JP5868215B2 - インプリント装置およびインプリント方法、それを用いた物品の製造方法 - Google Patents

インプリント装置およびインプリント方法、それを用いた物品の製造方法 Download PDF

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Publication number
JP5868215B2
JP5868215B2 JP2012039813A JP2012039813A JP5868215B2 JP 5868215 B2 JP5868215 B2 JP 5868215B2 JP 2012039813 A JP2012039813 A JP 2012039813A JP 2012039813 A JP2012039813 A JP 2012039813A JP 5868215 B2 JP5868215 B2 JP 5868215B2
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JP
Japan
Prior art keywords
shot
gas
substrate
supply port
mold
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP2012039813A
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English (en)
Japanese (ja)
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JP2013175631A5 (enExample
JP2013175631A (ja
Inventor
一樹 中川
一樹 中川
江本　圭司
圭司 江本
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Canon Inc
Original Assignee
Canon Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Canon Inc filed Critical Canon Inc
Priority to JP2012039813A priority Critical patent/JP5868215B2/ja
Priority to CN201380010484.1A priority patent/CN104137224B/zh
Priority to PCT/JP2013/001092 priority patent/WO2013128888A1/en
Priority to KR1020147023122A priority patent/KR101698253B1/ko
Priority to US14/376,334 priority patent/US10105892B2/en
Publication of JP2013175631A publication Critical patent/JP2013175631A/ja
Publication of JP2013175631A5 publication Critical patent/JP2013175631A5/ja
Application granted granted Critical
Publication of JP5868215B2 publication Critical patent/JP5868215B2/ja
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
    • H01L21/0271—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers
    • H01L21/0273—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers characterised by the treatment of photoresist layers
    • H01L21/0274—Photolithographic processes
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C39/00—Shaping by casting, i.e. introducing the moulding material into a mould or between confining surfaces without significant moulding pressure; Apparatus therefor
    • B29C39/02—Shaping by casting, i.e. introducing the moulding material into a mould or between confining surfaces without significant moulding pressure; Apparatus therefor for making articles of definite length, i.e. discrete articles
    • B29C39/12—Making multilayered or multicoloured articles
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C59/00—Surface shaping of articles, e.g. embossing; Apparatus therefor
    • B29C59/02—Surface shaping of articles, e.g. embossing; Apparatus therefor by mechanical means, e.g. pressing
    • B29C59/026—Surface shaping of articles, e.g. embossing; Apparatus therefor by mechanical means, e.g. pressing of layered or coated substantially flat surfaces
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B82—NANOTECHNOLOGY
    • B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
    • B82Y10/00—Nanotechnology for information processing, storage or transmission, e.g. quantum computing or single electron logic
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B82—NANOTECHNOLOGY
    • B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
    • B82Y40/00—Manufacture or treatment of nanostructures
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/0002—Lithographic processes using patterning methods other than those involving the exposure to radiation, e.g. by stamping
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29K—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS OR TO MATERIALS FOR MOULDS, REINFORCEMENTS, FILLERS OR PREFORMED PARTS, e.g. INSERTS
    • B29K2101/00—Use of unspecified macromolecular compounds as moulding material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29L—INDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULAR ARTICLES
    • B29L2009/00—Layered products

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  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Nanotechnology (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Theoretical Computer Science (AREA)
  • Mathematical Physics (AREA)
  • Mechanical Engineering (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Shaping Of Tube Ends By Bending Or Straightening (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
JP2012039813A 2012-02-27 2012-02-27 インプリント装置およびインプリント方法、それを用いた物品の製造方法 Expired - Fee Related JP5868215B2 (ja)

Priority Applications (5)

Application Number Priority Date Filing Date Title
JP2012039813A JP5868215B2 (ja) 2012-02-27 2012-02-27 インプリント装置およびインプリント方法、それを用いた物品の製造方法
CN201380010484.1A CN104137224B (zh) 2012-02-27 2013-02-26 压印装置和压印方法以及物品制造方法
PCT/JP2013/001092 WO2013128888A1 (en) 2012-02-27 2013-02-26 Imprint apparatus and imprint method, and article manufacturing method
KR1020147023122A KR101698253B1 (ko) 2012-02-27 2013-02-26 임프린트 장치 및 임프린트 방법 그리고 물품 제조 방법
US14/376,334 US10105892B2 (en) 2012-02-27 2013-02-26 Imprint apparatus and imprint method, and article manufacturing method

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2012039813A JP5868215B2 (ja) 2012-02-27 2012-02-27 インプリント装置およびインプリント方法、それを用いた物品の製造方法

Publications (3)

Publication Number Publication Date
JP2013175631A JP2013175631A (ja) 2013-09-05
JP2013175631A5 JP2013175631A5 (enExample) 2015-04-09
JP5868215B2 true JP5868215B2 (ja) 2016-02-24

Family

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Family Applications (1)

Application Number Title Priority Date Filing Date
JP2012039813A Expired - Fee Related JP5868215B2 (ja) 2012-02-27 2012-02-27 インプリント装置およびインプリント方法、それを用いた物品の製造方法

Country Status (5)

