JP5865728B2 - 窒化アルミニウム結晶の製造方法 - Google Patents
窒化アルミニウム結晶の製造方法 Download PDFInfo
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- JP5865728B2 JP5865728B2 JP2012038431A JP2012038431A JP5865728B2 JP 5865728 B2 JP5865728 B2 JP 5865728B2 JP 2012038431 A JP2012038431 A JP 2012038431A JP 2012038431 A JP2012038431 A JP 2012038431A JP 5865728 B2 JP5865728 B2 JP 5865728B2
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- aln
- aluminum nitride
- nitrogen
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- 239000013078 crystal Substances 0.000 title claims description 77
- PMHQVHHXPFUNSP-UHFFFAOYSA-M copper(1+);methylsulfanylmethane;bromide Chemical compound Br[Cu].CSC PMHQVHHXPFUNSP-UHFFFAOYSA-M 0.000 title claims description 19
- 238000004519 manufacturing process Methods 0.000 title claims description 15
- 239000000758 substrate Substances 0.000 claims description 64
- 239000007788 liquid Substances 0.000 claims description 31
- 150000001875 compounds Chemical class 0.000 claims description 30
- 229910052594 sapphire Inorganic materials 0.000 claims description 27
- 239000010980 sapphire Substances 0.000 claims description 27
- 239000007789 gas Substances 0.000 claims description 25
- 150000004767 nitrides Chemical class 0.000 claims description 25
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 claims description 20
- 239000001301 oxygen Substances 0.000 claims description 20
- 229910052760 oxygen Inorganic materials 0.000 claims description 20
- 125000004433 nitrogen atom Chemical group N* 0.000 claims description 4
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 35
- 238000000034 method Methods 0.000 description 17
- 229910052757 nitrogen Inorganic materials 0.000 description 13
- 239000010408 film Substances 0.000 description 10
- 230000004907 flux Effects 0.000 description 10
- 229910001873 dinitrogen Inorganic materials 0.000 description 9
- QJGQUHMNIGDVPM-UHFFFAOYSA-N nitrogen group Chemical group [N] QJGQUHMNIGDVPM-UHFFFAOYSA-N 0.000 description 8
- 239000007791 liquid phase Substances 0.000 description 6
- 239000010409 thin film Substances 0.000 description 5
- 229910002704 AlGaN Inorganic materials 0.000 description 4
- XKRFYHLGVUSROY-UHFFFAOYSA-N Argon Chemical compound [Ar] XKRFYHLGVUSROY-UHFFFAOYSA-N 0.000 description 4
- MCMNRKCIXSYSNV-UHFFFAOYSA-N Zirconium dioxide Chemical compound O=[Zr]=O MCMNRKCIXSYSNV-UHFFFAOYSA-N 0.000 description 4
- 229910052782 aluminium Inorganic materials 0.000 description 4
- 238000000137 annealing Methods 0.000 description 4
- 229910052733 gallium Inorganic materials 0.000 description 4
- 239000000155 melt Substances 0.000 description 4
- GYHNNYVSQQEPJS-UHFFFAOYSA-N Gallium Chemical compound [Ga] GYHNNYVSQQEPJS-UHFFFAOYSA-N 0.000 description 3
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 3
- 238000006392 deoxygenation reaction Methods 0.000 description 3
- 230000008018 melting Effects 0.000 description 3
- 238000002844 melting Methods 0.000 description 3
- 239000013081 microcrystal Substances 0.000 description 3
- 238000002441 X-ray diffraction Methods 0.000 description 2
- 229910052786 argon Inorganic materials 0.000 description 2
- 230000000052 comparative effect Effects 0.000 description 2
- 238000004719 convergent beam electron diffraction Methods 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 238000002248 hydride vapour-phase epitaxy Methods 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- MYMOFIZGZYHOMD-UHFFFAOYSA-N Dioxygen Chemical compound O=O MYMOFIZGZYHOMD-UHFFFAOYSA-N 0.000 description 1
- JMASRVWKEDWRBT-UHFFFAOYSA-N Gallium nitride Chemical compound [Ga]#N JMASRVWKEDWRBT-UHFFFAOYSA-N 0.000 description 1
