JP5887968B2 - Scカット水晶基板、振動素子、電子デバイス、発振器、及び電子機器 - Google Patents
Scカット水晶基板、振動素子、電子デバイス、発振器、及び電子機器 Download PDFInfo
- Publication number
- JP5887968B2 JP5887968B2 JP2012021638A JP2012021638A JP5887968B2 JP 5887968 B2 JP5887968 B2 JP 5887968B2 JP 2012021638 A JP2012021638 A JP 2012021638A JP 2012021638 A JP2012021638 A JP 2012021638A JP 5887968 B2 JP5887968 B2 JP 5887968B2
- Authority
- JP
- Japan
- Prior art keywords
- vibration
- axis
- mode
- substrate
- quartz substrate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 239000000758 substrate Substances 0.000 title claims description 118
- 239000010453 quartz Substances 0.000 title claims description 53
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 title claims description 53
- 239000013078 crystal Substances 0.000 claims description 34
- 230000005284 excitation Effects 0.000 claims description 15
- 238000000605 extraction Methods 0.000 claims description 9
- 230000010355 oscillation Effects 0.000 claims description 6
- 229910052727 yttrium Inorganic materials 0.000 claims description 6
- 239000004065 semiconductor Substances 0.000 claims description 4
- 239000003990 capacitor Substances 0.000 claims description 2
- 238000006073 displacement reaction Methods 0.000 description 101
- 238000009826 distribution Methods 0.000 description 61
- 230000002093 peripheral effect Effects 0.000 description 22
- 230000000694 effects Effects 0.000 description 11
- 238000004088 simulation Methods 0.000 description 8
- 239000004020 conductor Substances 0.000 description 7
- 239000000853 adhesive Substances 0.000 description 6
- 230000001070 adhesive effect Effects 0.000 description 6
- 239000011261 inert gas Substances 0.000 description 4
- 229910052751 metal Inorganic materials 0.000 description 4
- 239000002184 metal Substances 0.000 description 4
- 230000035882 stress Effects 0.000 description 4
- 238000007789 sealing Methods 0.000 description 3
- 239000011651 chromium Substances 0.000 description 2
- 239000010931 gold Substances 0.000 description 2
- 230000008018 melting Effects 0.000 description 2
- 238000002844 melting Methods 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 230000003287 optical effect Effects 0.000 description 2
- 229910000679 solder Inorganic materials 0.000 description 2
- 230000008646 thermal stress Effects 0.000 description 2
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 description 1
- 101000615238 Homo sapiens Proto-oncogene DBL Proteins 0.000 description 1
- 102100021384 Proto-oncogene DBL Human genes 0.000 description 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- 101100221226 Zea mays COAC2 gene Proteins 0.000 description 1
- 230000002159 abnormal effect Effects 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 229910052804 chromium Inorganic materials 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 239000010408 film Substances 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000001465 metallisation Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 238000000206 photolithography Methods 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 239000002356 single layer Substances 0.000 description 1
- 238000004544 sputter deposition Methods 0.000 description 1
- 238000012916 structural analysis Methods 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
- 238000001771 vacuum deposition Methods 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
Images
Landscapes
- Oscillators With Electromechanical Resonators (AREA)
- Piezo-Electric Or Mechanical Vibrators, Or Delay Or Filter Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2012021638A JP5887968B2 (ja) | 2012-02-03 | 2012-02-03 | Scカット水晶基板、振動素子、電子デバイス、発振器、及び電子機器 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2012021638A JP5887968B2 (ja) | 2012-02-03 | 2012-02-03 | Scカット水晶基板、振動素子、電子デバイス、発振器、及び電子機器 |
