CN102879597B - 传感器装置以及电子设备 - Google Patents

传感器装置以及电子设备 Download PDF

Info

Publication number
CN102879597B
CN102879597B CN201210237741.2A CN201210237741A CN102879597B CN 102879597 B CN102879597 B CN 102879597B CN 201210237741 A CN201210237741 A CN 201210237741A CN 102879597 B CN102879597 B CN 102879597B
Authority
CN
China
Prior art keywords
sensor device
substrate
rigid substrate
sensor
base
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
CN201210237741.2A
Other languages
English (en)
Chinese (zh)
Other versions
CN102879597A (zh
Inventor
佐久间正泰
小林祥宏
北村昇二郎
茅野岳人
今井信行
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Seiko Epson Corp
Original Assignee
Seiko Epson Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Seiko Epson Corp filed Critical Seiko Epson Corp
Publication of CN102879597A publication Critical patent/CN102879597A/zh
Application granted granted Critical
Publication of CN102879597B publication Critical patent/CN102879597B/zh
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01C—MEASURING DISTANCES, LEVELS OR BEARINGS; SURVEYING; NAVIGATION; GYROSCOPIC INSTRUMENTS; PHOTOGRAMMETRY OR VIDEOGRAMMETRY
    • G01C19/00—Gyroscopes; Turn-sensitive devices using vibrating masses; Turn-sensitive devices without moving masses; Measuring angular rate using gyroscopic effects
    • G01C19/56—Turn-sensitive devices using vibrating masses, e.g. vibratory angular rate sensors based on Coriolis forces
    • G01C19/5783—Mountings or housings not specific to any of the devices covered by groups G01C19/5607 - G01C19/5719
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01P—MEASURING LINEAR OR ANGULAR SPEED, ACCELERATION, DECELERATION, OR SHOCK; INDICATING PRESENCE, ABSENCE, OR DIRECTION, OF MOVEMENT
    • G01P1/00—Details of instruments
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01P—MEASURING LINEAR OR ANGULAR SPEED, ACCELERATION, DECELERATION, OR SHOCK; INDICATING PRESENCE, ABSENCE, OR DIRECTION, OF MOVEMENT
    • G01P15/00—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration
    • G01P15/02—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01P—MEASURING LINEAR OR ANGULAR SPEED, ACCELERATION, DECELERATION, OR SHOCK; INDICATING PRESENCE, ABSENCE, OR DIRECTION, OF MOVEMENT
    • G01P15/00—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration
    • G01P15/02—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses
    • G01P15/08—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values
    • G01P15/097—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values by vibratory elements
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01P—MEASURING LINEAR OR ANGULAR SPEED, ACCELERATION, DECELERATION, OR SHOCK; INDICATING PRESENCE, ABSENCE, OR DIRECTION, OF MOVEMENT
    • G01P15/00—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration
    • G01P15/18—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration in two or more dimensions

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Radar, Positioning & Navigation (AREA)
  • Remote Sensing (AREA)
  • Gyroscopes (AREA)
  • Mounting Of Printed Circuit Boards And The Like (AREA)
CN201210237741.2A 2011-07-11 2012-07-09 传感器装置以及电子设备 Active CN102879597B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2011152731A JP5845669B2 (ja) 2011-07-11 2011-07-11 センサーデバイスおよび電子機器
JP2011-152731 2011-07-11

Publications (2)

Publication Number Publication Date
CN102879597A CN102879597A (zh) 2013-01-16
CN102879597B true CN102879597B (zh) 2016-03-09

Family

ID=47480995

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201210237741.2A Active CN102879597B (zh) 2011-07-11 2012-07-09 传感器装置以及电子设备

Country Status (3)

Country Link
US (2) US9250260B2 (enExample)
JP (1) JP5845669B2 (enExample)
CN (1) CN102879597B (enExample)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9551730B2 (en) * 2014-07-02 2017-01-24 Merlin Technology, Inc. Mechanical shock resistant MEMS accelerometer arrangement, associated method, apparatus and system
CN106662446B (zh) 2014-07-16 2019-10-25 精工爱普生株式会社 传感器单元、电子设备以及移动体
JP6506034B2 (ja) * 2015-01-29 2019-04-24 京セラ株式会社 電子素子実装用基板および電子装置
JP2020101484A (ja) * 2018-12-25 2020-07-02 セイコーエプソン株式会社 慣性センサー、電子機器および移動体
US11340254B2 (en) * 2019-09-30 2022-05-24 Seiko Epson Corporation Inertial measurement unit having a sensor unit that is detachable from a substrate
JP7552377B2 (ja) * 2021-01-20 2024-09-18 セイコーエプソン株式会社 センサーモジュール
JPWO2022239347A1 (enExample) * 2021-05-12 2022-11-17
JP2024042245A (ja) * 2022-09-15 2024-03-28 セイコーエプソン株式会社 慣性計測装置

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7040922B2 (en) * 2003-06-05 2006-05-09 Analog Devices, Inc. Multi-surface mounting member and electronic device
CN101059346A (zh) * 2006-04-19 2007-10-24 富士通媒体部品株式会社 角速度传感器
CN101170105A (zh) * 2006-10-25 2008-04-30 松下电器产业株式会社 光学器件模块和其制造方法、及光学器件单元和其制造方法