- DGAQECJNVWCQMB-PUAWFVPOSA-M Ilexoside XXIX Chemical compound C[C@@H]1CC[C@@]2(CC[C@@]3(C(=CC[C@H]4[C@]3(CC[C@@H]5[C@@]4(CC[C@@H](C5(C)C)OS(=O)(=O)[O-])C)C)[C@@H]2[C@]1(C)O)C)C(=O)O[C@H]6[C@@H]([C@H]([C@@H]([C@H](O6)CO)O)O)O.[Na+] DGAQECJNVWCQMB-PUAWFVPOSA-M 0.000 description 1
- 229910052783 alkali metal Inorganic materials 0.000 description 1
- 150000001340 alkali metals Chemical class 0.000 description 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 238000005229 chemical vapour deposition Methods 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 238000000354 decomposition reaction Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 229910001882 dioxygen Inorganic materials 0.000 description 1
- 239000003344 environmental pollutant Substances 0.000 description 1
- 230000003628 erosive effect Effects 0.000 description 1
- 238000011156 evaluation Methods 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 239000012535 impurity Substances 0.000 description 1
- 230000005764 inhibitory process Effects 0.000 description 1
- 238000004943 liquid phase epitaxy Methods 0.000 description 1
- QSHDDOUJBYECFT-UHFFFAOYSA-N mercury Chemical compound [Hg] QSHDDOUJBYECFT-UHFFFAOYSA-N 0.000 description 1
- 229910052753 mercury Inorganic materials 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 238000005121 nitriding Methods 0.000 description 1
- 239000011941 photocatalyst Substances 0.000 description 1
- 231100000719 pollutant Toxicity 0.000 description 1
- 230000008707 rearrangement Effects 0.000 description 1
- 230000006798 recombination Effects 0.000 description 1
- 238000001953 recrystallisation Methods 0.000 description 1
- 229910052708 sodium Inorganic materials 0.000 description 1
- 239000011734 sodium Substances 0.000 description 1
- 238000000859 sublimation Methods 0.000 description 1
- 230000008022 sublimation Effects 0.000 description 1
Landscapes
- Crystals, And After-Treatments Of Crystals (AREA)
- Liquid Deposition Of Substances Of Which Semiconductor Devices Are Composed (AREA)
Description
先ず、c面サファイア基板を窒素分圧0.9atm/CO分圧0.1atm、温度1500℃で1時間保持した後、窒素分圧1.0atmで5時間保持し、窒化サファイア基板を得た。c軸配向したAlN結晶について、チルト成分(結晶試料面に垂直な方向の結晶面の揺らぎ)の結晶性はAlN結晶(002)面のX線回折ロッキングカーブの半値幅で表し、ツィスト成分(結晶試料面内における回転方向の揺らぎ)の結晶性はAlN結晶(102)面のロッキングカーブの半値幅で表した。その結果、この窒化サファイア基板表面のAlN薄膜の結晶性はAlN結晶(002)面チルトの半値幅で40arcsecであり、AlN結晶(102)面ツィストは440arcsecであった。
AlN結晶(002)面チルトの半値幅が36arcsec、(102)面ツィストの半値幅が460arcsecである窒化サファイア基板を用い、Ga−Al合金融液からなるフラックス中に吹き込んだ窒素ガス中の酸素分圧を1.25×10−8atmとした以外は、実施例1と同様にして窒化アルミニウム結晶を生成させた。AlN結晶(002)面チルトの半値幅は76arcsecで、(102)面ツィストの半値幅は581arcsecであった。また、エピタキシャル成長したAlN結晶の膜厚は0.7μmであり、AlN膜の極性を判定した結果Al極性であった。
AlN結晶(002)面チルトの半値幅が44arcsec、(102)面ツィストの半値幅が433arcsecである窒化サファイア基板を用い、Niリボンを充填した脱酸素炉の温度を700℃に保ち(O2/N2バランスガスは添加せず)、Ga−Al合金融液からなるフラックス中に吹き込んだ窒素ガス中の酸素分圧を1.00×10−17atmとした以外は、実施例1と同様にして窒化アルミニウム結晶を生成させた。その結果、AlN結晶はシード基板上にほとんど成長せず、シード基板表面に侵食が見られた。
Claims (3)
- Ga−Al合金融液に、N原子を含有し、酸素分圧が1×10−8atm以上1×10−5atm以下であるガスを導入し、該Ga−Al合金融液中の種結晶基板上に窒化アルミニウム結晶をエピタキシャル成長させることを特徴とする窒化アルミニウム結晶の製造方法。
- 前記種結晶基板が窒化サファイア基板であることを特徴とする請求項1記載の窒化アルミニウム結晶の製造方法。
- 前記窒化サファイア基板に形成された窒素極性の窒化アルミニウム膜上に、Al極性の前記窒化アルミニウム結晶をエピタキシャル成長させることを特徴とする請求項2に記載の窒化アルミニウム結晶の製造方法。
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CN107154799A (zh) * | 2017-04-01 | 2017-09-12 | 北京无线电计量测试研究所 | 一种蓝宝石微波频率源和控制方法 |
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JP6189664B2 (ja) * | 2013-07-29 | 2017-08-30 | 住友金属鉱山株式会社 | 窒化アルミニウム結晶の製造方法 |
JP6491488B2 (ja) * | 2015-01-30 | 2019-03-27 | 住友金属鉱山株式会社 | エピタキシャル成長用基板及びその製造方法 |
CN110142409B (zh) * | 2019-06-25 | 2024-05-14 | 华北理工大学 | 一种高压选区激光熔化制备含氮合金的方法 |
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JP5656697B2 (ja) * | 2010-07-14 | 2015-01-21 | 住友金属鉱山株式会社 | 窒化アルミニウム結晶の製造方法 |
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CN107154799B (zh) * | 2017-04-01 | 2020-04-14 | 北京无线电计量测试研究所 | 一种蓝宝石微波频率源和控制方法 |
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