TWI560526B - Electrostatic clamp, lithographic apparatus, and device manufacturing method - Google Patents

Electrostatic clamp, lithographic apparatus, and device manufacturing method

Info

Publication number
TWI560526B
TWI560526B TW101105881A TW101105881A TWI560526B TW I560526 B TWI560526 B TW I560526B TW 101105881 A TW101105881 A TW 101105881A TW 101105881 A TW101105881 A TW 101105881A TW I560526 B TWI560526 B TW I560526B
Authority
TW
Taiwan
Prior art keywords
device manufacturing
lithographic apparatus
electrostatic clamp
electrostatic
clamp
Prior art date
Application number
TW101105881A
Other languages
English (en)
Other versions
TW201239551A (en
Inventor
Eugene Maria Brinkhof
Jan Bex
Anko Jozef Cornelus Sijben
Johannes Wilhelmus Damen
Original Assignee
Asml Netherlands Bv
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Asml Netherlands Bv filed Critical Asml Netherlands Bv
Publication of TW201239551A publication Critical patent/TW201239551A/zh
Application granted granted Critical
Publication of TWI560526B publication Critical patent/TWI560526B/zh

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691—Handling of masks or workpieces
    • G03F7/707—Chucks, e.g. chucking or un-chucking operations or structural details
    • G03F7/70708—Chucks, e.g. chucking or un-chucking operations or structural details being electrostatic; Electrostatically deformable vacuum chucks
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691—Handling of masks or workpieces
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6831—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using electrostatic chucks

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
TW101105881A 2011-03-17 2012-02-22 Electrostatic clamp, lithographic apparatus, and device manufacturing method TWI560526B (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US201161453719P 2011-03-17 2011-03-17
US201161490682P 2011-05-27 2011-05-27

Publications (2)

Publication Number Publication Date
TW201239551A TW201239551A (en) 2012-10-01
TWI560526B true TWI560526B (en) 2016-12-01

Family

ID=45562345

Family Applications (1)

Application Number Title Priority Date Filing Date
TW101105881A TWI560526B (en) 2011-03-17 2012-02-22 Electrostatic clamp, lithographic apparatus, and device manufacturing method

Country Status (7)

Country Link
US (1) US9360771B2 (zh)
EP (1) EP2686736B1 (zh)
JP (1) JP5898705B2 (zh)
KR (1) KR101872886B1 (zh)
CN (1) CN103415812B (zh)
TW (1) TWI560526B (zh)
WO (1) WO2012123188A1 (zh)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2016147539A1 (ja) * 2015-03-16 2016-09-22 セイコーエプソン株式会社 圧電素子の製造方法、圧電素子、圧電駆動装置、ロボット、およびポンプ
KR20200119816A (ko) * 2018-02-13 2020-10-20 에이에스엠엘 네델란즈 비.브이. 리소그래피 장치에서의 인시튜 입자 제거를 위한 장치 및 방법
US11673161B2 (en) * 2019-03-11 2023-06-13 Technetics Group Llc Methods of manufacturing electrostatic chucks

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4139833A (en) * 1976-11-22 1979-02-13 Gould Inc. Resistance temperature sensor
JP2000036449A (ja) * 1998-07-17 2000-02-02 Nikon Corp 露光装置
EP1372009A1 (en) * 2002-06-14 2003-12-17 ASML Holding, N.V. Method and apparatus for compensating transients heat loads in a lithography mirror
EP1909308A1 (en) * 2005-07-08 2008-04-09 Creative Technology Corporation Electrostatic chuck and electrode sheet for electrostatic chuck
US20090207392A1 (en) * 2008-02-20 2009-08-20 Asml Netherlands B.V Lithographic apparatus and device manufacturing method
WO2011001978A1 (ja) * 2009-07-02 2011-01-06 株式会社クリエイティブ テクノロジー 静電吸着構造体及びその製造方法

