JP5851599B2 - パワーモジュール - Google Patents

パワーモジュール Download PDF

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Publication number
JP5851599B2
JP5851599B2 JP2014515561A JP2014515561A JP5851599B2 JP 5851599 B2 JP5851599 B2 JP 5851599B2 JP 2014515561 A JP2014515561 A JP 2014515561A JP 2014515561 A JP2014515561 A JP 2014515561A JP 5851599 B2 JP5851599 B2 JP 5851599B2
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JP
Japan
Prior art keywords
control board
heat
semiconductor element
power module
power semiconductor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2014515561A
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English (en)
Japanese (ja)
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JPWO2013172183A1 (ja
Inventor
宏之 和久
宏之 和久
幸司 吉瀬
幸司 吉瀬
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Priority to JP2014515561A priority Critical patent/JP5851599B2/ja
Publication of JPWO2013172183A1 publication Critical patent/JPWO2013172183A1/ja
Application granted granted Critical
Publication of JP5851599B2 publication Critical patent/JP5851599B2/ja
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
    • H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/07—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L29/00
    • H01L25/072—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L29/00 the devices being arranged next to each other
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48135—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
    • H01L2224/48137—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being arranged next to each other, e.g. on a common substrate
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/13—Discrete devices, e.g. 3 terminal devices
    • H01L2924/1304—Transistor
    • H01L2924/1305—Bipolar Junction Transistor [BJT]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/13—Discrete devices, e.g. 3 terminal devices
    • H01L2924/1304—Transistor
    • H01L2924/1305—Bipolar Junction Transistor [BJT]
    • H01L2924/13055—Insulated gate bipolar transistor [IGBT]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/13—Discrete devices, e.g. 3 terminal devices
    • H01L2924/1304—Transistor
    • H01L2924/1306—Field-effect transistor [FET]
    • H01L2924/13091—Metal-Oxide-Semiconductor Field-Effect Transistor [MOSFET]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
JP2014515561A 2012-05-18 2013-04-26 パワーモジュール Active JP5851599B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2014515561A JP5851599B2 (ja) 2012-05-18 2013-04-26 パワーモジュール

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP2012113957 2012-05-18
JP2012113957 2012-05-18
PCT/JP2013/062372 WO2013172183A1 (fr) 2012-05-18 2013-04-26 Module de puissance
JP2014515561A JP5851599B2 (ja) 2012-05-18 2013-04-26 パワーモジュール

Publications (2)

Publication Number Publication Date
JPWO2013172183A1 JPWO2013172183A1 (ja) 2016-01-12
JP5851599B2 true JP5851599B2 (ja) 2016-02-03

Family

ID=49583592

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2014515561A Active JP5851599B2 (ja) 2012-05-18 2013-04-26 パワーモジュール

Country Status (2)

Country Link
JP (1) JP5851599B2 (fr)
WO (1) WO2013172183A1 (fr)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2014050389A1 (fr) * 2012-09-27 2014-04-03 富士電機株式会社 Module à semi-conducteurs de puissance
WO2016031052A1 (fr) * 2014-08-29 2016-03-03 三菱電機株式会社 Dispositif à semi-conducteur et dispositif à semi-conducteur polyphasé
WO2016063353A1 (fr) * 2014-10-21 2016-04-28 株式会社安川電機 Dispositif de commande de moteur et système de robot
JP6737166B2 (ja) * 2016-12-21 2020-08-05 住友電気工業株式会社 半導体モジュール
EP3462822A1 (fr) * 2017-09-29 2019-04-03 Siemens Aktiengesellschaft Convertisseur électrique
WO2019142253A1 (fr) * 2018-01-17 2019-07-25 新電元工業株式会社 Module électronique
WO2022239154A1 (fr) * 2021-05-12 2022-11-17 三菱電機株式会社 Module de puissance et dispositif de conversion de puissance

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3466329B2 (ja) * 1995-06-16 2003-11-10 三菱電機株式会社 半導体パワーモジュール
JP3521785B2 (ja) * 1999-02-05 2004-04-19 株式会社日立製作所 樹脂封止した半導体装置
JP4163360B2 (ja) * 2000-02-21 2008-10-08 三菱電機株式会社 パワーモジュール
JP5230213B2 (ja) * 2007-09-26 2013-07-10 ローム株式会社 半導体装置

Also Published As

Publication number Publication date
WO2013172183A1 (fr) 2013-11-21
JPWO2013172183A1 (ja) 2016-01-12

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