丄妁2968 六、發明說明： 【發明所屬之技術領域】 本發明是有關於一種喷塗螢光材料之方法’且特別是 有關於一種噴塗螢光材料至一發光元件之方法。 【先前技術】 發光二極體（Light Emitted Diode，LED )是一種半導 ，元件’在施加正向電壓時，可藉由電致發光效應而發出 單色、不連續的光線。隨著半導體材料之化學組成不同， 發光二極體可發出紫外光、可見光或紅外光等不同波長範 圍之光線。 早期發光二極體多運用於指示燈、顯示板等顯示裝 m _ :隨著半導體技術的進展，目前已發展出多種高亮度、 问°°質的發光二極體裝置。同時，白光發光二極體裝置也 被廣泛地運用於顯示 、照明以及其他相關領域中。 相較於傳統光源，白光發光二極體裝置具有低耗能、 政率向、母命長、不易破損等優點，因此白光發光二極體 裝置被認為是21世紀的新型光源，可望取代如白熾燈和榮 光燈等傳統光源，而成為主要的顯示/照明裝置。 在製造白光LED時’必須搭配放射波長不同的螢光材 料’藉由混合這些不同波段的光線而達到混成白光的效 果。舉例來說’欲得到白光LE〇，可利用藍光LED搭配黃 光螢光粉或者是搭配紅光螢光粉與綠光螢光粉；若是採用 紫外線LED，則可搭配藍綠紅三色螢光粉。 在習知白光LED製程中’通常是將所需螢光材料和高 3 1362968 分子黏著劑混合製成榮光膠料，而後以點膠管將營 注入杯狀led晶片座中。然而，螢光粉在螢光腰料中戶，料 比重通常較高，使得螢光粉於膠料中之分布不易^制斤佔 導致整顆LED發出的光線色溫和/或亮度不岣。上述門而 在使用多種螢光粉的LED裝置中尤顯嚴重，這是因為 種類的螢光粉密度不同，因此螢光膠料中的螢光粉會出同 分層的現象。此外，進行點膠法時，同一時間僅能處理， 顆LED晶片，無法進行多顆或大面積的點膠，連帶使: 率低落。 屋丄妁 2968 VI. Description of the Invention: [Technical Field] The present invention relates to a method of spraying a fluorescent material and in particular to a method of spraying a fluorescent material to a light-emitting element. [Prior Art] A Light Emitted Diode (LED) is a semi-conducting device that emits a monochromatic, discontinuous light by an electroluminescence effect when a forward voltage is applied. As the chemical composition of the semiconductor material is different, the light emitting diode emits light of different wavelength ranges such as ultraviolet light, visible light or infrared light. Early light-emitting diodes are used for display lights, display panels, etc. m _ : With the advancement of semiconductor technology, a variety of high-brightness, high-quality light-emitting diode devices have been developed. At the same time, white light emitting diode devices are also widely used in display, lighting, and other related fields. Compared with the traditional light source, the white light emitting diode device has the advantages of low energy consumption, political rate, long life, and easy damage. Therefore, the white light emitting diode device is considered to be a new light source in the 21st century, and is expected to replace Traditional light sources such as incandescent lamps and glory lamps have become the main display/illumination devices. In the manufacture of white LEDs, it is necessary to match the phosphor materials of different wavelengths to achieve the effect of mixing white light by mixing the light of these different wavelength bands. For example, if you want to get white light LE〇, you can use blue LED with yellow fluorescent powder or red fluorescent powder and green fluorescent powder; if you use ultraviolet LED, you can use blue, green and red fluorescent powder. In the conventional white LED process, the luminescent material is usually mixed with the high-gloss 3 1362968 molecular adhesive to form a glory compound, and then the battalion is injected into the cup-shaped led wafer holder. However, the phosphor powder is usually used in the fluorescent waist material, so that the proportion of the phosphor powder is generally high, so that the distribution of the phosphor powder in the rubber compound is not easy to make the color temperature and/or brightness of the light emitted by the entire LED. The above-mentioned doors are particularly serious in LED devices using a variety of phosphors because the phosphor powders of the various types have different densities, so that the phosphors in the phosphors are stratified. In addition, when the dispensing method is performed, only one LED wafer can be processed at the same time, and it is impossible to perform multiple or large-area dispensing, and the rate is low. house
因此，相關領域虽需提出—種有效率的螢光材料 方式’不但可提升LED裝置發光關勻度，亦能提高 裝置的產率。 【發明内容】 本發明之一態樣是在提供喷塗螢光材料之方法，此一 喷塗方法可將螢光材料快速且大面積地塗佈於―發光元件 上，而形成均勻的螢光粉薄層。 依據本發明一具體實施例，上述噴塗方法至少包含下 述步驟。對位於至少二個相連通之容器内的螢光粉㈣施 加壓力，藉由調節施加至容器内的壓力，而使得上述容器 間存在一壓力差，進而可控制螢光粉漿料於該些容器間的 流動。透過噴塗裝置將螢光粉漿料霧化並噴塗至發光元件 上。 在參閱隨後描述之實施方式後，本發明所屬技術領域 中具有通常知識者當可輕易瞭解本發明之基本精神及其他 4 1362968 發明目的，以及本發明所採用之技術手段與較佳實施態樣。 【實施方式】 本發明之一態樣是在提供喷塗螢光材料之方法，舉例 來說，此一喷塗方法可將螢先材料快速且大面積地塗佈於 一發光元件如發光二極體之上，而形成均勻的螢光粉薄 層。具體而言’利用上述喷塗方法可將螢光粉漿料直接塗 佈於單數或複數顆發光二極體的表面上表面與側壁上。 以下參照第1圖，進一步描述本發明一具體實施例提 出之噴塗方法。第1圖為一種喷塗設備的概要圖式，此一 喷塗設備可用以進行根據本發明具體實施例的螢光材料喷 塗方法。 第1圖所示的噴塗設備100是一種雙儲存槽喷塗設 備，具有相連通的第一儲存槽102與第二儲存槽122，第 一與第二儲存槽102與122透過連接管104與124相連通。 喷塗設備100還包含了喷塗裝置110,其包含腔室112、喷 • 嘴114與閥針116。