JP2012230259A - 撮像装置 - Google Patents
撮像装置 Download PDFInfo
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- JP2012230259A JP2012230259A JP2011098587A JP2011098587A JP2012230259A JP 2012230259 A JP2012230259 A JP 2012230259A JP 2011098587 A JP2011098587 A JP 2011098587A JP 2011098587 A JP2011098587 A JP 2011098587A JP 2012230259 A JP2012230259 A JP 2012230259A
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- imaging element
- opening
- image sensor
- imaging
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- 238000003384 imaging method Methods 0.000 title claims abstract description 97
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- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
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- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
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Images
Classifications
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03B—APPARATUS OR ARRANGEMENTS FOR TAKING PHOTOGRAPHS OR FOR PROJECTING OR VIEWING THEM; APPARATUS OR ARRANGEMENTS EMPLOYING ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ACCESSORIES THEREFOR
- G03B19/00—Cameras
- G03B19/02—Still-picture cameras
- G03B19/12—Reflex cameras with single objective and a movable reflector or a partly-transmitting mirror
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
- H01L27/144—Devices controlled by radiation
- H01L27/146—Imager structures
- H01L27/14601—Structural or functional details thereof
- H01L27/14625—Optical elements or arrangements associated with the device
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/50—Constructional details
- H04N23/54—Mounting of pick-up tubes, electronic image sensors, deviation or focusing coils
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Studio Devices (AREA)
- Camera Bodies And Camera Details Or Accessories (AREA)
- Solid State Image Pick-Up Elements (AREA)
- Transforming Light Signals Into Electric Signals (AREA)
Abstract
【解決手段】 撮像素子と、開口部が形成される固定部材とを備え、前記撮像素子を前記固定部材に位置決めした後、前記開口部に接着剤を流し込むことで、前記撮像素子を前記固定部材に接着固定する撮像装置であって、前記開口部は、前記撮像素子の長辺方向における略中央部分にて、前記撮像素子の短辺方向に延出した形状に形成されるとともに、前記撮像素子に対向しない側の開口幅が前記撮像素子に対向する側の開口幅よりも大きくなるように形成される。
【選択図】 図6
Description
40 撮像ユニット
510 撮像素子固定部材
700 開口部
800 接着剤
Claims (5)
- 撮像素子と、開口部が形成される固定部材とを備え、前記撮像素子を前記固定部材に位置決めした後、前記開口部に接着剤を流し込むことで、前記撮像素子を前記固定部材に接着固定する撮像装置であって、
前記開口部は、前記撮像素子の長辺方向における略中央部分にて、前記撮像素子の短辺方向に延出した形状に形成されるとともに、前記撮像素子に対向しない側の開口幅が前記撮像素子に対向する側の開口幅よりも大きくなるように形成されることを特徴とする撮像装置。 - 前記開口部は、前記撮像素子に対向しない側に面取り加工を施すことで、前記撮像素子に対向しない側の開口幅が前記撮像素子に対向する側の開口幅よりも大きくなるように形成されることを特徴とする請求項1に記載の撮像装置。
- 前記開口部は、前記撮像素子に対向しない側に座ぐり加工を施すことで、前記撮像素子に対向しない側の開口幅が前記撮像素子に対向する側の開口幅よりも大きくなるように形成されることを特徴とする請求項1に記載の撮像装置。
- 前記開口部は、前記撮像素子の長辺方向における略中央部分に複数形成されることを特徴とする請求項1ないし3のいずれか1項に記載の撮像装置。
- 前記接着剤は光硬化型接着剤であることを特徴とする請求項1ないし4のいずれか1項に記載の撮像装置。
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2011098587A JP5864890B2 (ja) | 2011-04-26 | 2011-04-26 | 撮像装置 |
CN2012101206197A CN102761686A (zh) | 2011-04-26 | 2012-04-23 | 摄像设备 |
US13/454,995 US9291881B2 (en) | 2011-04-26 | 2012-04-24 | Imaging apparatus |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2011098587A JP5864890B2 (ja) | 2011-04-26 | 2011-04-26 | 撮像装置 |
Publications (3)
Publication Number | Publication Date |
---|---|
JP2012230259A true JP2012230259A (ja) | 2012-11-22 |
JP2012230259A5 JP2012230259A5 (ja) | 2014-06-19 |
JP5864890B2 JP5864890B2 (ja) | 2016-02-17 |
Family
ID=47056001
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2011098587A Expired - Fee Related JP5864890B2 (ja) | 2011-04-26 | 2011-04-26 | 撮像装置 |
Country Status (3)
Country | Link |
---|---|
US (1) | US9291881B2 (ja) |
JP (1) | JP5864890B2 (ja) |
CN (1) | CN102761686A (ja) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2017169059A1 (ja) * | 2016-03-30 | 2017-10-05 | パナソニックIpマネジメント株式会社 | カメラモジュール |
US10136039B2 (en) | 2016-04-27 | 2018-11-20 | Canon Kabushiki Kaisha | Image pickup apparatus capable of preventing thermal deformation of a fixing member fixed to image pickup device package |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP5864890B2 (ja) * | 2011-04-26 | 2016-02-17 | キヤノン株式会社 | 撮像装置 |