Related Child Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2016021518A Division JP5943160B2 (ja) | 2016-02-08 | 2016-02-08 | Scカット水晶基板、振動素子、電子デバイス、発振器、及び電子機器 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2013162266A JP2013162266A (ja) | 2013-08-19 |
| JP2013162266A5 JP2013162266A5 (https=) | 2015-03-12 |
| JP5887968B2 true JP5887968B2 (ja) | 2016-03-16 |
Family
ID=49174198
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2012021638A Expired - Fee Related JP5887968B2 (ja) | 2012-02-03 | 2012-02-03 | Scカット水晶基板、振動素子、電子デバイス、発振器、及び電子機器 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP5887968B2 (https=) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP6561447B2 (ja) | 2014-10-02 | 2019-08-21 | セイコーエプソン株式会社 | 振動子、発振器、電子機器、および移動体 |
| JP2017139682A (ja) * | 2016-02-05 | 2017-08-10 | セイコーエプソン株式会社 | 振動片、振動片の製造方法、発振器、電子機器、移動体、および基地局 |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH04123605A (ja) * | 1990-09-14 | 1992-04-23 | Nippon Dempa Kogyo Co Ltd | 水晶振動子 |
| JP3194442B2 (ja) * | 1992-05-30 | 2001-07-30 | 日本電波工業株式会社 | Scカットの水晶振動子 |
| JP4516021B2 (ja) * | 2003-07-18 | 2010-08-04 | 日本電波工業株式会社 | Scカット水晶振動子 |
| JP5046012B2 (ja) * | 2007-09-04 | 2012-10-10 | セイコーエプソン株式会社 | 振動片、振動デバイス、発振器及び電子機器 |
| JP4563437B2 (ja) * | 2007-10-18 | 2010-10-13 | 日本電波工業株式会社 | 2回回転yカット板からなる水晶振動子 |
-
2012
- 2012-02-03 JP JP2012021638A patent/JP5887968B2/ja not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| JP2013162266A (ja) | 2013-08-19 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN102684638B (zh) | 压电振动元件、压电振子、压电振荡器以及电子设备 | |
| JP5796355B2 (ja) | 圧電振動素子、圧電振動子、電子デバイス、及び電子機器 | |
| JP5625432B2 (ja) | 圧電振動素子、及び圧電振動子 | |
| JP6268629B2 (ja) | 水晶振動素子、及びこの水晶振動素子を備える水晶振動子 | |
| JP5982898B2 (ja) | 振動素子、振動子、電子デバイス、発振器、及び電子機器 | |
| JP5824967B2 (ja) | 振動素子、振動子、電子デバイス、及び電子機器 | |
| CN203747763U (zh) | 振动元件、振子、电子器件以及电子设备 | |
| TW201251157A (en) | Piezoelectric vibration element, manufacturing method for piezoelectric vibration element, piezoelectric vibrator, electronic device, and electronic apparatus | |
| JP5772082B2 (ja) | 圧電振動素子、圧電振動子、圧電発振器及び電子デバイス | |
| JP7800758B2 (ja) | 水晶振動素子及びその製造方法 | |
| JP2007300287A (ja) | 弾性表面波素子および弾性表面波デバイス並びに電子機器 | |
| JP5910092B2 (ja) | 圧電振動素子、圧電振動子、電子デバイス、及び電子機器 | |
| JP5668392B2 (ja) | 圧電振動素子、圧電振動子及び圧電発振器 | |
| JP2013042440A (ja) | 圧電振動素子、圧電振動子、電子デバイス、及び電子機器 | |
| JP5943160B2 (ja) | Scカット水晶基板、振動素子、電子デバイス、発振器、及び電子機器 | |
| JP5824958B2 (ja) | 振動素子、振動子、電子デバイス、及び電子機器 | |
| JP5887968B2 (ja) | Scカット水晶基板、振動素子、電子デバイス、発振器、及び電子機器 | |
| JP2013162265A (ja) | 振動素子、振動子、電子デバイス、発振器、及び電子機器 | |
| JP6137274B2 (ja) | 振動素子、振動子、電子デバイス、及び電子機器 | |
| JP5987321B2 (ja) | 圧電振動片、圧電振動片の製造方法、圧電デバイス及び電子機器 | |
| JP7677849B2 (ja) | 圧電振動片、圧電振動子および発振器 | |
| TW202418758A (zh) | 晶體振動片及使用其的晶體元件 | |
| WO2017169864A1 (ja) | 圧電振動子 | |
| JP2012186638A (ja) | 圧電振動片、圧電振動子、電子デバイス |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| RD04 | Notification of resignation of power of attorney |
Free format text: JAPANESE INTERMEDIATE CODE: A7424 Effective date: 20150107 |
|
| A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20150123 |
|
| A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20150123 |
|
| A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20151027 |
|
| A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20151215 |
|
| TRDD | Decision of grant or rejection written | ||
| A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 Effective date: 20160119 |
|
| A61 | First payment of annual fees (during grant procedure) |
Free format text: JAPANESE INTERMEDIATE CODE: A61 Effective date: 20160201 |
|
| R150 | Certificate of patent or registration of utility model |
Ref document number: 5887968 Country of ref document: JP Free format text: JAPANESE INTERMEDIATE CODE: R150 |
|
| S531 | Written request for registration of change of domicile |
Free format text: JAPANESE INTERMEDIATE CODE: R313531 |
|
| R350 | Written notification of registration of transfer |
Free format text: JAPANESE INTERMEDIATE CODE: R350 |
|
| LAPS | Cancellation because of no payment of annual fees |