第一與第二儲存槽102與122分別透過 供氣管106與126與提供壓力的氣源（未繪示）連接；而 .噴塗裝置110則透過供氣管118與120與提供壓力的氣源 (未繪示）連接，上述各供氣管所連接的氣源可以是相同 或不同的氣源。本發明所屬技術領域中具有通常知識者當 可理解，雖然此處繪示的是雙儲存槽喷塗設備，本發明實 施例提出之方法亦可運用具有更多儲存槽之噴塗設備中。 如第1圖所示，螢光粉漿料108填充於相連通的第一 與第二儲存槽102與122以及連接管104與124内。根據 5 1362968 本發明具體實補之方法，刊帛氣賴由供氣管1〇6與 126分別施加壓力至第一與第二儲存槽1〇2與122 ;此時， 上述氣源可作為流速控制裝置。應施加的壓力大小可取決 於螢光粉I料1G8本身性質（如黏度或榮光粉體重量濃 度）、連接管104與124之直徑、所需流速、喷塗壓力等因 素。一般而言，適當的壓力大小約為〇〇〇1 Mpa至約1〇 MPa。更明確地說，適當的壓力大小可為約〇刪、〇〇1、 (U、1、2、3、4、5、6、7、8、9 或 10 MPa。 作為流速控制裝置的氣源可以利用一種時序開關加壓 裝置或一種連續加壓裝置來產生適當的壓力。在利用時序 開關加壓裝置的情形中’適當的開啟頻率為每秒約U⑻ 次，例如每秒約卜 5、1〇、20、3〇、4〇、5〇、1〇〇、12〇、 150 或 200 次。 可進-步調節施加至第一與第二儲存槽1〇2與122内 的壓力，而使得上述儲存槽間存在—壓力差，進而控制營 光粉漿料於該些容器間流動。更詳細地說，施加至第一儲 存槽102内的壓力為P!，而施加至第二儲存槽122内的壓 力為P2 ;若匕大於P2時，則螢光粉漿料1〇8會從第一儲 存槽102經由連接管1〇4朝向第二儲存槽122的方向移 動；反之，螢光粉漿料108會從第二儲存槽122經由連接 管124朝向第一儲存槽102的方向移動；而若匕與^時大 致上相等（即’壓力差為零）時’螢光粉漿料1〇8實質上 不會流動。此外，當上述壓力差的差值越大時，螢光粉漿 料108的流速也就越快’因此亦可藉由調整壓力差來控制 流速；根據本發明具體實施例，適當的螢光粉漿料流速約 1362968 為1-100 imn/sec。更詳細地說，螢光粉漿料的流速可為約 l、2、5、10、20、30、4〇、5〇、6〇、7〇、8〇、9〇5ti〇〇mm/sec。 μ -般而言，可利用人I或自動化的方式來進行此一調 郎步驟。例如，刊科㈣來設定氣源開始與結束供應 氣體產生壓力㈣點。或者是，可利用軟體程式透過電腦 等運算裝置來控制氣源開始與結束供應氣體產生壓力的時 點。此外’可預先決定該儲存槽内可接受的上限液位與下Therefore, in the related art, it is necessary to propose an efficient fluorescent material method, which not only improves the illumination level of the LED device, but also improves the yield of the device. SUMMARY OF THE INVENTION One aspect of the present invention provides a method of spraying a fluorescent material, which can apply a fluorescent material to a "light-emitting element" quickly and in a large area to form uniform fluorescent light. Thin layer of powder. According to a specific embodiment of the invention, the above spraying method comprises at least the following steps. Applying pressure to the phosphor powder (four) in at least two communicating containers, by adjusting the pressure applied to the container, a pressure difference exists between the containers, thereby controlling the phosphor powder slurry in the containers The flow between. The phosphor powder slurry is atomized and sprayed onto the light-emitting element through a spraying device. The basic spirit of the present invention and other objects of the invention, as well as the technical means and preferred embodiments of the present invention, will be readily apparent to those skilled in the art of the invention. [Embodiment] One aspect of the present invention provides a method for spraying a fluorescent material. For example, the spraying method can rapidly and widely apply a fluorescent material to a light-emitting element such as a light-emitting diode. Above the body, a uniform thin layer of phosphor powder is formed. Specifically, the phosphor powder slurry can be directly coated on the upper surface and the side walls of the singular or plural light-emitting diodes by the above-described spraying method. Hereinafter, a spraying method proposed by an embodiment of the present invention will be further described with reference to Fig. 1. Figure 1 is a schematic illustration of a spray apparatus that can be used to perform a phosphor material spray process in accordance with an embodiment of the present invention. The spraying device 100 shown in FIG. 1 is a dual storage tank spraying device having a first storage tank 102 and a second storage tank 122 connected thereto, and the first and second storage tanks 102 and 122 pass through the connecting tubes 104 and 124. Connected. Spraying apparatus 100 also includes a spray device 110 that includes a chamber 112, a spray nozzle 114, and a valve needle 116. The first and second storage tanks 102 and 122 are respectively connected to the gas source (not shown) for supplying pressure through the gas supply pipes 106 and 126; and the spraying device 110 passes through the gas supply pipes 118 and 120 and the gas source for supplying pressure (not Connected, the gas sources connected to the respective gas supply pipes may be the same or different gas sources. It will be understood by those of ordinary skill in the art that although a dual storage tank spray apparatus is illustrated herein, the method of the presently described embodiments can also be utilized in spray equipment having more storage tanks. As shown in Fig. 1, the phosphor paste 