KR101698253B1 - 임프린트 장치 및 임프린트 방법 그리고 물품 제조 방법 - Google Patents

임프린트 장치 및 임프린트 방법 그리고 물품 제조 방법 Download PDF

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Publication number
KR101698253B1
KR101698253B1 KR1020147023122A KR20147023122A KR101698253B1 KR 101698253 B1 KR101698253 B1 KR 101698253B1 KR 1020147023122 A KR1020147023122 A KR 1020147023122A KR 20147023122 A KR20147023122 A KR 20147023122A KR 101698253 B1 KR101698253 B1 KR 101698253B1
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KR
South Korea
Prior art keywords
substrate
mold
gas
supply outlet
shot area
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Expired - Fee Related
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KR1020147023122A
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English (en)
Korean (ko)
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KR20140116209A (ko
Inventor
가즈키 나카가와
게이지 에모토
Original Assignee
캐논 가부시끼가이샤
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Publication of KR20140116209A publication Critical patent/KR20140116209A/ko
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Publication of KR101698253B1 publication Critical patent/KR101698253B1/ko
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
    • H01L21/0271—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers
    • H01L21/0273—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers characterised by the treatment of photoresist layers
    • H01L21/0274—Photolithographic processes
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C39/00—Shaping by casting, i.e. introducing the moulding material into a mould or between confining surfaces without significant moulding pressure; Apparatus therefor
    • B29C39/02—Shaping by casting, i.e. introducing the moulding material into a mould or between confining surfaces without significant moulding pressure; Apparatus therefor for making articles of definite length, i.e. discrete articles
    • B29C39/12—Making multilayered or multicoloured articles
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/0002—Lithographic processes using patterning methods other than those involving the exposure to radiation, e.g. by stamping
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C59/00—Surface shaping of articles, e.g. embossing; Apparatus therefor
    • B29C59/02—Surface shaping of articles, e.g. embossing; Apparatus therefor by mechanical means, e.g. pressing
    • B29C59/026—Surface shaping of articles, e.g. embossing; Apparatus therefor by mechanical means, e.g. pressing of layered or coated substantially flat surfaces
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B82—NANOTECHNOLOGY
    • B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
    • B82Y10/00—Nanotechnology for information processing, storage or transmission, e.g. quantum computing or single electron logic
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B82—NANOTECHNOLOGY
    • B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
    • B82Y40/00—Manufacture or treatment of nanostructures
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29K—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS OR TO MATERIALS FOR MOULDS, REINFORCEMENTS, FILLERS OR PREFORMED PARTS, e.g. INSERTS
    • B29K2101/00—Use of unspecified macromolecular compounds as moulding material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29L—INDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULAR ARTICLES
    • B29L2009/00—Layered products

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  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Nanotechnology (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Theoretical Computer Science (AREA)
  • Mathematical Physics (AREA)
  • Mechanical Engineering (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Shaping Of Tube Ends By Bending Or Straightening (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
KR1020147023122A 2012-02-27 2013-02-26 임프린트 장치 및 임프린트 방법 그리고 물품 제조 방법 Expired - Fee Related KR101698253B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JPJP-P-2012-039813 2012-02-27
JP2012039813A JP5868215B2 (ja) 2012-02-27 2012-02-27 インプリント装置およびインプリント方法、それを用いた物品の製造方法
PCT/JP2013/001092 WO2013128888A1 (en) 2012-02-27 2013-02-26 Imprint apparatus and imprint method, and article manufacturing method

Publications (2)

Publication Number Publication Date
KR20140116209A KR20140116209A (ko) 2014-10-01
KR101698253B1 true KR101698253B1 (ko) 2017-01-19

Family

ID=49082101

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020147023122A Expired - Fee Related KR101698253B1 (ko) 2012-02-27 2013-02-26 임프린트 장치 및 임프린트 방법 그리고 물품 제조 방법

Country Status (5)

Country Link
US (1) US10105892B2 (enExample)
JP (1) JP5868215B2 (enExample)
KR (1) KR101698253B1 (enExample)
CN (1) CN104137224B (enExample)
WO (1) WO2013128888A1 (enExample)

