JP5845669B2 - センサーデバイスおよび電子機器 - Google Patents

センサーデバイスおよび電子機器 Download PDF

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Publication number
JP5845669B2
JP5845669B2 JP2011152731A JP2011152731A JP5845669B2 JP 5845669 B2 JP5845669 B2 JP 5845669B2 JP 2011152731 A JP2011152731 A JP 2011152731A JP 2011152731 A JP2011152731 A JP 2011152731A JP 5845669 B2 JP5845669 B2 JP 5845669B2
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JP
Japan
Prior art keywords
sensor
substrate
rigid substrate
rigid
axis
Prior art date
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Expired - Fee Related
Application number
JP2011152731A
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English (en)
Japanese (ja)
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JP2013019745A (ja
JP2013019745A5 (enExample
Inventor
正泰 佐久間
正泰 佐久間
祥宏 小林
祥宏 小林
北村　昇二郎
昇二郎 北村
岳人 茅野
岳人 茅野
今井　信行
信行 今井
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Seiko Epson Corp
Original Assignee
Seiko Epson Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Seiko Epson Corp filed Critical Seiko Epson Corp
Priority to JP2011152731A priority Critical patent/JP5845669B2/ja
Priority to US13/543,098 priority patent/US9250260B2/en
Priority to CN201210237741.2A priority patent/CN102879597B/zh
Publication of JP2013019745A publication Critical patent/JP2013019745A/ja
Publication of JP2013019745A5 publication Critical patent/JP2013019745A5/ja
Priority to US14/982,700 priority patent/US9541397B2/en
Application granted granted Critical
Publication of JP5845669B2 publication Critical patent/JP5845669B2/ja
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01C—MEASURING DISTANCES, LEVELS OR BEARINGS; SURVEYING; NAVIGATION; GYROSCOPIC INSTRUMENTS; PHOTOGRAMMETRY OR VIDEOGRAMMETRY
    • G01C19/00—Gyroscopes; Turn-sensitive devices using vibrating masses; Turn-sensitive devices without moving masses; Measuring angular rate using gyroscopic effects
    • G01C19/56—Turn-sensitive devices using vibrating masses, e.g. vibratory angular rate sensors based on Coriolis forces
    • G01C19/5783—Mountings or housings not specific to any of the devices covered by groups G01C19/5607 - G01C19/5719
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01P—MEASURING LINEAR OR ANGULAR SPEED, ACCELERATION, DECELERATION, OR SHOCK; INDICATING PRESENCE, ABSENCE, OR DIRECTION, OF MOVEMENT
    • G01P1/00—Details of instruments
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01P—MEASURING LINEAR OR ANGULAR SPEED, ACCELERATION, DECELERATION, OR SHOCK; INDICATING PRESENCE, ABSENCE, OR DIRECTION, OF MOVEMENT
    • G01P15/00—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration
    • G01P15/02—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01P—MEASURING LINEAR OR ANGULAR SPEED, ACCELERATION, DECELERATION, OR SHOCK; INDICATING PRESENCE, ABSENCE, OR DIRECTION, OF MOVEMENT
    • G01P15/00—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration
    • G01P15/02—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses
    • G01P15/08—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values
    • G01P15/097—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values by vibratory elements
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01P—MEASURING LINEAR OR ANGULAR SPEED, ACCELERATION, DECELERATION, OR SHOCK; INDICATING PRESENCE, ABSENCE, OR DIRECTION, OF MOVEMENT
    • G01P15/00—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration
    • G01P15/18—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration in two or more dimensions

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Radar, Positioning & Navigation (AREA)
  • Remote Sensing (AREA)
  • Gyroscopes (AREA)
  • Mounting Of Printed Circuit Boards And The Like (AREA)
JP2011152731A 2011-07-11 2011-07-11 センサーデバイスおよび電子機器 Expired - Fee Related JP5845669B2 (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2011152731A JP5845669B2 (ja) 2011-07-11 2011-07-11 センサーデバイスおよび電子機器
US13/543,098 US9250260B2 (en) 2011-07-11 2012-07-06 Sensor device, and electronic apparatus
CN201210237741.2A CN102879597B (zh) 2011-07-11 2012-07-09 传感器装置以及电子设备
US14/982,700 US9541397B2 (en) 2011-07-11 2015-12-29 Sensor device, and electronic apparatus

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2011152731A JP5845669B2 (ja) 2011-07-11 2011-07-11 センサーデバイスおよび電子機器

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2015229382A Division JP6179579B2 (ja) 2015-11-25 2015-11-25 センサーデバイスおよび電子機器

Publications (3)

Publication Number Publication Date
JP2013019745A JP2013019745A (ja) 2013-01-31
JP2013019745A5 JP2013019745A5 (enExample) 2014-08-21
JP5845669B2 true JP5845669B2 (ja) 2016-01-20

Family

ID=47480995

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2011152731A Expired - Fee Related JP5845669B2 (ja) 2011-07-11 2011-07-11 センサーデバイスおよび電子機器

Country Status (3)