TWI545424B (zh) * | 2013-09-18 | 2016-08-11 | 微太科技股份有限公司 | 鏡頭視角切換裝置以及鏡頭視角切換方法 |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2001285722A (ja) * | 2000-01-28 | 2001-10-12 | Asahi Optical Co Ltd | 固体撮像素子保持ブロックおよび固体撮像素子取り付け構造 |
JP2006094444A (ja) * | 2004-09-27 | 2006-04-06 | Casio Comput Co Ltd | 固体撮像素子の固定構造 |
JP2007227673A (ja) * | 2006-02-23 | 2007-09-06 | Olympus Imaging Corp | 撮像装置 |
JP2010147700A (ja) * | 2008-12-17 | 2010-07-01 | Toshiba Corp | センサー固定装置およびカメラモジュール |
JP2011018080A (ja) * | 2010-10-08 | 2011-01-27 | Casio Computer Co Ltd | 固体撮像素子ユニット及びその製造方法並びに撮像装置 |
Family Cites Families (20)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5455386A (en) * | 1994-01-14 | 1995-10-03 | Olin Corporation | Chamfered electronic package component |
US5837090A (en) * | 1994-12-08 | 1998-11-17 | Raytheon Company | Precision aligning and joining of two articles using a flowable adhesive |
US6654064B2 (en) * | 1997-05-23 | 2003-11-25 | Canon Kabushiki Kaisha | Image pickup device incorporating a position defining member |
US6956615B2 (en) * | 2000-01-28 | 2005-10-18 | Pentax Corporation | Structure for mounting a solid-state imaging device |
JP4079343B2 (ja) * | 2001-06-07 | 2008-04-23 | 株式会社リコー | 画像読み取り装置及び画像形成装置 |
JP4477811B2 (ja) * | 2002-02-27 | 2010-06-09 | Hoya株式会社 | 固体撮像素子の取付板及びその取付板への取付方法 |
KR100718421B1 (ko) * | 2002-06-28 | 2007-05-14 | 교세라 가부시키가이샤 | 소형 모듈 카메라, 카메라 모듈, 카메라 모듈 제조 방법 및 촬상 소자의 패키징 방법 |
US20040238947A1 (en) * | 2003-05-28 | 2004-12-02 | Intel Corporation | Package and method for attaching an integrated heat spreader |
JP2006081008A (ja) * | 2004-09-10 | 2006-03-23 | Olympus Corp | 光学機器 |
JP4471853B2 (ja) | 2005-01-21 | 2010-06-02 | Hoya株式会社 | デジタルカメラ |
US7829833B2 (en) * | 2005-05-24 | 2010-11-09 | Olympus Imaging Corp. | Arranging and/or supporting an image pickup device in an image pickup apparatus |
JP4555732B2 (ja) * | 2005-05-24 | 2010-10-06 | オリンパスイメージング株式会社 | 撮像装置 |
JP4668036B2 (ja) * | 2005-11-02 | 2011-04-13 | Hoya株式会社 | 撮像素子のfpcに対する取り付け構造 |
US7399930B1 (en) * | 2007-01-16 | 2008-07-15 | International Business Machines Corporation | Method and device for repair of a contact pad of a printed circuit board |
JP4280779B2 (ja) * | 2007-01-31 | 2009-06-17 | キヤノン株式会社 | 撮像装置 |
CN100576555C (zh) * | 2007-08-09 | 2009-12-30 | 佛山普立华科技有限公司 | 影像装置 |
TW200951616A (en) * | 2008-06-05 | 2009-12-16 | Asia Optical Co Inc | Image sensing module |
CN201289538Y (zh) * | 2008-03-31 | 2009-08-12 | 富士能株式会社 | 透镜组装体及摄像装置 |
US8553131B2 (en) * | 2010-06-03 | 2013-10-08 | Bendix Commercial Vehicle Systems Llc | Six-axis mount |
JP5864890B2 (ja) * | 2011-04-26 | 2016-02-17 | キヤノン株式会社 | 撮像装置 |
-
2011
- 2011-04-26 JP JP2011098587A patent/JP5864890B2/ja not_active Expired - Fee Related
-
2012
- 2012-04-23 CN CN2012101206197A patent/CN102761686A/zh active Pending
- 2012-04-24 US US13/454,995 patent/US9291881B2/en not_active Expired - Fee Related
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2001285722A (ja) * | 2000-01-28 | 2001-10-12 | Asahi Optical Co Ltd | 固体撮像素子保持ブロックおよび固体撮像素子取り付け構造 |
JP2006094444A (ja) * | 2004-09-27 | 2006-04-06 | Casio Comput Co Ltd | 固体撮像素子の固定構造 |
JP2007227673A (ja) * | 2006-02-23 | 2007-09-06 | Olympus Imaging Corp | 撮像装置 |
JP2010147700A (ja) * | 2008-12-17 | 2010-07-01 | Toshiba Corp | センサー固定装置およびカメラモジュール |
JP2011018080A (ja) * | 2010-10-08 | 2011-01-27 | Casio Computer Co Ltd | 固体撮像素子ユニット及びその製造方法並びに撮像装置 |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2017169059A1 (ja) * | 2016-03-30 | 2017-10-05 | パナソニックIpマネジメント株式会社 | カメラモジュール |
US10136039B2 (en) | 2016-04-27 | 2018-11-20 | Canon Kabushiki Kaisha | Image pickup apparatus capable of preventing thermal deformation of a fixing member fixed to image pickup device package |
Also Published As
Publication number | Publication date |
---|---|
US9291881B2 (en) | 2016-03-22 |
US20120273656A1 (en) | 2012-11-01 |
JP5864890B2 (ja) | 2016-02-17 |
CN102761686A (zh) | 2012-10-31 |
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