108 is filled in the first and second storage tanks 102 and 122 and the connecting tubes 104 and 124 which are in communication. According to the method of the present invention, according to the method of the present invention, the gas supply is applied to the first and second storage tanks 1〇2 and 122 by the gas supply pipes 1〇6 and 126 respectively; at this time, the gas source can be controlled as a flow rate. Device. The amount of pressure to be applied may depend on the nature of the phosphor powder I 1G8 itself (e.g., viscosity or glory powder weight concentration), the diameter of the connecting tubes 104 and 124, the required flow rate, the spray pressure, and the like. In general, a suitable pressure range is from about 1 Mpa to about 1 MPa. More specifically, the appropriate pressure can be about 〇, 〇〇 1, (U, 1, 2, 3, 4, 5, 6, 7, 8, 9, or 10 MPa. As a source of flow rate control device A timing switch pressurizing device or a continuous pressurizing device can be utilized to generate the appropriate pressure. In the case of a timing switch pressurizing device, the 'appropriate turn-on frequency is about U (8) times per second, for example, about 5, 1 per second. 〇, 20, 3〇, 4〇, 5〇, 1〇〇, 12〇, 150 or 200 times. The pressure applied to the first and second storage tanks 1〇2 and 122 can be adjusted step by step, thereby making There is a pressure difference between the storage tanks, thereby controlling the flow of the camping powder slurry between the containers. In more detail, the pressure applied to the first storage tank 102 is P!, and is applied to the second storage tank 122. The pressure inside is P2; if 匕 is greater than P2, the phosphor powder slurry 1〇8 will move from the first storage tank 102 through the connecting pipe 1〇4 toward the second storage tank 122; otherwise, the fluorescent slurry The material 108 will move from the second storage tank 122 through the connecting pipe 124 toward the first storage tank 102; When the pressure is equal (ie, the pressure difference is zero), the phosphor powder slurry 1〇8 does not substantially flow. Further, when the difference in the above pressure difference is larger, the flow rate of the phosphor powder slurry 108 is faster. 'Therefore, the flow rate can also be controlled by adjusting the pressure difference; in accordance with an embodiment of the invention, the appropriate phosphor slurry flow rate is about 1 260 imn/sec at about 1362 968. More specifically, the flow rate of the phosphor powder slurry It can be about 1, 2, 5, 10, 20, 30, 4, 5, 6, 7, 8 and 9 〇 5 ti 〇〇 mm / sec. μ - Generally, human I or Automated way to carry out this step of arranging. For example, the journal (4) sets the pressure at which the gas source starts and ends the supply gas (4). Alternatively, the software program can be used to control the start and end of the gas supply through a computing device such as a computer. The time at which the gas generates pressure. In addition, 'the upper limit liquid level acceptable in the storage tank can be determined in advance
限液位，並根據上述上限液位與下限液位而適時地調節螢 光粉漿料的流向和/或流速。 根據本發明具體實施例提出之方法，可透過喷塗裝置 110將螢光粉漿料108霧化並喷塗至發光元件（未繪示） 上。根據第1圖所示的裝置，可利用氣源經由供氣管u8 與120分別施加一霧化壓力1>3以及一渦流壓力ρ4至喷嘴 114内，其中霧化壓力可讓螢光粉漿料1〇8和氣體混合而 產生氣霧化的喷霧；而渦流壓力可使得氣霧化的螢光粉漿 料形成一向下喷射的渦流；從而可將氣霧化的螢光粉漿料 喷塗至發光元件上。 吏具體而言，可利用二流體氣霧化噴嘴來實踐上述霧 化與噴塗步驟。當螢光粉漿料通過閥針116而進入二流體 氣霧化喷嘴中時，其能夠形成氣霧化的喷霧並利用渦流壓 力將霧化的螢光粉漿料喷塗於發光元件的上表面與二侧 壁，亦即可達成所謂的典形塗佈（conformal coating)。 應施加的壓力大小巧"隨著於螢光粉策料108本身性質 (如黏度）、喷塗速率、噴塗面積、漿料氣霧化程度以及渦 流強度等因素而加以調整。一般而言，適當的壓力大小約 7 1362968 至約20MPa。舉例來說，上述壓力大小可為 杯明且㈣ο·1、0.5、卜5、10、15或20斷。根據 發月具體實施例’ WP4的數值可以相同或不同。 =卜’單位時間中螢光漿料的喷塗量會受到多種條件 的衫響，上述條件可能包括但不限於，施加至 與 κ)2與122内的壓力和/或壓力差 '闕針ιΐ6開啟: 间度和/或頻率以及渦流壓力等。