JP5898705B2 - 静電クランプ、リソグラフィ装置、および、デバイス製造方法 - Google Patents

静電クランプ、リソグラフィ装置、および、デバイス製造方法 Download PDF

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Publication number
JP5898705B2
JP5898705B2 JP2013558344A JP2013558344A JP5898705B2 JP 5898705 B2 JP5898705 B2 JP 5898705B2 JP 2013558344 A JP2013558344 A JP 2013558344A JP 2013558344 A JP2013558344 A JP 2013558344A JP 5898705 B2 JP5898705 B2 JP 5898705B2
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JP
Japan
Prior art keywords
electrostatic clamp
substrate
multilayer film
core member
mask
Prior art date
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JP2013558344A
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English (en)
Japanese (ja)
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JP2014512675A5 (https=
JP2014512675A (ja
Inventor
ブリンクホフ，ユージン
ベックス，ヤン
シベン，アンコ
ダメン，ヨハネス
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
ASML Netherlands BV
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ASML Netherlands BV
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Publication of JP2014512675A5 publication Critical patent/JP2014512675A5/ja
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    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691—Handling of masks or workpieces
    • G03F7/707—Chucks, e.g. chucking or un-chucking operations or structural details
    • G03F7/70708—Chucks, e.g. chucking or un-chucking operations or structural details being electrostatic; Electrostatically deformable vacuum chucks
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691—Handling of masks or workpieces
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691—Handling of masks or workpieces
    • G03F7/707—Chucks, e.g. chucking or un-chucking operations or structural details
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/72—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using electrostatic chucks

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
JP2013558344A 2011-03-17 2012-02-07 静電クランプ、リソグラフィ装置、および、デバイス製造方法 Active JP5898705B2 (ja)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
US201161453719P 2011-03-17 2011-03-17
US61/453,719 2011-03-17
US201161490682P 2011-05-27 2011-05-27
US61/490,682 2011-05-27
PCT/EP2012/052044 WO2012123188A1 (en) 2011-03-17 2012-02-07 Electrostatic clamp, lithographic apparatus, and device manufacturing method

Publications (3)

Publication Number Publication Date
JP2014512675A JP2014512675A (ja) 2014-05-22
JP2014512675A5 JP2014512675A5 (https=) 2015-03-26
JP5898705B2 true JP5898705B2 (ja) 2016-04-06

Family

ID=45562345

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2013558344A Active JP5898705B2 (ja) 2011-03-17 2012-02-07 静電クランプ、リソグラフィ装置、および、デバイス製造方法

Country Status (7)

Country Link
US (1) US9360771B2 (https=)
EP (1) EP2686736B1 (https=)
JP (1) JP5898705B2 (https=)
KR (1) KR101872886B1 (https=)
CN (1) CN103415812B (https=)
TW (1) TWI560526B (https=)
WO (1) WO2012123188A1 (https=)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2016147539A1 (ja) * 2015-03-16 2016-09-22 セイコーエプソン株式会社 圧電素子の製造方法、圧電素子、圧電駆動装置、ロボット、およびポンプ
WO2019158380A1 (en) * 2018-02-13 2019-08-22 Asml Netherlands B.V. Apparatus for and method of in-situ particle removal in a lithography apparatus
US11673161B2 (en) * 2019-03-11 2023-06-13 Technetics Group Llc Methods of manufacturing electrostatic chucks
WO2022144144A1 (en) 2020-12-29 2022-07-07 Asml Holding N.V. Vacuum sheet bond fixturing and flexible burl applications for substrate tables