Country Link
US (2) US9250260B2 (enExample)
JP (1) JP5845669B2 (enExample)
CN (1) CN102879597B (enExample)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9551730B2 (en) * 2014-07-02 2017-01-24 Merlin Technology, Inc. Mechanical shock resistant MEMS accelerometer arrangement, associated method, apparatus and system
CN106662446B (zh) 2014-07-16 2019-10-25 精工爱普生株式会社 传感器单元、电子设备以及移动体
JP6506034B2 (ja) * 2015-01-29 2019-04-24 京セラ株式会社 電子素子実装用基板および電子装置
JP2020101484A (ja) * 2018-12-25 2020-07-02 セイコーエプソン株式会社 慣性センサー、電子機器および移動体
US11340254B2 (en) * 2019-09-30 2022-05-24 Seiko Epson Corporation Inertial measurement unit having a sensor unit that is detachable from a substrate
JP7552377B2 (ja) * 2021-01-20 2024-09-18 セイコーエプソン株式会社 センサーモジュール
JPWO2022239347A1 (enExample) * 2021-05-12 2022-11-17
JP2024042245A (ja) * 2022-09-15 2024-03-28 セイコーエプソン株式会社 慣性計測装置

Family Cites Families (29)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5241861A (en) * 1991-02-08 1993-09-07 Sundstrand Corporation Micromachined rate and acceleration sensor
JPH05340960A (ja) 1992-06-09 1993-12-24 Hitachi Ltd 多次元加速度センサ
JPH07306047A (ja) 1994-05-10 1995-11-21 Murata Mfg Co Ltd 多軸検出型振動ジャイロ
JP3780086B2 (ja) 1998-01-22 2006-05-31 Ｎｅｃトーキン株式会社 姿勢角度検出装置
JPH11289141A (ja) 1998-04-02 1999-10-19 Toshiba Corp 回路基板及びその製造方法
DE19858621C2 (de) 1998-12-18 2001-02-01 Autoflug Gmbh Verfahren zum Verbessern der Meßwerte eines inertialen Meßsystems
US6216537B1 (en) * 1999-03-31 2001-04-17 Medtronic, Inc. Accelerometer for implantable medical device
JP2001102746A (ja) 1999-09-30 2001-04-13 Sony Corp 回路装置とその製造方法
JP2002009228A (ja) 2000-06-20 2002-01-11 Seiko Epson Corp 半導体装置
US6545865B2 (en) * 2001-07-13 2003-04-08 International Business Machines Corporation Shock mount for a device packaged in a portable cartridge
DE10134620A1 (de) * 2001-07-17 2003-02-06 Bosch Gmbh Robert Mehraxiales Inertialsensorsystem und Verfahren zu seiner Herstellung
US7040922B2 (en) * 2003-06-05 2006-05-09 Analog Devices, Inc. Multi-surface mounting member and electronic device
JP2005197493A (ja) 2004-01-08 2005-07-21 Ihi Aerospace Co Ltd 回路基板組立体
JP2006112856A (ja) 2004-10-13 2006-04-27 Seiko Epson Corp センサ素子基板、センサ素子基板の製造方法、センサ
JP4428210B2 (ja) 2004-11-22 2010-03-10 パナソニック電工株式会社 物理量センサの実装構造
US7778043B2 (en) * 2005-02-28 2010-08-17 Jason Rosenblatt Flush mounted assembly for housing an ambient air abnormal condition sensor module
JP2006337196A (ja) * 2005-06-02 2006-12-14 Kayaba Ind Co Ltd 多軸加速度検出装置
US7536909B2 (en) 2006-01-20 2009-05-26 Memsic, Inc. Three-dimensional multi-chips and tri-axial sensors and methods of manufacturing the same
JP2007285977A (ja) * 2006-04-19 2007-11-01 Fujitsu Media Device Kk 角速度センサ
JP2008109378A (ja) 2006-10-25 2008-05-08 Matsushita Electric Ind Co Ltd 光学デバイスモジュールとその製造方法および光学デバイスユニットとその製造方法
JP4714665B2 (ja) * 2006-11-20 2011-06-29 パナソニック株式会社 光学デバイスモジュール及びその製造方法
US7291023B1 (en) 2006-11-21 2007-11-06 Autoliv Asp, Inc. Electric vehicle motion sensor
FR2910129B1 (fr) * 2006-12-15 2009-07-10 Skf Ab Dispositif de palier a roulement instrumente
JP2008256570A (ja) * 2007-04-05 2008-10-23 Fujitsu Media Device Kk 角速度センサ
CN100476358C (zh) 2007-08-06 2009-04-08 北京航空航天大学 一种mems陀螺仪的精密安装基准体组件及其安装方法
WO2009028680A1 (ja) * 2007-08-30 2009-03-05 Nec Corporation 最適擬似ランダム系列決定方法、位置検出システム、位置検出方法、送信装置及び受信装置
US20090056446A1 (en) * 2007-09-05 2009-03-05 Cluff Charles A Multiple-axis sensor package and method of assembly
US7933128B2 (en) * 2007-10-10 2011-04-26 Epson Toyocom Corporation Electronic device, electronic module, and methods for manufacturing the same
US8100010B2 (en) * 2008-04-14 2012-01-24 Honeywell International Inc. Method and system for forming an electronic assembly having inertial sensors mounted thereto

Also Published As

Publication number Publication date
US20160109238A1 (en) 2016-04-21
US20130014581A1 (en) 2013-01-17
JP2013019745A (ja) 2013-01-31
US9250260B2 (en) 2016-02-02
CN102879597A (zh) 2013-01-16
CN102879597B (zh) 2016-03-09
US9541397B2 (en) 2017-01-10

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