The liquid level is limited, and the flow direction and/or flow rate of the phosphor powder slurry is adjusted in time according to the above upper limit liquid level and lower limit liquid level. According to the method of the specific embodiment of the present invention, the phosphor powder slurry 108 can be atomized and sprayed onto the light-emitting element (not shown) through the spraying device 110. According to the apparatus shown in Fig. 1, an atomization pressure 1 > 3 and a vortex pressure ρ4 can be respectively applied to the nozzle 114 via the gas supply pipes u8 and 120, wherein the atomization pressure allows the phosphor powder slurry 1 to be used. The 〇8 and the gas are mixed to produce a gas atomized spray; and the vortex pressure causes the aerosolized phosphor powder slurry to form a downward jet vortex; thereby spraying the aerosolized phosphor powder slurry to On the light-emitting element. Specifically, the above-described atomization and spraying steps can be practiced using a two-fluid gas atomizing nozzle. When the phosphor powder slurry enters the two-fluid gas atomizing nozzle through the valve needle 116, it can form an aerosolized spray and spray the atomized phosphor powder slurry onto the light-emitting element by using vortex pressure. The so-called conformal coating can also be achieved by the surface and the two side walls. The amount of pressure that should be applied is adjusted according to factors such as the nature of the phosphor powder 108 (such as viscosity), spray rate, spray area, degree of slurry atomization, and eddy current strength. In general, a suitable pressure is from about 7 1362968 to about 20 MPa. For example, the magnitude of the above pressure may be a cup and (4) ο, 1, 0.5, 5, 10, 15 or 20 breaks. The values of WP4 may be the same or different according to the specific embodiment of the month. The amount of phosphor paste sprayed per unit time will be affected by a variety of conditions. These conditions may include, but are not limited to, pressure and/or pressure differentials applied to κ) 2 and 122. On: Interval and / or frequency and eddy current pressure.
當嘴塗裝置110未進行喷塗時，閥針116會頂住聚料 入口 128,而使得螢光粉漿料108不會從連接管1〇4或124 進入漿料入口 128，然而螢光粉漿料1〇8仍可在第一與 二儲存槽102、122間循環流動。當喷塗裝置11〇要進^喷 塗時，可提高閥針116使其不再頂住漿料入口 128，此時 螢光粉漿料108即可由連接管104或124進入漿料入口 128，進而透過喷嘴114進行喷塗。 7 可利用各種習知的手段，來控制閥針116的開啟與關 閉；舉例來說，可利用一加壓裝置來改變施加於閥針ιΐ6 上的壓力，藉以控制閥針116開啟的高度與頻率；或者是， 了利用電磁閥來控制閥針116的開啟高度與頻率。此外， 在較佳的情形中’亦可利用脈衝控制裝置來控制閥針116 的開啟與關閉’且適當的脈衝頻率為每秒約卜5、1〇、2〇、 3〇、40、50次。當然，亦可使用其他適當的開啟構件，來 控制閥針116的開啟高度與頻率，進而控制螢光粉漿料的 噴塗逮度與喷塗量。 根據本發明具體實施例提出的方法，當螢光粉漿料1〇8 在儲存槽102、122與連接管1〇4、124間流動時，可同時 8 1362968 進行噴塗步驟。另一大 θ ^ 万面’當螢光粉漿料108並未出現過 1沈澱且品質良好的愔犯 t 1ΛΛ ιλλ匱形下，亦可先停止螢光粉漿料108 在儲存槽102、122與读4 ^ '連接營104、124間的流動’然後再 進仃噴塗步驟。 此外 在進行喷塗:發^嘴塗步驟時’可依需求另行加熱正 n 件’以使得在喷塗步驟中可同時乾燥 、、於發光兀件上之螢光粉漿料，避免因流量過大所造成When the nozzle coating device 110 is not sprayed, the valve needle 116 will bear against the material inlet 128 such that the phosphor powder slurry 108 does not enter the slurry inlet 128 from the connecting tube 1〇4 or 124, however, the fluorescent light The powder slurry 1〇8 can still circulate between the first and second storage tanks 102, 122. When the spraying device 11 is ready to be sprayed, the valve needle 116 can be raised to stop against the slurry inlet 128, and the phosphor powder slurry 108 can enter the slurry inlet 128 from the connecting pipe 104 or 124. And spraying through the nozzle 114. 7 Various conventional means can be utilized to control the opening and closing of the valve needle 116; for example, a pressurizing device can be used to vary the pressure applied to the valve needle ι6 to control the height and frequency at which the valve needle 116 is opened. Or, a solenoid valve is used to control the opening height and frequency of the valve needle 116. In addition, in the preferred case, 'pulse control means can also be used to control the opening and closing of the valve needle 116' and the appropriate pulse frequency is about 5, 1 〇, 2 〇, 3 〇, 40, 50 times per second. . Of course, other suitable opening members can be used to control the opening height and frequency of the valve needle 116 to control the spray catch and spray amount of the phosphor powder slurry. According to the method proposed by the embodiment of the present invention, when the phosphor powder slurry 1〇8 flows between the storage tanks 102, 122 and the connecting tubes 1〇4, 124, the spraying step can be performed simultaneously at 8 1362968. Another large θ ^ 10,000 surface 'When the phosphor powder slurry 108 does not appear to have a precipitate and the quality is good, the luminescent powder slurry 108 may be stopped first in the storage tanks 102, 122. And read 4 ^ 'connect the flow between the camps 104, 124' and then proceed to the spray step. In addition, when spraying: the nozzle coating step, 'the other n pieces can be heated separately according to the requirements', so that the phosphor powder slurry can be dried at the same time in the spraying step, and the flow rate is too large. caused
