JP5878242B2 - 焼結体、同焼結体からなる磁気記録膜形成用スパッタリングターゲット - Google Patents

焼結体、同焼結体からなる磁気記録膜形成用スパッタリングターゲット Download PDF

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Publication number
JP5878242B2
JP5878242B2 JP2014541456A JP2014541456A JP5878242B2 JP 5878242 B2 JP5878242 B2 JP 5878242B2 JP 2014541456 A JP2014541456 A JP 2014541456A JP 2014541456 A JP2014541456 A JP 2014541456A JP 5878242 B2 JP5878242 B2 JP 5878242B2
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Prior art keywords
sintered body
oxide
mol
boron
body according
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JP2014541456A
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English (en)
Japanese (ja)
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JPWO2014178310A1 (ja
Inventor
英生 高見
英生 高見
中村 祐一郎
祐一郎 中村
祐希 池田
祐希 池田
真一 荻野
真一 荻野
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JX Nippon Mining and Metals Corp
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JX Nippon Mining and Metals Corp
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Publication of JPWO2014178310A1 publication Critical patent/JPWO2014178310A1/ja
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Classifications

    • CCHEMISTRY; METALLURGY
    • C22METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22CALLOYS
    • C22C32/00Non-ferrous alloys containing at least 5% by weight but less than 50% by weight of oxides, carbides, borides, nitrides, silicides or other metal compounds, e.g. oxynitrides, sulfides, whether added as such or formed in situ
    • C22C32/001Non-ferrous alloys containing at least 5% by weight but less than 50% by weight of oxides, carbides, borides, nitrides, silicides or other metal compounds, e.g. oxynitrides, sulfides, whether added as such or formed in situ with only oxides
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/34Sputtering
    • C23C14/3407Cathode assembly for sputtering apparatus, e.g. Target
    • C23C14/3414Metallurgical or chemical aspects of target preparation, e.g. casting, powder metallurgy
    • CCHEMISTRY; METALLURGY
    • C22METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22CALLOYS
    • C22C19/00Alloys based on nickel or cobalt
    • C22C19/07Alloys based on nickel or cobalt based on cobalt
    • CCHEMISTRY; METALLURGY
    • C22METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22CALLOYS
    • C22C5/00Alloys based on noble metals
    • C22C5/04Alloys based on a platinum group metal

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Physical Vapour Deposition (AREA)
  • Manufacturing Of Magnetic Record Carriers (AREA)
  • Powder Metallurgy (AREA)
  • Hard Magnetic Materials (AREA)
  • Thin Magnetic Films (AREA)
  • Compositions Of Oxide Ceramics (AREA)
  • Magnetic Record Carriers (AREA)
JP2014541456A 2013-04-30 2014-04-23 焼結体、同焼結体からなる磁気記録膜形成用スパッタリングターゲット Active JP5878242B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2014541456A JP5878242B2 (ja) 2013-04-30 2014-04-23 焼結体、同焼結体からなる磁気記録膜形成用スパッタリングターゲット

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP2013095486 2013-04-30
JP2013095486 2013-04-30
PCT/JP2014/061357 WO2014178310A1 (ja) 2013-04-30 2014-04-23 焼結体、同焼結体からなる磁気記録膜形成用スパッタリングターゲット
JP2014541456A JP5878242B2 (ja) 2013-04-30 2014-04-23 焼結体、同焼結体からなる磁気記録膜形成用スパッタリングターゲット

Publications (2)

Publication Number Publication Date
JP5878242B2 true JP5878242B2 (ja) 2016-03-08
JPWO2014178310A1 JPWO2014178310A1 (ja) 2017-02-23

Family

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Family Applications (1)

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JP2014541456A Active JP5878242B2 (ja) 2013-04-30 2014-04-23 焼結体、同焼結体からなる磁気記録膜形成用スパッタリングターゲット

Country Status (6)

