JP5846470B2 - レーザダイシング装置及び方法並びにウェーハ処理方法 - Google Patents

レーザダイシング装置及び方法並びにウェーハ処理方法 Download PDF

Info

Publication number
JP5846470B2
JP5846470B2 JP2011020999A JP2011020999A JP5846470B2 JP 5846470 B2 JP5846470 B2 JP 5846470B2 JP 2011020999 A JP2011020999 A JP 2011020999A JP 2011020999 A JP2011020999 A JP 2011020999A JP 5846470 B2 JP5846470 B2 JP 5846470B2
Authority
JP
Japan
Prior art keywords
wafer
laser
tape
laser dicing
holding surface
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP2011020999A
Other languages
English (en)
Japanese (ja)
Other versions
JP2012160659A5 (enrdf_load_stackoverflow
JP2012160659A (ja
Inventor
貴介 清水
貴介 清水
藤田　隆
隆 藤田
翼 清水
翼 清水
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Tokyo Seimitsu Co Ltd
Original Assignee
Tokyo Seimitsu Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokyo Seimitsu Co Ltd filed Critical Tokyo Seimitsu Co Ltd
Priority to JP2011020999A priority Critical patent/JP5846470B2/ja
Publication of JP2012160659A publication Critical patent/JP2012160659A/ja
Publication of JP2012160659A5 publication Critical patent/JP2012160659A5/ja
Application granted granted Critical
Publication of JP5846470B2 publication Critical patent/JP5846470B2/ja
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Landscapes

  • Micromachines (AREA)
  • Laser Beam Processing (AREA)
  • Dicing (AREA)
JP2011020999A 2011-02-02 2011-02-02 レーザダイシング装置及び方法並びにウェーハ処理方法 Expired - Fee Related JP5846470B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2011020999A JP5846470B2 (ja) 2011-02-02 2011-02-02 レーザダイシング装置及び方法並びにウェーハ処理方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2011020999A JP5846470B2 (ja) 2011-02-02 2011-02-02 レーザダイシング装置及び方法並びにウェーハ処理方法

Publications (3)

Publication Number Publication Date
JP2012160659A JP2012160659A (ja) 2012-08-23
JP2012160659A5 JP2012160659A5 (enrdf_load_stackoverflow) 2014-03-06
JP5846470B2 true JP5846470B2 (ja) 2016-01-20

Family

ID=46840931

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2011020999A Expired - Fee Related JP5846470B2 (ja) 2011-02-02 2011-02-02 レーザダイシング装置及び方法並びにウェーハ処理方法

Country Status (1)

Country Link
JP (1) JP5846470B2 (enrdf_load_stackoverflow)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5860217B2 (ja) * 2011-03-04 2016-02-16 株式会社ディスコ レーザー加工装置
JP5860219B2 (ja) * 2011-03-10 2016-02-16 株式会社ディスコ レーザー加工装置
TWI512867B (zh) * 2012-12-14 2015-12-11 Yayatech Co Ltd 晶圓切割道之檢測方法及其檢測治具
JP2014212282A (ja) * 2013-04-22 2014-11-13 株式会社ディスコ ウェーハの加工方法
JP6151557B2 (ja) * 2013-05-13 2017-06-21 株式会社ディスコ レーザー加工方法
DE102018200656A1 (de) * 2018-01-16 2019-07-18 Disco Corporation Verfahren zum Bearbeiten eines Wafers
JP6651208B1 (ja) * 2019-05-15 2020-02-19 ハイソル株式会社 ウェハチャック及びチャックリング
JP7286503B2 (ja) * 2019-09-26 2023-06-05 株式会社ディスコ ウエーハの加工方法、及びウエーハの加工装置

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002248593A (ja) * 2000-12-21 2002-09-03 Hitachi Metals Ltd シート部材のレーザ加工治具及び加工方法
JP4770126B2 (ja) * 2003-06-06 2011-09-14 日立化成工業株式会社 接着シート
JP2007275920A (ja) * 2006-04-05 2007-10-25 Seiko Epson Corp 基体の製造方法、表示装置、電気光学装置、電子機器
JP2009101384A (ja) * 2007-10-23 2009-05-14 Olympus Corp レーザ加工方法
JP2009262216A (ja) * 2008-04-28 2009-11-12 Toyota Motor Corp 透明基材のレーザ加工方法および電解質膜の製造方法
JP2010029930A (ja) * 2008-07-31 2010-02-12 Disco Abrasive Syst Ltd レーザ加工装置及びレーザ加工方法

Also Published As

Publication number Publication date
JP2012160659A (ja) 2012-08-23

Similar Documents

Publication Publication Date Title
JP5846470B2 (ja) レーザダイシング装置及び方法並びにウェーハ処理方法
JP5980275B2 (ja) レーザダイシング装置及び方法
JP5983923B2 (ja) レーザダイシング装置及び方法並びにウェーハ処理方法
JP6175470B2 (ja) レーザダイシング装置及び方法
JP5829433B2 (ja) レーザダイシング装置及び方法
JP2012164974A (ja) レーザー加工装置、及びレーザー加工方法
JP6214192B2 (ja) 加工方法
US20110051250A1 (en) Optical element, and processing apparatus and method for reducing reflection
KR102584665B1 (ko) 층 구조를 갖는 마이크로전자 컴포넌트들을 생성하기 위한 방법 및 제조 시스템
JP6319640B2 (ja) レーザダイシング装置及び方法
TWI818183B (zh) 樹脂黏貼機
JP2014014841A (ja) 基板加工方法及び装置
TWI831794B (zh) 工件分離裝置及工件分離方法
JP2014015352A (ja) 基板加工方法及び装置
KR20150116778A (ko) 레이저 리프트 오프 장치
JP6735372B2 (ja) レーザダイシング装置
JP2013107090A (ja) 脆性基板加工装置
KR100371103B1 (ko) 비금속 기판 절단 장치 및 그 절단 방법
JP2020017592A (ja) ウェーハの分割方法
JP6483204B2 (ja) レーザダイシング装置及び方法
JP6048713B2 (ja) レーザダイシング装置及び方法
JP2008062547A (ja) レーザ照射による脆性材板割断の方法および装置。
KR101708503B1 (ko) 필름 절단을 위한 레이저 절단 장치 및 이를 이용한 필름 절단 방법
US20060255025A1 (en) Processing apparatus
JP6044814B2 (ja) レーザダイシング装置及び方法

Legal Events

Date Code Title Description
A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20140107

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20140120

A977 Report on retrieval

Free format text: JAPANESE INTERMEDIATE CODE: A971007

Effective date: 20141210

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20150128

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20150325

TRDD Decision of grant or rejection written
A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

Effective date: 20151030

A61 First payment of annual fees (during grant procedure)

Free format text: JAPANESE INTERMEDIATE CODE: A61

Effective date: 20151112

R150 Certificate of patent or registration of utility model

Ref document number: 5846470

Country of ref document: JP

Free format text: JAPANESE INTERMEDIATE CODE: R150

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

LAPS Cancellation because of no payment of annual fees