Family Cites Families (22)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2106325A (en) * 1981-09-14 1983-04-07 Philips Electronic Associated Electrostatic chuck
US5221403A (en) 1990-07-20 1993-06-22 Tokyo Electron Limited Support table for plate-like body and processing apparatus using the table
JPH05166757A (ja) * 1991-12-13 1993-07-02 Tokyo Electron Ltd 被処理体の温調装置
KR100238629B1 (ko) * 1992-12-17 2000-01-15 히가시 데쓰로 정전척을 가지는 재치대 및 이것을 이용한 플라즈마 처리장치
US5822171A (en) * 1994-02-22 1998-10-13 Applied Materials, Inc. Electrostatic chuck with improved erosion resistance
US5646814A (en) * 1994-07-15 1997-07-08 Applied Materials, Inc. Multi-electrode electrostatic chuck
US5671116A (en) 1995-03-10 1997-09-23 Lam Research Corporation Multilayered electrostatic chuck and method of manufacture thereof
US5835333A (en) 1995-10-30 1998-11-10 Lam Research Corporation Negative offset bipolar electrostatic chucks
US5986873A (en) * 1996-07-01 1999-11-16 Packard Hughes Interconnect Co. Creating surface topography on an electrostatic chuck with a mandrel
US5835334A (en) 1996-09-30 1998-11-10 Lam Research Variable high temperature chuck for high density plasma chemical vapor deposition
JP3936004B2 (ja) 1996-11-26 2007-06-27 財団法人神奈川科学技術アカデミー 静電浮上チャック
EP0947884B1 (en) 1998-03-31 2004-03-10 ASML Netherlands B.V. Lithographic projection apparatus with substrate holder
JP4640876B2 (ja) 2000-06-13 2011-03-02 株式会社アルバック 基板搬送装置
US6542224B2 (en) 2000-10-13 2003-04-01 Corning Incorporated Silica-based light-weight EUV lithography stages
EP1359469B1 (en) 2002-05-01 2011-03-02 ASML Netherlands B.V. Chuck, lithographic projection apparatus and device manufacturing method
US7092231B2 (en) * 2002-08-23 2006-08-15 Asml Netherlands B.V. Chuck, lithographic apparatus and device manufacturing method
US7105836B2 (en) * 2002-10-18 2006-09-12 Asml Holding N.V. Method and apparatus for cooling a reticle during lithographic exposure
JP2004247387A (ja) * 2003-02-12 2004-09-02 Sumitomo Electric Ind Ltd 半導体製造装置用ウェハ保持体およびそれを搭載した半導体製造装置
US7626681B2 (en) * 2005-12-28 2009-12-01 Asml Netherlands B.V. Lithographic apparatus and method
US7940511B2 (en) * 2007-09-21 2011-05-10 Asml Netherlands B.V. Electrostatic clamp, lithographic apparatus and method of manufacturing an electrostatic clamp
JP2010161319A (ja) * 2009-01-09 2010-07-22 Nikon Corp 静電吸着保持装置、露光装置及びデバイスの製造方法
NL2008630A (en) * 2011-04-27 2012-10-30 Asml Netherlands Bv Substrate holder, lithographic apparatus, device manufacturing method, and method of manufacturing a substrate holder.

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4139833A (en) * 1976-11-22 1979-02-13 Gould Inc. Resistance temperature sensor
JP2000036449A (ja) * 1998-07-17 2000-02-02 Nikon Corp 露光装置
EP1372009A1 (en) * 2002-06-14 2003-12-17 ASML Holding, N.V. Method and apparatus for compensating transients heat loads in a lithography mirror
EP1909308A1 (en) * 2005-07-08 2008-04-09 Creative Technology Corporation Electrostatic chuck and electrode sheet for electrostatic chuck
US20090207392A1 (en) * 2008-02-20 2009-08-20 Asml Netherlands B.V Lithographic apparatus and device manufacturing method
WO2011001978A1 (ja) * 2009-07-02 2011-01-06 株式会社クリエイティブ テクノロジー 静電吸着構造体及びその製造方法

Also Published As

Publication number Publication date
EP2686736A1 (en) 2014-01-22
US9360771B2 (en) 2016-06-07
KR20140030154A (ko) 2014-03-11
WO2012123188A1 (en) 2012-09-20
JP2014512675A (ja) 2014-05-22
CN103415812A (zh) 2013-11-27
EP2686736B1 (en) 2014-12-17
KR101872886B1 (ko) 2018-06-29
CN103415812B (zh) 2015-10-21
TW201239551A (en) 2012-10-01
JP5898705B2 (ja) 2016-04-06
US20140218711A1 (en) 2014-08-07

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