如此-來，可進-步提升發光元件 上營光私聚料分布的均句性。 根據本發明具體實施例提出之方法，可針對單數或複 數顆發光二極體表面進行嘴塗，而於上述發光二極體的上 表面與二側壁上形成—均勻的螢光粉薄層。 可重複進行上述噴塗步驟，直到發光元件上形成的螢 光材料厚度或重篁達到所需程度為止；舉例來說，可重複 喷塗直到喷塗於發光元件上的螢光粉漿料之厚度約為31〇 μιη為止。 再者’當進行多次喷塗時’可採用不同配方的骛光粉 聚料來進行喷塗，更詳細地說’在第一次喷塗時可以使用 放射波長主要為紅光波段的螢光粉體，而在第二次嘴塗時 就可以採用放射波長主要為綠光波段的螢光粉體。以上所 述僅為例示，本發明所屬技術領域中具有通常知識者當可 依需求調整所使用的螢光粉體種類。 根據先前技術以點膠法來施覆螢光材料時，需將螢光 材料和高分子黏著劑混合製成螢光膠料；然而此種肇光膠 料無法用於本發明具體實施例提出之噴塗方法。因此，本 9 1362968 發明亦提出了適用於上述噴塗方法的螢光粉漿料組成。 根據本發明具體實施例，上述螢光粉漿料組成至少包 含螢光粉體、聚合物以及溶劑，且螢光粉漿料的黏度約為 0.1-200 cps。具體而言，適用於上述方法之螢光粉漿料的 濃度可為約 0.1、0.5、1、2、5、1〇、20、50、80、100、 120、150、180 或 200 cps。 根據本發明具體實施例’可利用任何適當的螢光粉 體’只要其能夠受到LED發出的光線激發而發射出具備所 φ 想發射波長的光線即可。具體而言，當利用藍光LED晶片 或紫外光LED晶片來製備白光LED裝置時，所用的螢光 粉體之可激發波長約為250-500 nm ;而發射波長約為 500-600 nm。此外’上述螢光粉體的粒徑大小約為3-40 /xm。 舉例來說’適當的螢光粉體可以是鋁氧化物螢光粉（如 纪鋁石榴石化物（Y3Al5〇12:Ce)螢光粉或錢鋁石榴石化物 (Tb^ALOeCe )螢光粉）、石夕氧化物螢光粉（如锰摻雜梦 酸鋅化物（Μη-doped Zn2Si04)螢光粉）、氮化物螢光粉（如 φ (Ca,Sr，Ba)xSiyNz : Eu螢光粉）或氮氧化物螢光粉（如銪活 化氮氧化物螢光粉）。 製備螢光粉漿料組成時，可用的聚合物可以是矽酮基 聚合物（silicone base )、矽氧烷基聚合物（sil〇xane base )、 溶凝膠·混聚物（sol-gel hybrid base)、環氧基聚合物、梦環 氧混聚物（silicone-epoxy hybrid or silicon-epoxy hybrid， 請確認）或上述之任意組合。 可以根據所需之螢光粉體量或所需之螢光粉漿料黏度 等特性，而改變螢光粉漿料組成份的配比，其中螢光粉體 1362968 與聚合物的重量比約為10 : 1至1 : 10間，例如約10 : 1、 10 : 1.5、10 : 2、10 : 3、10 : 5、10 : 8、1 :卜 1 : 1.5、1 : 2、1 : 4、1 : 5、1 : 8或1 : 10。此外，螢光粉體與聚合物 佔整個螢光粉漿料之重量百分比約為5-95%，更詳細地 說，上述重量百分比可為約5%、10%、15%、20%、30%、 40%、50%、60%、70%、80%、90%或 95%。聚合物佔整 個螢光粉漿料之重量百分比約為5-70%，如約5%、10%、 15%、20%、30%、40%、50%、60%或 70%’且較佳為 20-40%。 螢光粉漿料組成中所含的溶劑可以是C3酮類（如丙 酮）或C4酮類（如曱乙酮）、具有至少一鹵素取代基的C1_C4 直鏈烷類、C5-C7直鏈烷類（如正庚烷）、C5-C6環烷類、 C1-C4直鏈烷醇類、C2-C4醚類、醋酸乙酯、苯類（如曱 本、 一曱本或'一甲本的結構異構物）、乙猜、四氫σ夫喃、石 油鍵、含氟溶劑、石夕酮溶劑或上述之任意組合。 根據本發明具體實施例，更可依需求於螢光粉漿料組 成中加入添加劑。一般而言，添加劑可幫助螢光粉漿料懸 浮及穩定或增加其發光焭度。舉例來說，上述添加劑可以 是增稍劑、抗沉劑、增亮劑或平坦劑。 下文提出一製備實例，其係根據上述本發明具體實施 例提出的螢光粉漿料組成來製備螢光粉漿料，並根據上述 喷塗方法將該螢光粉漿料喷塗於一藍光LED晶片（Cree， 型號：BlueC460-EZ1000;啟動電壓 2 9_3 8V，35〇mA;晶 片尺寸 LxWxH = 980x980x100 微米）上。 製備實例1 1362968In this way, it is possible to further improve the uniformity of the distribution of the private components of the light-emitting elements on the light-emitting elements. According to the method of the embodiment of the present invention, the surface of the singular or plural light-emitting diodes may be subjected to nozzle coating, and a uniform thin layer of phosphor powder is formed on the upper surface and the two side walls of the light-emitting diode. The above spraying step may be repeated until the thickness or the weight of the fluorescent material formed on the light-emitting element reaches a desired level; for example, the spraying may be repeated until the thickness of the phosphor powder sprayed on the light-emitting element is about It is 31〇μηη. In addition, 'when performing multiple spraying', it can be sprayed with different formulations of phosphorescent powder. In more detail, 'in the first spraying, it is possible to use fluorescent light with a dominant wavelength of red light. Powder, and in the second mouth coating, it is possible to use a phosphor powder having a wavelength of mainly green light. The above description is merely illustrative, and those skilled in the art to which the present invention pertains can adjust the type of phosphor powder to be used as needed. When the fluorescent material is applied by the dispensing method according to the prior art, the fluorescent material and the polymer adhesive are mixed to form a fluorescent compound; however, such a polishing compound cannot be used in the specific embodiment of the present invention. Spray method. Therefore, the invention of the present invention also proposes a phosphor powder slurry composition suitable for the above spraying method. According to a specific embodiment of the present invention, the phosphor powder slurry composition comprises at least a phosphor powder, a polymer and a solvent, and the phosphor powder paste has a viscosity of about 0.1 to 200 cps. Specifically, the concentration of the phosphor paste suitable for the above method may be about 0.1, 0.5, 1, 2, 5, 1 , 20, 50, 80, 100, 120, 150, 180 or 