Country Link
US (1) US10105892B2 (enExample)
JP (1) JP5868215B2 (enExample)
KR (1) KR101698253B1 (enExample)
CN (1) CN104137224B (enExample)
WO (1) WO2013128888A1 (enExample)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US12072622B2 (en) * 2022-03-11 2024-08-27 Kioxia Corporation Imprint method, method of manufacturing semiconductor device, and imprint device
US12228855B2 (en) 2020-12-11 2025-02-18 Canon Kabushiki Kaisha Imprint apparatus, imprint method, article manufacturing method, and storage medium

Families Citing this family (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6294679B2 (ja) * 2014-01-21 2018-03-14 キヤノン株式会社 インプリント装置及び物品の製造方法
JP6525567B2 (ja) * 2014-12-02 2019-06-05 キヤノン株式会社 インプリント装置及び物品の製造方法
US10571801B2 (en) * 2014-12-09 2020-02-25 Canon Kabushiki Kaisha Coating apparatus, imprint apparatus, and method of manufacturing article
US20180180999A1 (en) * 2015-06-29 2018-06-28 Nissan Chemical Industries, Ltd. Imprint material
US10204780B2 (en) * 2015-09-08 2019-02-12 Canon Kabushiki Kaisha Imprint apparatus, and article manufacturing method
JP6702753B2 (ja) 2016-02-17 2020-06-03 キヤノン株式会社 リソグラフィ装置、及び物品の製造方法
JP6313795B2 (ja) * 2016-03-03 2018-04-18 キヤノン株式会社 シャッタユニット、リソグラフィ装置、インプリント装置、及び物品の製造方法
JP6700949B2 (ja) * 2016-04-28 2020-05-27 キヤノン株式会社 インプリント方法及び物品の製造方法
JP6735656B2 (ja) * 2016-11-18 2020-08-05 キヤノン株式会社 インプリント装置、インプリント方法及び物品の製造方法
KR102369538B1 (ko) * 2017-09-28 2022-03-03 캐논 가부시끼가이샤 성형 장치 및 물품 제조 방법
JP7064310B2 (ja) * 2017-10-24 2022-05-10 キヤノン株式会社 インプリント装置、および物品製造方法
CN109828437A (zh) * 2017-11-23 2019-05-31 志圣工业股份有限公司 防黏板结构
JP7210155B2 (ja) * 2018-04-16 2023-01-23 キヤノン株式会社 装置、方法、および物品製造方法
JP7134790B2 (ja) * 2018-08-28 2022-09-12 キオクシア株式会社 インプリント装置、インプリント方法、および半導体装置の製造方法
JP7149872B2 (ja) * 2019-02-14 2022-10-07 キヤノン株式会社 インプリント方法、インプリント装置、および物品の製造方法
JP7407579B2 (ja) * 2019-12-04 2024-01-04 キヤノン株式会社 インプリント装置、インプリント方法、および物品の製造方法
US12353127B2 (en) * 2021-04-14 2025-07-08 Canon Kabushiki Kaisha Imprint apparatus, imprint method and article manufacturing method
JP7669199B2 (ja) 2021-06-07 2025-04-28 キヤノン株式会社 インプリント装置、インプリント方法、コンピュータプログラム、及び物品の製造方法
JP7676281B2 (ja) * 2021-09-27 2025-05-14 キヤノン株式会社 インプリント装置、インプリント方法、及び物品の製造方法

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8211214B2 (en) 2003-10-02 2012-07-03 Molecular Imprints, Inc. Single phase fluid imprint lithography method
US8144309B2 (en) * 2007-09-05 2012-03-27 Asml Netherlands B.V. Imprint lithography
WO2009153925A1 (ja) * 2008-06-17 2009-12-23 株式会社ニコン ナノインプリント方法及び装置
JP4892025B2 (ja) * 2008-09-26 2012-03-07 株式会社東芝 インプリント方法
US20110140304A1 (en) * 2009-12-10 2011-06-16 Molecular Imprints, Inc. Imprint lithography template
JP5451450B2 (ja) 2010-02-24 2014-03-26 キヤノン株式会社 インプリント装置及びそのテンプレート並びに物品の製造方法
JP5618588B2 (ja) 2010-03-24 2014-11-05 キヤノン株式会社 インプリント方法
JP2011230430A (ja) * 2010-04-28 2011-11-17 Toshiba Corp テンプレート補修方法、パターン形成方法及びテンプレート補修装置
JP5597031B2 (ja) * 2010-05-31 2014-10-01 キヤノン株式会社 リソグラフィ装置及び物品の製造方法
JP5744422B2 (ja) 2010-06-17 2015-07-08 キヤノン株式会社 インプリント方法及びインプリント装置、サンプルショット抽出方法、並びにそれを用いた物品の製造方法
JP2012039057A (ja) * 2010-07-13 2012-02-23 Canon Inc インプリント装置及び物品の製造方法

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US12228855B2 (en) 2020-12-11 2025-02-18 Canon Kabushiki Kaisha Imprint apparatus, imprint method, article manufacturing method, and storage medium
US12072622B2 (en) * 2022-03-11 2024-08-27 Kioxia Corporation Imprint method, method of manufacturing semiconductor device, and imprint device

Also Published As

Publication number Publication date
WO2013128888A1 (en) 2013-09-06
US20150042012A1 (en) 2015-02-12
KR20140116209A (ko) 2014-10-01
JP2013175631A (ja) 2013-09-05
CN104137224B (zh) 2016-08-17
US10105892B2 (en) 2018-10-23
CN104137224A (zh) 2014-11-05
KR101698253B1 (ko) 2017-01-19

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