JP5840959B2 - 塗布方法及び装置 - Google Patents
塗布方法及び装置 Download PDFInfo
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- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D3/00—Pretreatment of surfaces to which liquids or other fluent materials are to be applied; After-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/50—Wavelength conversion elements
- H01L33/501—Wavelength conversion elements characterised by the materials, e.g. binder
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05B—SPRAYING APPARATUS; ATOMISING APPARATUS; NOZZLES
- B05B12/00—Arrangements for controlling delivery; Arrangements for controlling the spray area
- B05B12/08—Arrangements for controlling delivery; Arrangements for controlling the spray area responsive to condition of liquid or other fluent material to be discharged, of ambient medium or of target ; responsive to condition of spray devices or of supply means, e.g. pipes, pumps or their drive means
- B05B12/084—Arrangements for controlling delivery; Arrangements for controlling the spray area responsive to condition of liquid or other fluent material to be discharged, of ambient medium or of target ; responsive to condition of spray devices or of supply means, e.g. pipes, pumps or their drive means responsive to condition of liquid or other fluent material already sprayed on the target, e.g. coating thickness, weight or pattern
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05B—SPRAYING APPARATUS; ATOMISING APPARATUS; NOZZLES
- B05B16/00—Spray booths
- B05B16/90—Spray booths comprising conveying means for moving objects or other work to be sprayed in and out of the booth, e.g. through the booth
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- B—PERFORMING OPERATIONS; TRANSPORTING
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- B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C11/00—Component parts, details or accessories not specifically provided for in groups B05C1/00 - B05C9/00
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
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- B05C11/1015—Means for controlling supply, i.e. flow or pressure, of liquid or other fluent material to the applying apparatus, e.g. valves responsive to a conditions of ambient medium or target, e.g. humidity, temperature ; responsive to position or movement of the coating head relative to the target
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- B—PERFORMING OPERATIONS; TRANSPORTING
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- B05C5/02—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work the liquid or other fluent material being discharged through an outlet orifice by pressure, e.g. from an outlet device in contact or almost in contact, with the work
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- B—PERFORMING OPERATIONS; TRANSPORTING
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- B05C9/10—Apparatus or plant for applying liquid or other fluent material to surfaces by means not covered by any preceding group, or in which the means of applying the liquid or other fluent material is not important for applying liquid or other fluent material and performing an auxiliary operation the auxiliary operation being performed before the application
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- B—PERFORMING OPERATIONS; TRANSPORTING
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- H—ELECTRICITY
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
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- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/50—Wavelength conversion elements
- H01L33/507—Wavelength conversion elements the elements being in intimate contact with parts other than the semiconductor body or integrated with parts other than the semiconductor body
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Application Of Or Painting With Fluid Materials (AREA)
- Coating Apparatus (AREA)
- Led Device Packages (AREA)
- Details Or Accessories Of Spraying Plant Or Apparatus (AREA)
Description