200 cps. Any suitable phosphor powder can be utilized in accordance with an embodiment of the present invention as long as it is capable of being excited by the light emitted by the LED to emit light having the desired wavelength of emission. Specifically, when a white LED device is fabricated using a blue LED chip or an ultraviolet LED chip, the phosphor powder used has an excitation wavelength of about 250-500 nm and an emission wavelength of about 500-600 nm. Further, the above phosphor powder has a particle size of about 3 to 40 / x m. For example, 'appropriate phosphor powder may be aluminum oxide phosphor powder (such as Y3Al5〇12:Ce) phosphor powder or money aluminum pomegranate petrochemical (Tb^ALOeCe) phosphor powder) , Shixi oxide phosphor powder (such as manganese doped Zn2Si04 phosphor powder), nitride phosphor powder (such as φ (Ca, Sr, Ba) x SiyNz : Eu phosphor powder) Or oxynitride phosphors (such as cerium-activated oxynitride phosphors). When preparing the composition of the phosphor powder slurry, the usable polymer may be a silicone base, a siloxane base, or a sol-gel hybrid. Base), epoxy-epoxy hybrid or silicon-epoxy hybrid (please confirm) or any combination of the above. The proportion of the components of the phosphor powder slurry can be changed according to the required amount of the phosphor powder or the desired viscosity of the phosphor powder slurry, wherein the weight ratio of the phosphor powder 1362968 to the polymer is about 10: 1 to 1: 10, for example, about 10: 1, 10: 1.5, 10: 2, 10: 3, 10: 5, 10: 8, 1: Bu 1: 1.5, 1: 2, 1: 4 1 : 5, 1: 8 or 1: 10. In addition, the weight percentage of the phosphor powder and the polymer to the entire phosphor powder slurry is about 5-95%. In more detail, the above weight percentage may be about 5%, 10%, 15%, 20%, 30. %, 40%, 50%, 60%, 70%, 80%, 90% or 95%. The polymer accounts for about 5-70% by weight of the entire phosphor powder slurry, such as about 5%, 10%, 15%, 20%, 30%, 40%, 50%, 60% or 70%' Good for 20-40%. The solvent contained in the phosphor powder slurry composition may be a C3 ketone (such as acetone) or a C4 ketone (such as acetophenone), a C1_C4 linear alkane having at least one halogen substituent, and a C5-C7 linear alkane. Classes (such as n-heptane), C5-C6 naphthenes, C1-C4 linear alkanols, C2-C4 ethers, ethyl acetate, benzenes (such as transcripts, transcripts or 'a Structural isomer), B guess, tetrahydro-sigma, petroleum bond, fluorinated solvent, solvent, or any combination thereof. According to a specific embodiment of the present invention, an additive may be added to the phosphor powder slurry composition as needed. In general, the additive helps the phosphor paste to suspend and stabilize or increase its luminosity. For example, the above additives may be a bulking agent, an anti-settling agent, a brightening agent or a flattening agent. A preparation example is prepared by preparing a phosphor powder slurry according to the composition of the phosphor powder slurry proposed in the above specific embodiment of the present invention, and spraying the phosphor powder slurry on a blue LED according to the above spraying method. Wafer (Cree, model: BlueC460-EZ1000; startup voltage 2 9_3 8V, 35 mA; wafer size LxWxH = 980x980x100 microns). Preparation example 1 1362968
將8克矽樹脂（ShinEstu，KER2500, A、B雙劑型，A 劑劑= 1:1(各4克））倒入10〇毫升樣品瓶中，加入32 克曱笨溶劑於室溫下攪拌一小時。其後，將12克YA(J螢 光粉（型雖：YAG 4-3-2)加入上述矽樹脂溶液中並攪拌兩 小時，即可得到本發明具體實施例提出之螢光粉漿料，此 —漿料粉漿料的黏度約為10 cps ° 將上述螢光粉漿料平均地加入第1圖所示的喷塗設備 100的第一儲存槽102與第二儲存槽122中，並利用氣源 _ 經由供氣管106與126分別施加壓力至第一與第二儲存槽 與122，以控制螢光粉漿料於其中之流動。 θ 舉例來說，當欲使螢光粉漿料由第丨儲存槽1〇2進入 第一儲存槽中時，可控制氣源施加的壓力，使得ρ2小於Ρ广 而當第一儲存槽102中的螢光粉漿料存量低於預定的下限 液位或者是第二儲存槽122中的螢光粉漿料存量高於預定 上限液位時，可控制螢光粉漿料使其改由第二儲存槽122 流入第一儲存槽102。或者是，亦可在其他適當的時機， • 利用本發明具體實施例提出的方法來調節螢光粉漿料的流 向或流速。上述加廢與調節步驟可視需要重覆進行。 當噴塗步驟開始時’將閥針116以約2〇〇微米的高度 開啟，並以每秒約10次的開啟頻率進行開關動作以供 料至喷嘴114，而閥針116每次開啟時間為2〇毫秒了^據 本製備實例，在進行上述噴塗步驟的同時，仍然利用前述 調節手段，使得螢光粉漿料在第一與第二儲存槽1〇2、122 間循環流動。 喷塗時，將喷嘴114設置於距離LED晶片約9公分處， 12 利用氣源透過供氣管118施加約〇 2MPa的壓力至噴嘴 内部，以使得噴4的螢光粉漿料可和氣體混合*霧化並 透過供氣管120施加約〇.2 MPa的喷出壓力。在本製備實 例中，噴塗速度約為60mm/sec。重覆進行上述噴塗動作， 直到LED晶片表面的螢光粉體及矽樹脂負載量達每平方公 分4 mg為止。 第2圖為根據本製備實例製得之白光LED裴置的色溫 分布圖’顯示了上述白光LED裝置不同角度發出之光線的 色溫。由第2圖可以發現，上述白光LED裝置在18〇度的 發光面中’發出的光線色溫皆在約6400-6700 K之間。由 此可知’根據本發明提出之方法，能夠將螢光材料均勻地 施覆於發光元件的上表面與二侧壁。 