Families Citing this family (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6294679B2 (ja) * 2014-01-21 2018-03-14 キヤノン株式会社 インプリント装置及び物品の製造方法
JP6525567B2 (ja) * 2014-12-02 2019-06-05 キヤノン株式会社 インプリント装置及び物品の製造方法
US10571801B2 (en) * 2014-12-09 2020-02-25 Canon Kabushiki Kaisha Coating apparatus, imprint apparatus, and method of manufacturing article
US20180180999A1 (en) * 2015-06-29 2018-06-28 Nissan Chemical Industries, Ltd. Imprint material
US10204780B2 (en) * 2015-09-08 2019-02-12 Canon Kabushiki Kaisha Imprint apparatus, and article manufacturing method
JP6702753B2 (ja) 2016-02-17 2020-06-03 キヤノン株式会社 リソグラフィ装置、及び物品の製造方法
JP6313795B2 (ja) * 2016-03-03 2018-04-18 キヤノン株式会社 シャッタユニット、リソグラフィ装置、インプリント装置、及び物品の製造方法
JP6700949B2 (ja) * 2016-04-28 2020-05-27 キヤノン株式会社 インプリント方法及び物品の製造方法
JP6735656B2 (ja) * 2016-11-18 2020-08-05 キヤノン株式会社 インプリント装置、インプリント方法及び物品の製造方法
KR102369538B1 (ko) * 2017-09-28 2022-03-03 캐논 가부시끼가이샤 성형 장치 및 물품 제조 방법
JP7064310B2 (ja) * 2017-10-24 2022-05-10 キヤノン株式会社 インプリント装置、および物品製造方法
CN109828437A (zh) * 2017-11-23 2019-05-31 志圣工业股份有限公司 防黏板结构
JP7210155B2 (ja) * 2018-04-16 2023-01-23 キヤノン株式会社 装置、方法、および物品製造方法
JP7134790B2 (ja) * 2018-08-28 2022-09-12 キオクシア株式会社 インプリント装置、インプリント方法、および半導体装置の製造方法
JP7149872B2 (ja) * 2019-02-14 2022-10-07 キヤノン株式会社 インプリント方法、インプリント装置、および物品の製造方法
JP7407579B2 (ja) * 2019-12-04 2024-01-04 キヤノン株式会社 インプリント装置、インプリント方法、および物品の製造方法
JP7581033B2 (ja) * 2020-12-11 2024-11-12 キヤノン株式会社 インプリント装置、インプリント方法、物品の製造方法、およびコンピュータプログラム
US12353127B2 (en) * 2021-04-14 2025-07-08 Canon Kabushiki Kaisha Imprint apparatus, imprint method and article manufacturing method
JP7669199B2 (ja) 2021-06-07 2025-04-28 キヤノン株式会社 インプリント装置、インプリント方法、コンピュータプログラム、及び物品の製造方法
JP7676281B2 (ja) * 2021-09-27 2025-05-14 キヤノン株式会社 インプリント装置、インプリント方法、及び物品の製造方法
JP7731831B2 (ja) * 2022-03-11 2025-09-01 キオクシア株式会社 インプリント方法、半導体装置の製造方法、及びインプリント装置

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8211214B2 (en) 2003-10-02 2012-07-03 Molecular Imprints, Inc. Single phase fluid imprint lithography method
US8144309B2 (en) * 2007-09-05 2012-03-27 Asml Netherlands B.V. Imprint lithography
WO2009153925A1 (ja) * 2008-06-17 2009-12-23 株式会社ニコン ナノインプリント方法及び装置
JP4892025B2 (ja) * 2008-09-26 2012-03-07 株式会社東芝 インプリント方法
US20110140304A1 (en) * 2009-12-10 2011-06-16 Molecular Imprints, Inc. Imprint lithography template
JP5451450B2 (ja) 2010-02-24 2014-03-26 キヤノン株式会社 インプリント装置及びそのテンプレート並びに物品の製造方法
JP5618588B2 (ja) 2010-03-24 2014-11-05 キヤノン株式会社 インプリント方法
JP2011230430A (ja) * 2010-04-28 2011-11-17 Toshiba Corp テンプレート補修方法、パターン形成方法及びテンプレート補修装置
JP5597031B2 (ja) * 2010-05-31 2014-10-01 キヤノン株式会社 リソグラフィ装置及び物品の製造方法
JP5744422B2 (ja) 2010-06-17 2015-07-08 キヤノン株式会社 インプリント方法及びインプリント装置、サンプルショット抽出方法、並びにそれを用いた物品の製造方法
JP2012039057A (ja) * 2010-07-13 2012-02-23 Canon Inc インプリント装置及び物品の製造方法

Also Published As

Publication number Publication date
WO2013128888A1 (en) 2013-09-06
US20150042012A1 (en) 2015-02-12
KR20140116209A (ko) 2014-10-01
JP2013175631A (ja) 2013-09-05
CN104137224B (zh) 2016-08-17
US10105892B2 (en) 2018-10-23
CN104137224A (zh) 2014-11-05
JP5868215B2 (ja) 2016-02-24

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