重量測定物体4は予め測定してあるので例えば外部通信できて最少表示が0.1ミリグラムのA&D社の計量器AD−4212B−101と市販の工業用計算機やソフト等を使用してシーケンサーで簡単に処理し塗布重量の表示なり、合否の信号を自動的に出力できる。
被塗物載置ユニット6に被塗物(LED,LED部材等)3がセットされ図示されない第2の駆動源と第2の駆動軸11により移動する。塗布器5はブラケット17に固定されブラケット17は第3の駆動源15と第3の駆動源15の駆動軸16に連結し上下移動する。更に第3の駆動軸15は第1の駆動源13により第2の駆動軸11と直交して動く第1の駆動軸14に固定されるので塗布器5は直交移動でき被塗物載置ユニット6にセットされた被塗物3はピッチ送りすることができるので各駆動軸のストロークの範囲まで均一に塗布できる。勿論のこと前記の“横塗り”に対し塗布器をピッチ移動させ被塗物載置ユニットを連続移動させて塗布する“縦塗り”もできる。又それらを交互に繰り返すこともできる。塗布器5で被塗物11に塗材が一層塗布され、又はより均一に塗布する為、層ごとに位相をずらし(オフセット)しながら複数層塗布し、乾燥ゾーン等の次工程へ手動又は自動で移動する。
塗布時間の長さは限定しないが、塗材のコストを考えたらできるだけ短時間で少量塗布が好ましい。その点からも最少測定は0.1ミリグラムが測定できることが好ましい。その場合少しの風の流れなどの外乱で影響を受けるので、二重に例えば一般的電子天秤に備わっているボックスも使用するなど特に測定時の風の流れは完全に遮断すべきである。
2 塗布重量測定室
3 被塗物
4 重量測定物体
5 塗布器
6 被塗物載置ユニット
7 ハンドリングブラケット
8 昇降装置
9 開閉装置
10 シャッター
11 第二駆動軸
12 ベルト
13 第一駆動源
14 第一駆動軸
15 第三駆動軸
16 第三駆動源
17 ブラケット
18 排気部
19 開口部
20 塗材
30 重量測定器
31 計量皿
40 スタンド
Claims (15)
- 気体の流れがある場所で被塗物に塗布器で塗材を塗布する方法であって、前記被塗物への塗布前に塗布重量測定用物体に前記塗布器で前記塗材を塗布する第一の工程と、塗布された前記塗布重量測定用物体を、気体の流れの無いまたは重量測定に影響しない気体の流れの雰囲気下の重量測定室まで自動的に移動し重量測定する第二の工程と、予め決められた塗布重量範囲の時、又は塗布重量範囲外の時は塗布条件を補正した後、前記被塗物へ前記塗布器で塗布を行う第三の工程とからなることを特徴とする塗布方法。
- 前記被塗物への塗布終了後、再度自動的に塗布重量測定を行い塗布量を確認した後、乾燥装置へ移動する第四の工程を有することを特徴とする請求項1に記載の塗布方法。
- 少なくとも排気ラインに接続され、気体の流れがある塗布ブース内で前記塗布重量測定用物体への塗布が行われ、該塗布重量測定用物体への塗布ポジションと前記塗布重量測定室が隣接していることを特徴とする請求項1または2に記載の塗布方法。
- 前記塗布器と前記被塗物を相対移動させ、前記塗布器がパルス的に塗布できるディスペンサー、インクジェット、微粒子発生塗布装置の少なくとも一つから選択されることを特徴とする請求項1乃至3の何れか一項に記載の塗布方法。
- 前記塗布条件補正は、塗材圧力、前記塗布器と被塗物の相対スピード、塗布ピッチ、パルスサイクル、ワンショット塗布時間、流路面積の少なくとも一つを選択することを特徴とする請求項1乃至4の何れか一項に記載の塗布方法。
- 前記被塗物がLED又はLED部材であって、前記塗材が少なくとも蛍光体とバインダーからなるスラリーであることを特徴とする請求項1乃至5の何れか一項に記載の塗布方法。
- 前記塗布器が微粒子発生装置であって、前記塗布重量測定物体へ前記スラリーを塗布し前記塗布重量測定室で塗布重量測定を行った後、前記微粒子発生塗布装置とLED又はLED部材は相対的にピッチ移動し、少なくとも一層塗布するごとにピッチの位相をずらして塗布することを特徴とする請求項6に記載の塗布方法。
- 前記微粒子発生装置がエアスプレイ装置であって、該エアスプレイ装置の先端噴出部とLED又はLED部材とは5乃至80ミリメートルの距離に調整可能とし、かつ2乃至15ミリメートルのピッチで相対移動し、一層塗布するごとに0.1乃至7.5ミリメートル位相をずらしながら塗布することを特徴とする請求項7に記載の塗布方法。
- 前記スラリーは重量比で前記バインダーより前記蛍光体の比率を大きくし、かつ溶剤を含むスラリーであって、粘度が1乃至100mPa・s(1乃至100センチポイズ)の範囲であることを特徴とする請求項6乃至8の何れか一項に記載の塗布方法。
- 前記スラリーは循環装置により循環させ、又は二つ以上の小型容器間で移動させて蛍光体の沈降を防止することを特徴とする請求項9に記載の塗布方法。
- 前記塗布重量測定用物体及び被塗物へ1乃至50ヘルツのサイクルでパルス的に塗布することを特徴とする請求項1乃至10の何れか一項に記載の塗布方法。
- 少なくとも排気ラインに接続された塗布ブース内で被塗物に塗材を塗布器で塗布する装置であって、前記被塗物への塗布前に前記塗布ブース内で塗布重量測定用物体に前記塗材を前記塗布器で塗布し、次いで塗材が塗布された前記塗布量測定用物体を塗布重量測定室まで自動的に移動し重量を測定し、さらに予め決められた範囲の塗布重量の時、被塗物へ塗布を開始することを特徴とする塗布装置。
- 前記塗布ブースと前記塗布重量測定室間の隔壁の開口には自動開閉できるシャッターが設置されており、該シャッターは自動的に塗材の塗布時及び重量計測時は閉に、前記塗布重量測定用物体の移動時には開になることを特徴とする請求項12に記載の塗布装置。
- 前記塗布重量測定器の上部の計量部には、該計量部の一部として細く軽いスタンドを設置したことを特徴とする請求項12または13に記載の塗布装置。
- 前記塗材が蛍光体とシリコーン溶液からなるスラリーであって、前記塗布器がパルス的にスプレイするエアスプレイ装置であって、前記被塗物はLED又はLED部材であって、前記エアスプレイ装置と前記LED又はLED部材は相対的にピッチ移動して塗布し、一層塗布するごとにオフセットさせて複数層塗布することを特徴とする請求項12乃至14の何れか一項に記載の塗布装置。
Priority Applications (6)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2012006062A JP5840959B2 (ja) | 2012-01-16 | 2012-01-16 | 塗布方法及び装置 |
EP13738318.8A EP2805777B1 (en) | 2012-01-16 | 2013-01-08 | Coating method and device |
US14/377,855 US9608174B2 (en) | 2012-01-16 | 2013-01-08 | Coating method and device |
PCT/JP2013/050125 WO2013108669A1 (ja) | 2012-01-16 | 2013-01-08 | 塗布方法及び装置 |
KR1020147022914A KR102080357B1 (ko) | 2012-01-16 | 2013-01-08 | 도포 방법 및 장치 |
CN201380014347.5A CN104169010B (zh) | 2012-01-16 | 2013-01-08 | 涂敷方法以及装置 |
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JP2012006062A JP5840959B2 (ja) | 2012-01-16 | 2012-01-16 | 塗布方法及び装置 |
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JP5840959B2 true JP5840959B2 (ja) | 2016-01-06 |
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US (1) | US9608174B2 (ja) |
EP (1) | EP2805777B1 (ja) |
JP (1) | JP5840959B2 (ja) |
KR (1) | KR102080357B1 (ja) |
CN (1) | CN104169010B (ja) |
WO (1) | WO2013108669A1 (ja) |
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DE112014002056B4 (de) * | 2013-04-20 | 2023-06-01 | Mtek-Smart Corp. | Aufbring- oder Abgebeverfahren für Pulver oder körniges Material |
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JP6481154B2 (ja) | 2014-10-18 | 2019-03-13 | エムテックスマート株式会社 | 粉粒体の塗布方法 |
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