本發明上述具體實施例提出的喷塗方法可有效降低喷 塗時飛濺的材料量，在實際運用上，本發明具體實施例提 出的喷塗方法之材料利用率高達約95%。如此一來，將可 減少材料的浪費進而降低成本。此外，當利用脈衝式流量 控制系統進行供料時，螢光粉漿料之塗佈流量較低，可有 效提高材料之轉印率。再者，上述喷塗法可將螢光材料塗 佈至發光元件的上表面與二侧壁上，而非僅限於發光元件 的上表面；如此一來，發光元件的整個發光部分皆可發出 一致且均勻的色光。 與習知點膠法相比之下，根據本發明具體實施例利用 喷塗法將螢光材料施覆至發光元件上，至少具有以下的特 性。首先，點膠法一次僅能處理單一的發光元件（如LED)， 而喷塗法可處理單一或複數個發光元件，因而可提升產 13 1362968 能。其次，點膠法僅適用於杯體式LED封裝體，而利用喷 塗法可將#光粉⑽直接錄於非杯料led封裝體，例 如採用紹基板、陶莞基板或石夕基板之發光元件等。再者， 利用點谬法所施覆的螢光膠料會發生表面張力聚集的問 題，使得螢光材料在發光元件表面的分布不均；而利用喷 塗法可形成薄膜狀的螢光材料，較無表面張力聚集的問 題。另外，由於在進行喷塗之前或同時會使得$光粉聚料 在不同儲存容器間循環流動，可減少螢光粉沈降的問題； • 而利用喷塗法可將不同的螢光粉漿料配方分次噴塗，也可 避免不同螢光粉成份在單一流體中出現分層的問題，這些 情形都使得利用噴塗法得到的榮光材料層具有較佳的均句 度。此外，藉由喷嘴特別是二流體氣霧化喷嘴來進行喷塗 時’能夠將螢光粉聚料和氣體混合而形成霧化的氣體且 所產生的渦流能夠將螢光粉漿料均勻地喷塗於發光元件的 上表面與一侧壁，將可降低不同發光部分發出不同色光的 問題。 • 雖然本發明已以實施方式揭露如上，然其並非用以限 ^本發明，任何熟習此技藝者，在不脫離本發明之精神和 範圍内，當可作各種之更動與潤飾，因此本發明之保護範 圍當視後附之申請專利範圍所界定者為準。 【圖式簡單說明】 . ㈣本發明之上述和其他目#、特徵、優點與實施例 能更明顯易懂，所附圖式之說明如下： 第1圖繪示根據本發明一具體實施例喷塗螢光材料時 1362968 所用之喷塗設備的概要圖式。 第2圖為根據本發明一製備實例之白光LED裝置的色 溫分布圖。8 g of enamel resin (ShinEstu, KER2500, A, B double dosage form, A agent = 1:1 (4 g each)) was poured into a 10 〇 ml sample vial, and 32 g of hydrazine solvent was added and stirred at room temperature. hour. Thereafter, 12 g of YA (J phosphor powder (type: YAG 4-3-2) is added to the above-mentioned enamel resin solution and stirred for two hours to obtain a phosphor powder slurry according to a specific embodiment of the present invention. The viscosity of the slurry slurry is about 10 cps. The phosphor powder slurry is evenly added to the first storage tank 102 and the second storage tank 122 of the spraying apparatus 100 shown in FIG. The gas source _ applies pressure to the first and second storage tanks and 122 via the gas supply pipes 106 and 126, respectively, to control the flow of the phosphor powder slurry therein. θ For example, when the phosphor powder slurry is to be made When the storage tank 1〇2 enters the first storage tank, the pressure applied by the air source can be controlled such that ρ2 is smaller than Ρ2 and the amount of the phosphor powder slurry in the first storage tank 102 is lower than a predetermined lower limit level or When the amount of the phosphor powder slurry in the second storage tank 122 is higher than the predetermined upper limit liquid level, the phosphor powder slurry may be controlled to flow into the first storage tank 102 from the second storage tank 122. Alternatively, At other suitable times, • the method of the specific embodiment of the invention is used to adjust the flow of the phosphor powder slurry Or the flow rate. The above-mentioned addition and adjustment steps can be repeated as needed. When the spraying step starts, the valve needle 116 is opened at a height of about 2 〇〇 microns, and the switching action is performed at an opening frequency of about 10 times per second. Feeding to the nozzle 114, and the valve needle 116 is opened for 2 〇 milliseconds each time. According to the preparation example, while the above spraying step is performed, the aforementioned adjusting means is still used to make the phosphor powder slurry in the first and second Circulating flow between the storage tanks 1 and 2, 122. When spraying, the nozzle 114 is disposed at about 9 cm from the LED wafer, 12 using a gas source to apply a pressure of about 2 MPa through the air supply tube 118 to the inside of the nozzle, so that the spray 4 The phosphor paste can be mixed with a gas* atomized and applied with a discharge pressure of about 22 MPa through the gas supply pipe 120. In the present preparation example, the spraying speed is about 60 mm/sec. Until the amount of phosphor powder and tantalum resin on the surface of the LED wafer is 4 mg per square centimeter. Figure 2 is a color temperature distribution diagram of the white LED device prepared according to the preparation example, showing the different angles of the above white LED device. The color temperature of the light emitted. It can be seen from Fig. 2 that the white light LED device emits a color temperature of about 6400-6700 K in the 18-degree light-emitting surface. Thus, the method according to the present invention is known. The fluorescent material can be uniformly applied to the upper surface and the two sidewalls of the light-emitting