Family Cites Families (26)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5241861A (en) * 1991-02-08 1993-09-07 Sundstrand Corporation Micromachined rate and acceleration sensor
JPH05340960A (ja) 1992-06-09 1993-12-24 Hitachi Ltd 多次元加速度センサ
JPH07306047A (ja) 1994-05-10 1995-11-21 Murata Mfg Co Ltd 多軸検出型振動ジャイロ
JP3780086B2 (ja) 1998-01-22 2006-05-31 Ｎｅｃトーキン株式会社 姿勢角度検出装置
JPH11289141A (ja) 1998-04-02 1999-10-19 Toshiba Corp 回路基板及びその製造方法
DE19858621C2 (de) 1998-12-18 2001-02-01 Autoflug Gmbh Verfahren zum Verbessern der Meßwerte eines inertialen Meßsystems
US6216537B1 (en) * 1999-03-31 2001-04-17 Medtronic, Inc. Accelerometer for implantable medical device
JP2001102746A (ja) 1999-09-30 2001-04-13 Sony Corp 回路装置とその製造方法
JP2002009228A (ja) 2000-06-20 2002-01-11 Seiko Epson Corp 半導体装置
US6545865B2 (en) * 2001-07-13 2003-04-08 International Business Machines Corporation Shock mount for a device packaged in a portable cartridge
DE10134620A1 (de) * 2001-07-17 2003-02-06 Bosch Gmbh Robert Mehraxiales Inertialsensorsystem und Verfahren zu seiner Herstellung
JP2005197493A (ja) 2004-01-08 2005-07-21 Ihi Aerospace Co Ltd 回路基板組立体
JP2006112856A (ja) 2004-10-13 2006-04-27 Seiko Epson Corp センサ素子基板、センサ素子基板の製造方法、センサ
JP4428210B2 (ja) 2004-11-22 2010-03-10 パナソニック電工株式会社 物理量センサの実装構造
US7778043B2 (en) * 2005-02-28 2010-08-17 Jason Rosenblatt Flush mounted assembly for housing an ambient air abnormal condition sensor module
JP2006337196A (ja) * 2005-06-02 2006-12-14 Kayaba Ind Co Ltd 多軸加速度検出装置
US7536909B2 (en) 2006-01-20 2009-05-26 Memsic, Inc. Three-dimensional multi-chips and tri-axial sensors and methods of manufacturing the same
JP4714665B2 (ja) * 2006-11-20 2011-06-29 パナソニック株式会社 光学デバイスモジュール及びその製造方法
US7291023B1 (en) 2006-11-21 2007-11-06 Autoliv Asp, Inc. Electric vehicle motion sensor
FR2910129B1 (fr) * 2006-12-15 2009-07-10 Skf Ab Dispositif de palier a roulement instrumente
JP2008256570A (ja) * 2007-04-05 2008-10-23 Fujitsu Media Device Kk 角速度センサ
CN100476358C (zh) 2007-08-06 2009-04-08 北京航空航天大学 一种mems陀螺仪的精密安装基准体组件及其安装方法
WO2009028680A1 (ja) * 2007-08-30 2009-03-05 Nec Corporation 最適擬似ランダム系列決定方法、位置検出システム、位置検出方法、送信装置及び受信装置
US20090056446A1 (en) * 2007-09-05 2009-03-05 Cluff Charles A Multiple-axis sensor package and method of assembly
US7933128B2 (en) * 2007-10-10 2011-04-26 Epson Toyocom Corporation Electronic device, electronic module, and methods for manufacturing the same
US8100010B2 (en) * 2008-04-14 2012-01-24 Honeywell International Inc. Method and system for forming an electronic assembly having inertial sensors mounted thereto

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7040922B2 (en) * 2003-06-05 2006-05-09 Analog Devices, Inc. Multi-surface mounting member and electronic device
CN101059346A (zh) * 2006-04-19 2007-10-24 富士通媒体部品株式会社 角速度传感器
CN101170105A (zh) * 2006-10-25 2008-04-30 松下电器产业株式会社 光学器件模块和其制造方法、及光学器件单元和其制造方法

Also Published As

Publication number Publication date
JP5845669B2 (ja) 2016-01-20
US20160109238A1 (en) 2016-04-21
US20130014581A1 (en) 2013-01-17
JP2013019745A (ja) 2013-01-31
US9250260B2 (en) 2016-02-02
CN102879597A (zh) 2013-01-16
US9541397B2 (en) 2017-01-10

Similar Documents

Publication Publication Date Title
US12436006B2 (en) Sensor device and electronic apparatus
CN102879597B (zh) 传感器装置以及电子设备
JP5821290B2 (ja) モジュールおよび電子機器
US9052220B2 (en) Maintaining member, module, and electronic apparatus
JP5935244B2 (ja) モジュールおよび電子機器
JP5919662B2 (ja) 電子デバイスおよび電子機器
JP6455567B2 (ja) センサーデバイスおよび電子機器
JP6806130B2 (ja) センサーデバイスおよび電子機器
JP6179579B2 (ja) センサーデバイスおよび電子機器
JP6179580B2 (ja) センサーデバイスおよび電子機器

Legal Events

Date Code Title Description
C06 Publication
PB01 Publication
C10 Entry into substantive examination
SE01 Entry into force of request for substantive examination
C14 Grant of patent or utility model
GR01 Patent grant