JP5878242B2 - 焼結体、同焼結体からなる磁気記録膜形成用スパッタリングターゲット - Google Patents

焼結体、同焼結体からなる磁気記録膜形成用スパッタリングターゲット Download PDF

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Publication number
JP5878242B2
JP5878242B2 JP2014541456A JP2014541456A JP5878242B2 JP 5878242 B2 JP5878242 B2 JP 5878242B2 JP 2014541456 A JP2014541456 A JP 2014541456A JP 2014541456 A JP2014541456 A JP 2014541456A JP 5878242 B2 JP5878242 B2 JP 5878242B2
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Prior art keywords
sintered body
oxide
mol
boron
body according
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JP2014541456A
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English (en)
Japanese (ja)
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JPWO2014178310A1 (ja
Inventor
英生 高見
英生 高見
中村 祐一郎
祐一郎 中村
祐希 池田
祐希 池田
真一 荻野
真一 荻野
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
JX Nippon Mining and Metals Corp
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JX Nippon Mining and Metals Corp
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Publication of JPWO2014178310A1 publication Critical patent/JPWO2014178310A1/ja
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Classifications

    • CCHEMISTRY; METALLURGY
    • C22METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22CALLOYS
    • C22C32/00Non-ferrous alloys containing at least 5% by weight but less than 50% by weight of oxides, carbides, borides, nitrides, silicides or other metal compounds, e.g. oxynitrides, sulfides, whether added as such or formed in situ
    • C22C32/001Non-ferrous alloys containing at least 5% by weight but less than 50% by weight of oxides, carbides, borides, nitrides, silicides or other metal compounds, e.g. oxynitrides, sulfides, whether added as such or formed in situ with only oxides
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/34Sputtering
    • C23C14/3407Cathode assembly for sputtering apparatus, e.g. Target
    • C23C14/3414Metallurgical or chemical aspects of target preparation, e.g. casting, powder metallurgy
    • CCHEMISTRY; METALLURGY
    • C22METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22CALLOYS
    • C22C19/00Alloys based on nickel or cobalt
    • C22C19/07Alloys based on nickel or cobalt based on cobalt
    • CCHEMISTRY; METALLURGY
    • C22METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22CALLOYS
    • C22C5/00Alloys based on noble metals
    • C22C5/04Alloys based on a platinum group metal

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Physical Vapour Deposition (AREA)
  • Manufacturing Of Magnetic Record Carriers (AREA)
  • Powder Metallurgy (AREA)
  • Magnetic Record Carriers (AREA)
  • Hard Magnetic Materials (AREA)
  • Thin Magnetic Films (AREA)
  • Compositions Of Oxide Ceramics (AREA)
JP2014541456A 2013-04-30 2014-04-23 焼結体、同焼結体からなる磁気記録膜形成用スパッタリングターゲット Active JP5878242B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2014541456A JP5878242B2 (ja) 2013-04-30 2014-04-23 焼結体、同焼結体からなる磁気記録膜形成用スパッタリングターゲット

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP2013095486 2013-04-30
JP2013095486 2013-04-30
JP2014541456A JP5878242B2 (ja) 2013-04-30 2014-04-23 焼結体、同焼結体からなる磁気記録膜形成用スパッタリングターゲット
PCT/JP2014/061357 WO2014178310A1 (ja) 2013-04-30 2014-04-23 焼結体、同焼結体からなる磁気記録膜形成用スパッタリングターゲット

Publications (2)

Publication Number Publication Date
JP5878242B2 true JP5878242B2 (ja) 2016-03-08
JPWO2014178310A1 JPWO2014178310A1 (ja) 2017-02-23

Family

ID=51843443

Family Applications (1)

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JP2014541456A Active JP5878242B2 (ja) 2013-04-30 2014-04-23 焼結体、同焼結体からなる磁気記録膜形成用スパッタリングターゲット

Country Status (6)

