JP5864890B2 - 撮像装置 - Google Patents
撮像装置 Download PDFInfo
- Publication number
- JP5864890B2 JP5864890B2 JP2011098587A JP2011098587A JP5864890B2 JP 5864890 B2 JP5864890 B2 JP 5864890B2 JP 2011098587 A JP2011098587 A JP 2011098587A JP 2011098587 A JP2011098587 A JP 2011098587A JP 5864890 B2 JP5864890 B2 JP 5864890B2
- Authority
- JP
- Japan
- Prior art keywords
- imaging element
- fixing member
- imaging
- opening
- image sensor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Images
Classifications
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03B—APPARATUS OR ARRANGEMENTS FOR TAKING PHOTOGRAPHS OR FOR PROJECTING OR VIEWING THEM; APPARATUS OR ARRANGEMENTS EMPLOYING ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ACCESSORIES THEREFOR
- G03B19/00—Cameras
- G03B19/02—Still-picture cameras
- G03B19/12—Reflex cameras with single objective and a movable reflector or a partly-transmitting mirror
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/50—Constructional details
- H04N23/54—Mounting of pick-up tubes, electronic image sensors, deviation or focusing coils
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
- H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
- H10F39/80—Constructional details of image sensors
- H10F39/806—Optical elements or arrangements associated with the image sensors
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Studio Devices (AREA)
- Camera Bodies And Camera Details Or Accessories (AREA)
- Solid State Image Pick-Up Elements (AREA)
- Transforming Light Signals Into Electric Signals (AREA)
Priority Applications (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2011098587A JP5864890B2 (ja) | 2011-04-26 | 2011-04-26 | 撮像装置 |
| CN2012101206197A CN102761686A (zh) | 2011-04-26 | 2012-04-23 | 摄像设备 |
| US13/454,995 US9291881B2 (en) | 2011-04-26 | 2012-04-24 | Imaging apparatus |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2011098587A JP5864890B2 (ja) | 2011-04-26 | 2011-04-26 | 撮像装置 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2012230259A JP2012230259A (ja) | 2012-11-22 |
| JP2012230259A5 JP2012230259A5 (enExample) | 2014-06-19 |
| JP5864890B2 true JP5864890B2 (ja) | 2016-02-17 |
Family
ID=47056001
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2011098587A Expired - Fee Related JP5864890B2 (ja) | 2011-04-26 | 2011-04-26 | 撮像装置 |
Country Status (3)
| Country | Link |
|---|---|
| US (1) | US9291881B2 (enExample) |
| JP (1) | JP5864890B2 (enExample) |
| CN (1) | CN102761686A (enExample) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5864890B2 (ja) * | 2011-04-26 | 2016-02-17 | キヤノン株式会社 | 撮像装置 |
| TWI545424B (zh) * | 2013-09-18 | 2016-08-11 | 微太科技股份有限公司 | 鏡頭視角切換裝置以及鏡頭視角切換方法 |
| JP6524951B2 (ja) * | 2016-03-30 | 2019-06-05 | パナソニックIpマネジメント株式会社 | カメラモジュール |
| JP6666044B2 (ja) | 2016-04-27 | 2020-03-13 | キヤノン株式会社 | 撮像装置 |
Family Cites Families (25)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5455386A (en) * | 1994-01-14 | 1995-10-03 | Olin Corporation | Chamfered electronic package component |
| US5837090A (en) * | 1994-12-08 | 1998-11-17 | Raytheon Company | Precision aligning and joining of two articles using a flowable adhesive |
| US6654064B2 (en) * | 1997-05-23 | 2003-11-25 | Canon Kabushiki Kaisha | Image pickup device incorporating a position defining member |
| JP4169938B2 (ja) * | 2000-01-28 | 2008-10-22 | Hoya株式会社 | 固体撮像素子保持ブロックおよび固体撮像素子取り付け構造 |
| US6956615B2 (en) * | 2000-01-28 | 2005-10-18 | Pentax Corporation | Structure for mounting a solid-state imaging device |
| JP4079343B2 (ja) * | 2001-06-07 | 2008-04-23 | 株式会社リコー | 画像読み取り装置及び画像形成装置 |
| JP4477811B2 (ja) * | 2002-02-27 | 2010-06-09 | Hoya株式会社 | 固体撮像素子の取付板及びその取付板への取付方法 |
| US7583309B2 (en) * | 2002-06-28 | 2009-09-01 | Kyocera Coproration | Imaging device package camera module and camera module producing method |
| US20040238947A1 (en) * | 2003-05-28 | 2004-12-02 | Intel Corporation | Package and method for attaching an integrated heat spreader |
| JP2006081008A (ja) * | 2004-09-10 | 2006-03-23 | Olympus Corp | 光学機器 |
| JP2006094444A (ja) * | 2004-09-27 | 2006-04-06 | Casio Comput Co Ltd | 固体撮像素子の固定構造 |
| JP4471853B2 (ja) | 2005-01-21 | 2010-06-02 | Hoya株式会社 | デジタルカメラ |
| JP4555732B2 (ja) * | 2005-05-24 | 2010-10-06 | オリンパスイメージング株式会社 | 撮像装置 |
| JP4818750B2 (ja) * | 2006-02-23 | 2011-11-16 | オリンパスイメージング株式会社 | 撮像装置 |
| US7829833B2 (en) * | 2005-05-24 | 2010-11-09 | Olympus Imaging Corp. | Arranging and/or supporting an image pickup device in an image pickup apparatus |
| JP4668036B2 (ja) * | 2005-11-02 | 2011-04-13 | Hoya株式会社 | 撮像素子のfpcに対する取り付け構造 |
| US7399930B1 (en) * | 2007-01-16 | 2008-07-15 | International Business Machines Corporation | Method and device for repair of a contact pad of a printed circuit board |
| JP4280779B2 (ja) * | 2007-01-31 | 2009-06-17 | キヤノン株式会社 | 撮像装置 |
| CN100576555C (zh) * | 2007-08-09 | 2009-12-30 | 佛山普立华科技有限公司 | 影像装置 |
| TW200951616A (en) * | 2008-06-05 | 2009-12-16 | Asia Optical Co Inc | Image sensing module |
| CN201289538Y (zh) * | 2008-03-31 | 2009-08-12 | 富士能株式会社 | 透镜组装体及摄像装置 |
| JP4560121B2 (ja) * | 2008-12-17 | 2010-10-13 | 株式会社東芝 | センサー固定装置およびカメラモジュール |
| US8553131B2 (en) * | 2010-06-03 | 2013-10-08 | Bendix Commercial Vehicle Systems Llc | Six-axis mount |
| JP5093324B2 (ja) * | 2010-10-08 | 2012-12-12 | カシオ計算機株式会社 | 固体撮像素子ユニット及びその製造方法並びに撮像装置 |
| JP5864890B2 (ja) * | 2011-04-26 | 2016-02-17 | キヤノン株式会社 | 撮像装置 |
-
2011
- 2011-04-26 JP JP2011098587A patent/JP5864890B2/ja not_active Expired - Fee Related
-
2012
- 2012-04-23 CN CN2012101206197A patent/CN102761686A/zh active Pending
- 2012-04-24 US US13/454,995 patent/US9291881B2/en not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| US9291881B2 (en) | 2016-03-22 |
| US20120273656A1 (en) | 2012-11-01 |
| CN102761686A (zh) | 2012-10-31 |
| JP2012230259A (ja) | 2012-11-22 |
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