Family Cites Families (28)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4139833A (en) * 1976-11-22 1979-02-13 Gould Inc. Resistance temperature sensor
GB2106325A (en) * 1981-09-14 1983-04-07 Philips Electronic Associated Electrostatic chuck
US5221403A (en) 1990-07-20 1993-06-22 Tokyo Electron Limited Support table for plate-like body and processing apparatus using the table
JPH05166757A (ja) * 1991-12-13 1993-07-02 Tokyo Electron Ltd 被処理体の温調装置
KR100238629B1 (ko) 1992-12-17 2000-01-15 히가시 데쓰로 정전척을 가지는 재치대 및 이것을 이용한 플라즈마 처리장치
US5822171A (en) * 1994-02-22 1998-10-13 Applied Materials, Inc. Electrostatic chuck with improved erosion resistance
US5646814A (en) * 1994-07-15 1997-07-08 Applied Materials, Inc. Multi-electrode electrostatic chuck
US5671116A (en) 1995-03-10 1997-09-23 Lam Research Corporation Multilayered electrostatic chuck and method of manufacture thereof
US5835333A (en) 1995-10-30 1998-11-10 Lam Research Corporation Negative offset bipolar electrostatic chucks
US5986873A (en) * 1996-07-01 1999-11-16 Packard Hughes Interconnect Co. Creating surface topography on an electrostatic chuck with a mandrel
US5835334A (en) 1996-09-30 1998-11-10 Lam Research Variable high temperature chuck for high density plasma chemical vapor deposition
JP3936004B2 (ja) 1996-11-26 2007-06-27 財団法人神奈川科学技術アカデミー 静電浮上チャック
EP0947884B1 (en) 1998-03-31 2004-03-10 ASML Netherlands B.V. Lithographic projection apparatus with substrate holder
JP2000036449A (ja) * 1998-07-17 2000-02-02 Nikon Corp 露光装置
JP4640876B2 (ja) 2000-06-13 2011-03-02 株式会社アルバック 基板搬送装置
US6542224B2 (en) 2000-10-13 2003-04-01 Corning Incorporated Silica-based light-weight EUV lithography stages
EP1359469B1 (en) 2002-05-01 2011-03-02 ASML Netherlands B.V. Chuck, lithographic projection apparatus and device manufacturing method
US6994444B2 (en) * 2002-06-14 2006-02-07 Asml Holding N.V. Method and apparatus for managing actinic intensity transients in a lithography mirror
US7092231B2 (en) * 2002-08-23 2006-08-15 Asml Netherlands B.V. Chuck, lithographic apparatus and device manufacturing method
US7105836B2 (en) 2002-10-18 2006-09-12 Asml Holding N.V. Method and apparatus for cooling a reticle during lithographic exposure
JP2004247387A (ja) * 2003-02-12 2004-09-02 Sumitomo Electric Ind Ltd 半導体製造装置用ウェハ保持体およびそれを搭載した半導体製造装置
TWI431707B (zh) * 2005-07-08 2014-03-21 創意科技股份有限公司 Electrostatic cups and electrostatic chuck with the electrode sheet
US7626681B2 (en) * 2005-12-28 2009-12-01 Asml Netherlands B.V. Lithographic apparatus and method
US7940511B2 (en) 2007-09-21 2011-05-10 Asml Netherlands B.V. Electrostatic clamp, lithographic apparatus and method of manufacturing an electrostatic clamp
NL1036460A1 (nl) * 2008-02-20 2009-08-24 Asml Netherlands Bv Lithographic apparatus and device manufacturing method.
JP2010161319A (ja) * 2009-01-09 2010-07-22 Nikon Corp 静電吸着保持装置、露光装置及びデバイスの製造方法
EP2450948B1 (en) 2009-07-02 2018-11-07 Creative Technology Corporation Electrostatic attracting structure and fabricating method therefor
NL2008630A (en) * 2011-04-27 2012-10-30 Asml Netherlands Bv Substrate holder, lithographic apparatus, device manufacturing method, and method of manufacturing a substrate holder.

Also Published As

Publication number Publication date
US9360771B2 (en) 2016-06-07
EP2686736A1 (en) 2014-01-22
US20140218711A1 (en) 2014-08-07
EP2686736B1 (en) 2014-12-17
TW201239551A (en) 2012-10-01
KR101872886B1 (ko) 2018-06-29
WO2012123188A1 (en) 2012-09-20
CN103415812A (zh) 2013-11-27
KR20140030154A (ko) 2014-03-11
JP2014512675A (ja) 2014-05-22
CN103415812B (zh) 2015-10-21
TWI560526B (en) 2016-12-01

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