JP5873251B2 - 基板トレイ及び該トレイを用いた基板処理装置 - Google Patents

基板トレイ及び該トレイを用いた基板処理装置 Download PDF

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Publication number
JP5873251B2
JP5873251B2 JP2011101645A JP2011101645A JP5873251B2 JP 5873251 B2 JP5873251 B2 JP 5873251B2 JP 2011101645 A JP2011101645 A JP 2011101645A JP 2011101645 A JP2011101645 A JP 2011101645A JP 5873251 B2 JP5873251 B2 JP 5873251B2
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JP
Japan
Prior art keywords
substrate
tray
mounting plate
holder
magnet
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2011101645A
Other languages
English (en)
Japanese (ja)
Other versions
JP2012234930A5 (pl
JP2012234930A (ja
Inventor
哲郎 戸田
哲郎 戸田
信二 高城
信二 高城
知子 大坂
知子 大坂
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Canon Anelva Corp
Original Assignee
Canon Anelva Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Canon Anelva Corp filed Critical Canon Anelva Corp
Priority to JP2011101645A priority Critical patent/JP5873251B2/ja
Priority to KR1020120041377A priority patent/KR101366441B1/ko
Priority to TW101114162A priority patent/TWI503921B/zh
Priority to CN201210128524.XA priority patent/CN102760679B/zh
Publication of JP2012234930A publication Critical patent/JP2012234930A/ja
Publication of JP2012234930A5 publication Critical patent/JP2012234930A5/ja
Application granted granted Critical
Publication of JP5873251B2 publication Critical patent/JP5873251B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H01L21/67333—Trays for chips
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H01L21/6735—Closed carriers
    • H01L21/67356—Closed carriers specially adapted for containing chips, dies or ICs
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H01L21/6735—Closed carriers
    • H01L21/67379—Closed carriers characterised by coupling elements, kinematic members, handles or elements to be externally gripped
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68764—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a movable susceptor, stage or support, others than those only rotating on their own vertical axis, e.g. susceptors on a rotating caroussel

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Physical Vapour Deposition (AREA)
JP2011101645A 2011-04-28 2011-04-28 基板トレイ及び該トレイを用いた基板処理装置 Active JP5873251B2 (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2011101645A JP5873251B2 (ja) 2011-04-28 2011-04-28 基板トレイ及び該トレイを用いた基板処理装置
KR1020120041377A KR101366441B1 (ko) 2011-04-28 2012-04-20 기판 트레이 및 상기 트레이를 이용한 기판 처리 장치
TW101114162A TWI503921B (zh) 2011-04-28 2012-04-20 A substrate tray and a substrate processing device using the tray
CN201210128524.XA CN102760679B (zh) 2011-04-28 2012-04-27 基板托架以及使用了该托架的基板处理装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2011101645A JP5873251B2 (ja) 2011-04-28 2011-04-28 基板トレイ及び該トレイを用いた基板処理装置

Publications (3)

Publication Number Publication Date
JP2012234930A JP2012234930A (ja) 2012-11-29
JP2012234930A5 JP2012234930A5 (pl) 2014-04-24
JP5873251B2 true JP5873251B2 (ja) 2016-03-01

Family

ID=47055081

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2011101645A Active JP5873251B2 (ja) 2011-04-28 2011-04-28 基板トレイ及び該トレイを用いた基板処理装置

Country Status (4)

Country Link
JP (1) JP5873251B2 (pl)
KR (1) KR101366441B1 (pl)
CN (1) CN102760679B (pl)
TW (1) TWI503921B (pl)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP2971224B1 (en) * 2013-03-15 2018-01-31 Applied Materials, Inc. Carrier for substrates
GB201402126D0 (en) * 2014-02-07 2014-03-26 Spts Technologies Ltd Method of processing a substrate
US11756816B2 (en) 2019-07-26 2023-09-12 Applied Materials, Inc. Carrier FOUP and a method of placing a carrier
US11196360B2 (en) 2019-07-26 2021-12-07 Applied Materials, Inc. System and method for electrostatically chucking a substrate to a carrier
US10916464B1 (en) 2019-07-26 2021-02-09 Applied Materials, Inc. Method of pre aligning carrier, wafer and carrier-wafer combination for throughput efficiency
CN114054419B (zh) * 2021-11-17 2023-04-11 新美光(苏州)半导体科技有限公司 硅电极的清洗装置、清洗方法
US20230265554A1 (en) * 2022-02-18 2023-08-24 Applied Materials, Inc. Substrate carrier to control temperature of substrate

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02229421A (ja) * 1989-03-02 1990-09-12 Sumitomo Electric Ind Ltd 露光装置
JP4428799B2 (ja) * 2000-04-03 2010-03-10 キヤノン株式会社 磁気支持機構、位置決め装置および半導体デバイス製造方法
JP4121763B2 (ja) * 2002-04-08 2008-07-23 Ｔｄｋ株式会社 薄膜形成装置に対する基板の交換ユニットおよび基板交換方法
KR100523824B1 (ko) * 2002-07-11 2005-10-25 에이에스엠엘 네델란즈 비.브이. 기판홀더 및 디바이스 제조방법
JP2005120410A (ja) * 2003-10-15 2005-05-12 Renesas Technology Corp 半導体装置の製造方法
JP4386753B2 (ja) * 2004-02-19 2009-12-16 キヤノンアネルバ株式会社 ウェハーステージ及びプラズマ処理装置
KR100582036B1 (ko) * 2004-04-12 2006-05-22 주식회사 테라세미콘 반도체 제조공법 및 반도체 제조장치의 기판홀더
JP4576200B2 (ja) * 2004-10-21 2010-11-04 キヤノンアネルバ株式会社 基板処理装置及び基板処理装置におけるアーキング発生監視方法
JP2007281050A (ja) * 2006-04-04 2007-10-25 Miraial Kk 半導体ウエハのウエハトレイ
JP4699272B2 (ja) * 2006-04-27 2011-06-08 株式会社フジクラ 基板ホルダー
JP4990636B2 (ja) * 2007-01-11 2012-08-01 株式会社アルバック 搬送トレーを用いた真空処理装置
JP4997141B2 (ja) * 2008-02-21 2012-08-08 株式会社アルバック 真空処理装置、基板の温度制御方法
US20100151680A1 (en) * 2008-12-17 2010-06-17 Optisolar Inc. Substrate carrier with enhanced temperature uniformity
JP2010177267A (ja) * 2009-01-27 2010-08-12 Ulvac Japan Ltd 搬送トレー及びこの搬送トレーを用いた真空処理装置
JP2011023425A (ja) * 2009-07-13 2011-02-03 Canon Inc ステージ装置、露光装置及びデバイス製造方法

Also Published As

Publication number Publication date
TWI503921B (zh) 2015-10-11
CN102760679A (zh) 2012-10-31
JP2012234930A (ja) 2012-11-29
KR101366441B1 (ko) 2014-02-21
TW201306164A (zh) 2013-02-01
KR20120122905A (ko) 2012-11-07
CN102760679B (zh) 2015-07-15

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