | 2006-06-08 | Matsushita Electric Ind Co Ltd | 半導体装置 |
US8227841B2 (en) * | 2008-04-28 | 2012-07-24 | Taiwan Semiconductor Manufacturing Company, Ltd. | Self-aligned impact-ionization field effect transistor |
CN101777499B (zh) * | 2010-01-22 | 2011-08-24 | 北京大学 | 一种基于平面工艺自对准制备隧穿场效应晶体管的方法 |
JP5383732B2 (ja) | 2011-03-09 | 2014-01-08 | 株式会社東芝 | 半導体装置 |
JP2013069977A (ja) | 2011-09-26 | 2013-04-18 | Toshiba Corp | 半導体装置の製造方法 |
JP5715551B2 (ja) * | 2011-11-25 | 2015-05-07 | 株式会社東芝 | 半導体装置およびその製造方法 |
FR2992469B1 (fr) * | 2012-06-25 | 2014-08-08 | Commissariat Energie Atomique | Transistor a effet tunnel |
CN103280464B (zh) * | 2013-05-23 | 2016-02-24 | 清华大学 | 一种无结型纵向隧穿场效应晶体管 |
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2013
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- 2013-12-31 US US14/145,141 patent/US9048267B2/en active Active
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Cited By (2)
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KR20180078042A (ko) * | 2016-12-29 | 2018-07-09 | (재)한국나노기술원 | 터널 전계 효과 트랜지스터 제조방법 |
KR101955935B1 (ko) | 2016-12-29 | 2019-03-08 | (재)한국나노기술원 | 터널 전계 효과 트랜지스터 제조방법 |
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US20150076553A1 (en) | 2015-03-19 |
US9048267B2 (en) | 2015-06-02 |
JP2015056619A (ja) | 2015-03-23 |
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