JP5905292B2 - 圧電素子及び圧電素子の製造方法 - Google Patents

圧電素子及び圧電素子の製造方法 Download PDF

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Publication number
JP5905292B2
JP5905292B2 JP2012034937A JP2012034937A JP5905292B2 JP 5905292 B2 JP5905292 B2 JP 5905292B2 JP 2012034937 A JP2012034937 A JP 2012034937A JP 2012034937 A JP2012034937 A JP 2012034937A JP 5905292 B2 JP5905292 B2 JP 5905292B2
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Japan
Prior art keywords
ceramic substrate
piezoelectric element
groove
electrodes
electrode
Prior art date
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JP2012034937A
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English (en)
Japanese (ja)
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JP2013171981A5 (enExample
JP2013171981A (ja
Inventor
大西　孝生
孝生 大西
清水　秀樹
清水　　秀樹
政之 植谷
政之 植谷
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NGK Insulators Ltd
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NGK Insulators Ltd
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Filing date
Publication date
Application filed by NGK Insulators Ltd filed Critical NGK Insulators Ltd
Priority to JP2012034937A priority Critical patent/JP5905292B2/ja
Priority to US13/770,261 priority patent/US9142750B2/en
Priority to EP13155729.0A priority patent/EP2631959A3/en
Priority to CN201310054960.1A priority patent/CN103258951B/zh
Publication of JP2013171981A publication Critical patent/JP2013171981A/ja
Publication of JP2013171981A5 publication Critical patent/JP2013171981A5/ja
Application granted granted Critical
Publication of JP5905292B2 publication Critical patent/JP5905292B2/ja
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Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N30/00—Piezoelectric or electrostrictive devices
    • H10N30/80—Constructional details
    • H10N30/87—Electrodes or interconnections, e.g. leads or terminals
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N30/00—Piezoelectric or electrostrictive devices
    • H10N30/01—Manufacture or treatment
    • H10N30/06—Forming electrodes or interconnections, e.g. leads or terminals
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/42—Piezoelectric device making

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Piezo-Electric Or Mechanical Vibrators, Or Delay Or Filter Circuits (AREA)
  • General Electrical Machinery Utilizing Piezoelectricity, Electrostriction Or Magnetostriction (AREA)
JP2012034937A 2012-02-21 2012-02-21 圧電素子及び圧電素子の製造方法 Active JP5905292B2 (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2012034937A JP5905292B2 (ja) 2012-02-21 2012-02-21 圧電素子及び圧電素子の製造方法
US13/770,261 US9142750B2 (en) 2012-02-21 2013-02-19 Piezoelectric element with electrodes allowing substrate strain and method for manufacturing the same
EP13155729.0A EP2631959A3 (en) 2012-02-21 2013-02-19 Piezoelectric element and method for manufacturing the same
CN201310054960.1A CN103258951B (zh) 2012-02-21 2013-02-20 压电元件及压电元件的制造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2012034937A JP5905292B2 (ja) 2012-02-21 2012-02-21 圧電素子及び圧電素子の製造方法

Publications (3)

Publication Number Publication Date
JP2013171981A JP2013171981A (ja) 2013-09-02
JP2013171981A5 JP2013171981A5 (enExample) 2014-12-25
JP5905292B2 true JP5905292B2 (ja) 2016-04-20

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JP2012034937A Active JP5905292B2 (ja) 2012-02-21 2012-02-21 圧電素子及び圧電素子の製造方法

Country Status (4)

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US (1) US9142750B2 (enExample)
EP (1) EP2631959A3 (enExample)
JP (1) JP5905292B2 (enExample)
CN (1) CN103258951B (enExample)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9972767B2 (en) * 2013-02-07 2018-05-15 Danfoss A/S All compliant electrode
US10707404B2 (en) * 2016-07-07 2020-07-07 Tdk Corporation Piezoelectric element
US11296272B2 (en) * 2017-07-20 2022-04-05 Taiyo Yuden Co., Ltd. Multilayer piezoelectric element, piezoelectric vibration apparatus, and electronic device
FR3097668B1 (fr) 2019-06-24 2021-07-02 Commissariat Energie Atomique Dispositif a surface tactile
CN114008804A (zh) * 2019-06-28 2022-02-01 富士胶片株式会社 压电薄膜
JP6725049B1 (ja) * 2019-12-16 2020-07-15 Tdk株式会社 積層圧電素子
CN117044238A (zh) * 2021-03-30 2023-11-10 富士胶片株式会社 压电薄膜
US20230099440A1 (en) * 2021-09-28 2023-03-30 Skyworks Global Pte. Ltd. Piezoelectric mems device with thermal compensation from different material properties