element. The spraying method proposed by the above specific embodiment of the present invention can effectively reduce the amount of material splashed during spraying, and in practical application, the present invention The material utilization rate of the spraying method proposed by the specific embodiment is up to about 95%, so that the waste of materials can be reduced and the cost can be reduced. In addition, when the pulse flow control system is used for feeding, the phosphor powder slurry is used. The lower coating flow rate can effectively increase the transfer rate of the material. Furthermore, the above spraying method can apply the fluorescent material to the upper surface and the two side walls of the light-emitting element, instead of being limited to the upper surface of the light-emitting element; thus, the entire light-emitting portion of the light-emitting element can emit the same And uniform color light. In contrast to the conventional dispensing method, the fluorescent material is applied to the light-emitting element by a spray coating method according to an embodiment of the present invention, and has at least the following characteristics. First, the dispensing method can only process a single illuminating element (such as an LED) at a time, while the spraying method can process a single or a plurality of illuminating elements, thereby improving the production of 13 1362968. Secondly, the dispensing method is only applicable to the cup-shaped LED package, and the spraying method can directly record the #光粉(10) in the non-cup LED package, for example, the light-emitting element of the substrate, the ceramic substrate or the stone substrate. Wait. Furthermore, the problem of surface tension accumulation occurs in the fluorescent compound applied by the point method, so that the distribution of the fluorescent material on the surface of the light-emitting element is uneven; and the film-like fluorescent material can be formed by spraying. Less problem with surface tension accumulation. In addition, since the light powder can be circulated between different storage containers before or at the same time of spraying, the problem of sedimentation of the phosphor powder can be reduced; • Different phosphor powder slurry formulations can be prepared by spraying method. The split coating also avoids the problem of delamination of different phosphor components in a single fluid, which results in a better uniformity of the luminescent material layer obtained by the spray method. In addition, when sprayed by a nozzle, in particular a two-fluid gas atomizing nozzle, 'the fluorescent powder aggregate and the gas can be mixed to form an atomized gas and the generated eddy current can uniformly spray the phosphor powder slurry. Applying to the upper surface and a side wall of the light-emitting element will reduce the problem that different light-emitting portions emit different colored lights. The present invention has been disclosed in the above embodiments, but it is not intended to limit the invention, and the present invention may be modified and modified without departing from the spirit and scope of the invention. The scope of protection is subject to the definition of the scope of the patent application. BRIEF DESCRIPTION OF THE DRAWINGS [IV] The above and other objects, features, advantages and embodiments of the present invention will be more apparent and understood. The description of the drawings is as follows: FIG. 1 is a view showing a spray according to an embodiment of the present invention. A schematic diagram of the spray equipment used in 1362968 when fluorescent materials are applied. Fig. 2 is a graph showing the color temperature distribution of a white LED device according to a preparation example of the present invention.
【主要元件符號說明】 100 喷塗設備 102 第一儲存槽 104、 124 連接管 106 ' 118、120、126 供氣管 108 螢光粉漿料 110 喷塗裝置 112 腔室 114 喷嘴 116 閥針 122 第二儲存槽 128 漿料入口[Main component symbol description] 100 Spraying device 102 First storage tank 104, 124 Connecting pipe 106 '118, 120, 126 Air supply pipe 108 Fluorescent powder slurry 110 Spraying device 112 Chamber 114 Nozzle 116 Valve needle 122 Two storage tanks 128 slurry inlet
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