Country Link
JP (1) JP5878242B2 (zh)
CN (1) CN105026589B (zh)
MY (1) MY170253A (zh)
SG (1) SG11201506155PA (zh)
TW (1) TWI615479B (zh)
WO (1) WO2014178310A1 (zh)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2020202604A1 (ja) * 2019-03-29 2020-10-08 Jx金属株式会社 スパッタリングターゲット及びスパッタリングターゲットの製造方法

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN108026631B (zh) * 2015-02-19 2020-02-28 捷客斯金属株式会社 磁性体薄膜形成用溅射靶
JP2016160530A (ja) * 2015-03-05 2016-09-05 光洋應用材料科技股▲分▼有限公司 磁気合金スパッタリングターゲット及び磁気記録媒体用記録層
JP6504605B2 (ja) * 2015-11-27 2019-04-24 田中貴金属工業株式会社 スパッタリングターゲット
CN112739846A (zh) * 2018-09-25 2021-04-30 Jx金属株式会社 溅射靶以及用于制造溅射靶的粉体
JP6885981B2 (ja) * 2019-03-29 2021-06-16 Jx金属株式会社 スパッタリングターゲットの梱包物の作製方法及び輸送方法

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH11158607A (ja) * 1997-11-28 1999-06-15 Sumitomo Metal Mining Co Ltd ZnO系焼結体およびその製法
JP2006351164A (ja) * 2005-06-15 2006-12-28 Heraeus Inc スパッタターゲット、磁気記録媒体及び磁気記録媒体の製造方法
JP2012117147A (ja) * 2010-11-12 2012-06-21 Jx Nippon Mining & Metals Corp コバルト酸化物が残留したスパッタリングターゲット

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4469506A (en) * 1983-01-24 1984-09-04 Mitsui Toatsu Chemicals, Incorporated Production process of ferromagnetic iron powder
JP4846872B2 (ja) * 2009-03-03 2011-12-28 Jx日鉱日石金属株式会社 スパッタリングターゲット及びその製造方法
MY149640A (en) * 2009-12-11 2013-09-13 Jx Nippon Mining & Metals Corp Sputtering target comprising oxide phase dispersed in co or co alloy phase, magnetic thin film made of co or co alloy phase and oxide phase, and magnetic recording medium using the said thin film
MY149437A (en) * 2010-01-21 2013-08-30 Jx Nippon Mining & Metals Corp Ferromagnetic material sputtering target
WO2012011294A1 (ja) * 2010-07-20 2012-01-26 Jx日鉱日石金属株式会社 パーティクル発生の少ない強磁性材スパッタリングターゲット
US8590717B2 (en) * 2011-05-16 2013-11-26 Miner Enterprises, Inc. Railroad freight car draft gear

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH11158607A (ja) * 1997-11-28 1999-06-15 Sumitomo Metal Mining Co Ltd ZnO系焼結体およびその製法
JP2006351164A (ja) * 2005-06-15 2006-12-28 Heraeus Inc スパッタターゲット、磁気記録媒体及び磁気記録媒体の製造方法
JP2012117147A (ja) * 2010-11-12 2012-06-21 Jx Nippon Mining & Metals Corp コバルト酸化物が残留したスパッタリングターゲット

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2020202604A1 (ja) * 2019-03-29 2020-10-08 Jx金属株式会社 スパッタリングターゲット及びスパッタリングターゲットの製造方法
JP7176102B2 (ja) 2019-03-29 2022-11-21 Jx金属株式会社 スパッタリングターゲット及びスパッタリングターゲットの製造方法

Also Published As

Publication number Publication date
TWI615479B (zh) 2018-02-21
WO2014178310A1 (ja) 2014-11-06
MY170253A (en) 2019-07-13
TW201510232A (zh) 2015-03-16
CN105026589B (zh) 2017-07-18
JPWO2014178310A1 (ja) 2017-02-23
SG11201506155PA (en) 2015-09-29
CN105026589A (zh) 2015-11-04

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