Country Link
JP (1) JP5878242B2 (zh)
CN (1) CN105026589B (zh)
MY (1) MY170253A (zh)
SG (1) SG11201506155PA (zh)
TW (1) TWI615479B (zh)
WO (1) WO2014178310A1 (zh)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2020202604A1 (ja) * 2019-03-29 2020-10-08 Jx金属株式会社 スパッタリングターゲット及びスパッタリングターゲットの製造方法

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN108026631B (zh) * 2015-02-19 2020-02-28 捷客斯金属株式会社 磁性体薄膜形成用溅射靶
JP2016160530A (ja) * 2015-03-05 2016-09-05 光洋應用材料科技股▲分▼有限公司 磁気合金スパッタリングターゲット及び磁気記録媒体用記録層
JP6504605B2 (ja) * 2015-11-27 2019-04-24 田中貴金属工業株式会社 スパッタリングターゲット
JP7072664B2 (ja) * 2018-09-25 2022-05-20 Jx金属株式会社 スパッタリングターゲット及びスパッタリングターゲットの製造方法
JP6885981B2 (ja) * 2019-03-29 2021-06-16 Jx金属株式会社 スパッタリングターゲットの梱包物の作製方法及び輸送方法

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH11158607A (ja) * 1997-11-28 1999-06-15 Sumitomo Metal Mining Co Ltd ZnO系焼結体およびその製法
JP2006351164A (ja) * 2005-06-15 2006-12-28 Heraeus Inc スパッタターゲット、磁気記録媒体及び磁気記録媒体の製造方法
JP2012117147A (ja) * 2010-11-12 2012-06-21 Jx Nippon Mining & Metals Corp コバルト酸化物が残留したスパッタリングターゲット

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4469506A (en) * 1983-01-24 1984-09-04 Mitsui Toatsu Chemicals, Incorporated Production process of ferromagnetic iron powder
WO2010101051A1 (ja) * 2009-03-03 2010-09-10 日鉱金属株式会社 スパッタリングターゲット及びその製造方法
MY149640A (en) * 2009-12-11 2013-09-13 Jx Nippon Mining & Metals Corp Sputtering target comprising oxide phase dispersed in co or co alloy phase, magnetic thin film made of co or co alloy phase and oxide phase, and magnetic recording medium using the said thin film
SG175953A1 (en) * 2010-01-21 2011-12-29 Jx Nippon Mining & Metals Corp Ferromagnetic-material sputtering target
US9181617B2 (en) * 2010-07-20 2015-11-10 Jx Nippon Mining & Metals Corporation Sputtering target of ferromagnetic material with low generation of particles
US8590717B2 (en) * 2011-05-16 2013-11-26 Miner Enterprises, Inc. Railroad freight car draft gear

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH11158607A (ja) * 1997-11-28 1999-06-15 Sumitomo Metal Mining Co Ltd ZnO系焼結体およびその製法
JP2006351164A (ja) * 2005-06-15 2006-12-28 Heraeus Inc スパッタターゲット、磁気記録媒体及び磁気記録媒体の製造方法
JP2012117147A (ja) * 2010-11-12 2012-06-21 Jx Nippon Mining & Metals Corp コバルト酸化物が残留したスパッタリングターゲット

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2020202604A1 (ja) * 2019-03-29 2020-10-08 Jx金属株式会社 スパッタリングターゲット及びスパッタリングターゲットの製造方法
JP7176102B2 (ja) 2019-03-29 2022-11-21 Jx金属株式会社 スパッタリングターゲット及びスパッタリングターゲットの製造方法
US12106949B2 (en) 2019-03-29 2024-10-01 Jx Advanced Metals Corporation Sputtering target and method for manufacturing sputtering target

Also Published As

Publication number Publication date
TWI615479B (zh) 2018-02-21
CN105026589B (zh) 2017-07-18
CN105026589A (zh) 2015-11-04
MY170253A (en) 2019-07-13
TW201510232A (zh) 2015-03-16
SG11201506155PA (en) 2015-09-29
WO2014178310A1 (ja) 2014-11-06
JPWO2014178310A1 (ja) 2017-02-23

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