SG11201506155PA - Sintered body, and sputtering target for forming magnetic recording film produced from said sintered body - Google Patents

Sintered body, and sputtering target for forming magnetic recording film produced from said sintered body

Info

Publication number
SG11201506155PA
SG11201506155PA SG11201506155PA SG11201506155PA SG11201506155PA SG 11201506155P A SG11201506155P A SG 11201506155PA SG 11201506155P A SG11201506155P A SG 11201506155PA SG 11201506155P A SG11201506155P A SG 11201506155PA SG 11201506155P A SG11201506155P A SG 11201506155PA
Authority
SG
Singapore
Prior art keywords
sintered body
magnetic recording
sputtering target
recording film
film produced
Prior art date
Application number
SG11201506155PA
Other languages
English (en)
Inventor
Hideo Takami
Yuichiro Nakamura
Yuki Ikeda
Shin-Ichi Ogino
Original Assignee
Jx Nippon Mining & Metals Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Jx Nippon Mining & Metals Corp filed Critical Jx Nippon Mining & Metals Corp
Publication of SG11201506155PA publication Critical patent/SG11201506155PA/en

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C32/00—Non-ferrous alloys containing at least 5% by weight but less than 50% by weight of oxides, carbides, borides, nitrides, silicides or other metal compounds, e.g. oxynitrides, sulfides, whether added as such or formed in situ
    • C22C32/001—Non-ferrous alloys containing at least 5% by weight but less than 50% by weight of oxides, carbides, borides, nitrides, silicides or other metal compounds, e.g. oxynitrides, sulfides, whether added as such or formed in situ with only oxides
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/34—Sputtering
    • C23C14/3407—Cathode assembly for sputtering apparatus, e.g. Target
    • C23C14/3414—Metallurgical or chemical aspects of target preparation, e.g. casting, powder metallurgy
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C19/00—Alloys based on nickel or cobalt
    • C22C19/07—Alloys based on nickel or cobalt based on cobalt
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C5/00—Alloys based on noble metals
    • C22C5/04—Alloys based on a platinum group metal

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Physical Vapour Deposition (AREA)
  • Manufacturing Of Magnetic Record Carriers (AREA)
  • Powder Metallurgy (AREA)
  • Hard Magnetic Materials (AREA)
  • Thin Magnetic Films (AREA)
  • Compositions Of Oxide Ceramics (AREA)
  • Magnetic Record Carriers (AREA)
SG11201506155PA 2013-04-30 2014-04-23 Sintered body, and sputtering target for forming magnetic recording film produced from said sintered body SG11201506155PA (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2013095486 2013-04-30
PCT/JP2014/061357 WO2014178310A1 (ja) 2013-04-30 2014-04-23 焼結体、同焼結体からなる磁気記録膜形成用スパッタリングターゲット

Publications (1)

Publication Number Publication Date
SG11201506155PA true SG11201506155PA (en) 2015-09-29

Family

ID=51843443

Family Applications (1)

Application Number Title Priority Date Filing Date
SG11201506155PA SG11201506155PA (en) 2013-04-30 2014-04-23 Sintered body, and sputtering target for forming magnetic recording film produced from said sintered body

Country Status (6)

Country Link
JP (1) JP5878242B2 (zh)
CN (1) CN105026589B (zh)
MY (1) MY170253A (zh)
SG (1) SG11201506155PA (zh)
TW (1) TWI615479B (zh)
WO (1) WO2014178310A1 (zh)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN108026631B (zh) * 2015-02-19 2020-02-28 捷客斯金属株式会社 磁性体薄膜形成用溅射靶
JP2016160530A (ja) * 2015-03-05 2016-09-05 光洋應用材料科技股▲分▼有限公司 磁気合金スパッタリングターゲット及び磁気記録媒体用記録層
JP6504605B2 (ja) * 2015-11-27 2019-04-24 田中貴金属工業株式会社 スパッタリングターゲット
CN112739846A (zh) * 2018-09-25 2021-04-30 Ｊｘ金属株式会社 溅射靶以及用于制造溅射靶的粉体
SG11202110634VA (en) 2019-03-29 2021-10-28 Jx Nippon Mining & Metals Corp Sputtering target and method for manufacturing sputtering target
JP6885981B2 (ja) * 2019-03-29 2021-06-16 Ｊｘ金属株式会社 スパッタリングターゲットの梱包物の作製方法及び輸送方法

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4469506A (en) * 1983-01-24 1984-09-04 Mitsui Toatsu Chemicals, Incorporated Production process of ferromagnetic iron powder
JPH11158607A (ja) * 1997-11-28 1999-06-15 Sumitomo Metal Mining Co Ltd ＺｎＯ系焼結体およびその製法
US20060286414A1 (en) * 2005-06-15 2006-12-21 Heraeus, Inc. Enhanced oxide-containing sputter target alloy compositions
JP4846872B2 (ja) * 2009-03-03 2011-12-28 Ｊｘ日鉱日石金属株式会社 スパッタリングターゲット及びその製造方法
MY149640A (en) * 2009-12-11 2013-09-13 Jx Nippon Mining & Metals Corp Sputtering target comprising oxide phase dispersed in co or co alloy phase, magnetic thin film made of co or co alloy phase and oxide phase, and magnetic recording medium using the said thin film
MY149437A (en) * 2010-01-21 2013-08-30 Jx Nippon Mining & Metals Corp Ferromagnetic material sputtering target
WO2012011294A1 (ja) * 2010-07-20 2012-01-26 Jx日鉱日石金属株式会社 パーティクル発生の少ない強磁性材スパッタリングターゲット
JP2012117147A (ja) * 2010-11-12 2012-06-21 Jx Nippon Mining & Metals Corp コバルト酸化物が残留したスパッタリングターゲット
US8590717B2 (en) * 2011-05-16 2013-11-26 Miner Enterprises, Inc. Railroad freight car draft gear

Also Published As

Publication number Publication date
TWI615479B (zh) 2018-02-21
WO2014178310A1 (ja) 2014-11-06
MY170253A (en) 2019-07-13
TW201510232A (zh) 2015-03-16
CN105026589B (zh) 2017-07-18
JPWO2014178310A1 (ja) 2017-02-23
CN105026589A (zh) 2015-11-04
JP5878242B2 (ja) 2016-03-08

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