Family Cites Families (23)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05335861A (ja) * 1992-05-29 1993-12-17 Tokin Corp 圧電振動子の製造方法
US5755909A (en) * 1996-06-26 1998-05-26 Spectra, Inc. Electroding of ceramic piezoelectric transducers
JPH11179905A (ja) * 1997-12-22 1999-07-06 Nec Corp インクジェットヘッドとその製造方法
US7548015B2 (en) * 2000-11-02 2009-06-16 Danfoss A/S Multilayer composite and a method of making such
DE60238599D1 (de) * 2001-03-12 2011-01-27 Ngk Insulators Ltd Betätigungsglied des typs mit piezoelektischem/elektrostriktivem film und verfahren zu seiner herstellung
JP4473529B2 (ja) * 2002-07-12 2010-06-02 日本碍子株式会社 圧電／電歪膜型素子、及びその製造方法
EP1570415B1 (en) * 2002-12-12 2009-08-19 Danfoss A/S Tactile sensor element and sensor array
JP4344554B2 (ja) * 2003-07-29 2009-10-14 京セラ株式会社 圧電アクチュエータの製造方法及び印刷ヘッドの製造方法
JP4359915B2 (ja) * 2003-08-21 2009-11-11 京セラ株式会社 圧電磁器振動体及び圧電共振装置
JP4480371B2 (ja) 2003-08-26 2010-06-16 京セラ株式会社 積層型圧電素子及び噴射装置
JP4593912B2 (ja) * 2003-12-24 2010-12-08 京セラ株式会社 積層型圧電素子およびその製法、並びに噴射装置
US8378554B2 (en) * 2005-10-28 2013-02-19 Kyocera Corporation Multi-layer piezoelectric element and injection apparatus using the same
JP5004484B2 (ja) * 2006-03-23 2012-08-22 日本碍子株式会社 誘電体デバイス
JP5032791B2 (ja) * 2006-05-15 2012-09-26 アルプス電気株式会社 電子部品の製造方法
WO2008053569A1 (en) * 2006-10-31 2008-05-08 Kyocera Corporation Multi-layer piezoelectric element and injection apparatus employing the same
EP2124268B1 (en) * 2006-11-29 2015-04-15 Kyocera Corporation Laminated piezoelectric element, jetting device provided with the laminated piezoelectric element and fuel jetting system
EP2800158B1 (en) * 2007-08-29 2016-01-06 Kyocera Corporation Multi-layer piezoelectric element, and ejection apparatus and fuel ejection system that employ the same
JP2011041136A (ja) * 2009-08-17 2011-02-24 Taiyo Yuden Co Ltd 弾性波デバイスおよびその製造方法
WO2011027879A1 (ja) * 2009-09-07 2011-03-10 日本碍子株式会社 圧電／電歪膜型素子の製造方法
JPWO2011089746A1 (ja) * 2010-01-20 2013-05-20 株式会社村田製作所 分波器
JP5714361B2 (ja) * 2011-03-01 2015-05-07 日本碍子株式会社 端子電極形成方法及びそれを用いた圧電／電歪素子の製造方法
US8891222B2 (en) * 2012-02-14 2014-11-18 Danfoss A/S Capacitive transducer and a method for manufacturing a transducer
WO2013171913A1 (ja) * 2012-05-12 2013-11-21 京セラ株式会社 圧電アクチュエータ、圧電振動装置および携帯端末

Also Published As

Publication number Publication date
US9142750B2 (en) 2015-09-22
CN103258951B (zh) 2017-04-12
JP2013171981A (ja) 2013-09-02
EP2631959A3 (en) 2014-09-17
US20130214647A1 (en) 2013-08-22
CN103258951A (zh) 2013-08-21
EP2631959A2 (en) 2013-08-28

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