201034759 六、發明說明： . 【發明所屬之技術領域】 • 本發明是有關於一種喷塗螢光材料之方法，且特別是 有關於一種噴塗螢光材料至一發光元件之方法。 【先前技術】201034759 VI. Description of the Invention: [Technical Field of the Invention] The present invention relates to a method of spraying a fluorescent material, and more particularly to a method of spraying a fluorescent material to a light-emitting element. [Prior Art]
發光二極體（Light Emitted Diode，LED)是—種半導 體元件’在施加正向電壓時’可藉由電致發光效應而發出 單色、不連續的光線。隨著半導體材料之化學組成不同， 發光二極體可發出紫外光、可見光或紅外光等不同波長範 圍之光線。 早期發光二極體多運用於指示燈、顯示板等顯示裝 置。隨著半導體技術的進展，目前已發展出多種高亮度、 同m質的發光二極體裝置。同時，白光發光二極體裝置也 被廣泛地運用於顯示、照明以及其他相關領域中。 相較於傳統光源，白光發光二極體裝置具有低耗能 效率高、壽命長、不易破損等優點，因此白紐光二極體 裝置被認歧21世_时錢，可望取代如自熾燈和營 光燈等傳統練，而成為主要的顯示/照明裝置。 μ #製把HLED時’必須搭配放射波長不同的螢光材 果。二?二口，气些不同波段的光線而達到混成白光的效 光罄杏传到白光LED’可利用藍光led搭配黃 紫外線LED，則可ΐ綠光螢光粉;若是採用 搭配藍綠紅三色螢光粉。 在！矣白光LED製程中，通常是將所需榮光材料和高 3 201034759 分子黏著劑混合製成螢光膠料，而後以點膠管將螢光膠料 注入杯狀LEf晶片座中。然而’螢光粉在螢光膠料中所佔 比重通常較咼，使得螢光粉於膠料中之分布不易控制，而 導致整顆LED發$的紐或亮度*均。上述問題 在使用多種螢光粉的LED Μ中尤顯嚴重，這是因為不同 種類的螢光粉密度不同’ ϋ此榮光㈣巾的螢光粉會出現 分層的現象。此外，進行點膠法時，同一時間僅能處理單 顆LED晶片’無法進行多顆或大面積的點膠，連帶使 率低落。 因此’相關領域亟需提出一種有效率的榮光材料施覆 方式，不但可提升LED裝置發光的均句度，亦能提高L£d 裝置的產率。 【發明内容】 本發明之一態樣是在提供喷塗榮光材料之方法，此一 喷塗方法可將蝥光材料快速且大面積地塗佈於一發光元件 Q 上，而形成均勻的螢光粉薄層。 依據本發明一具體實施例，上述喷塗方法至少包含下 述步驟。對位於至少二個相連通之容器内的螢光粉漿料施 加壓力’藉由調節施加至容器内的壓力，而使得上述容器 間存在一壓力差，進而可控制螢光粉漿料於該些容器間的 流動。透過喷塗裝置將螢光粉漿料霧化並噴塗至發光元件 上。 在參閱隨後描述之實施方式後’本發明所屬技術領域 中具有通常知識者當可輕易暸解本發明之基本精神及其他 201034759 發明目的，以及本發明所採用之技術手段與較佳實施態樣。 【實施方式】 本發明之一態樣是在提供喷塗螢光材料之方法，舉例 來說，此一喷塗方法可將螢光材料快速且大面積地塗佈於 一發光元件如發光二極體之上，而形成均勻的螢光粉薄 層。具體而言，利用上述喷塗方法可將螢光粉漿料直接塗 佈於单數或複數顆發光二極體的表面上表面與侧壁上。 Ο 以下參照第1圖，進一步描述本發明一具體實施例提 出之喷塗方法。第1圖為一種喷塗設備的概要圖式，此一 喷塗設備可用以進行根據本發明具體實施例的螢光材料喷 塗方法。 第1圖所示的喷塗設備100是一種雙儲存槽噴塗設 備，具有相連通的第一儲存槽102與第二儲存槽122，第 一與第二儲存槽102與122透過連接管104與124相連通。 噴塗設備1〇〇還包含了喷塗裝置110，其包含腔室112、喷 〇 嘴I14與閥針116。第一與第二儲存槽102與122分別透過 供氣管106與126與提供壓力的氣源（未繪示）連接；而 喷塗裝置110則透過供氣管m與12〇與提供壓力的氣源 (未繪不）連接，上述各供氣管所連接的氣源可以是相同 或不同的氣源。本發明所屬技術領域中具有通常知識者當 可理解，雖然此處繪示的是雙儲存槽冑塗設#，本發明^ 施例提出之方法亦可運用具有更多儲存槽之喷塗設備十。 如第1圖所示，螢光粉漿料1〇8填充於相連通的第— 與第二儲存槽1G2與122以及連接管104與124内。根據 5 201034759 本發明具體實施例之方法，可利用氣源經由供氣管106與 126分別施加壓力至第一與第二儲存槽1〇2與122;此時， 上述氣源可作為流速控制裝置。應施加的壓力大小可取決 於螢光粉漿料108本身性質（如黏度或螢光粉體重量濃 度）、連接管104與124之直徑、所需流速、噴塗壓力等因 素。一般而言’適當的壓力大小約為0.001 MPa至約1〇 MPa。更明確地說’適當的壓力大小可為約o.ooi、〇 oj、 〇.1、1、2、3、4、5、6、7、8、9或1〇%^。 〇 作為流速控制裝置的氣源可以利用一種時序開關加壓 裝置或一種連續加壓裝置來產生適當的壓力。在利用時序 開關加壓裝置的情形中，適當的開啟頻率為每秒約1-2〇〇 次’例如每秒約 1、5、1〇、20、30、40、50、100、120、 150 或 200 次。 可進一步調節施加至第一與第二儲存槽1〇2與122内 的壓力，而使彳于上述儲存槽間存在一壓力差，進而控制螢 光粉漿料於該些容器間流動。更詳細地說，施加至第一儲 〇存槽102内的壓力為Pl，而施加至第二儲存槽122内的壓 力為P2 ;若Pi大於P2時，則螢光粉漿料1〇8會從第一儲 存槽102經由連接管104朝向第二儲存槽122的方向移 ^反之，螢光粉漿料1〇8會從第二铸存槽122經由連接 官124朝向第-儲存槽102的方向移動；而若時大 致上相等（即，壓力差為零）時，螢光粉襞料1〇8實質上 •不會流動。此外’當上述壓力差的差值越大時，螢光粉漿 料108的流速也就越快，因此亦可藉由調整壓力差來控制 流速；根據本發明具體實施例，適當的螢光粉聚料流速約 201034759 為1-100 mm/sec。更詳細地說，螢光粉漿料的流速可為約 1、2、5、10、20、30、40、50、60、70、80、90 或 100mm/sec。 一般而言，可利用人工或自動化的方式來進行此一調 節步驟。例如，可利用計時器來設定氣源開始與結束供應 氣體產生壓力的時點。或者是，可利用軟體程式透過電^ 等運鼻裝置來控制氣源開始與結束供應氣體產生壓力的時 點。此外，可預先決定該儲存槽内可接受的上限液位與下A Light Emitted Diode (LED) is a type of semiconductor element that emits a monochromatic, discontinuous light by the electroluminescence effect when a forward voltage is applied. As the chemical composition of the semiconductor material is different, the light emitting diode emits light of different wavelength ranges such as ultraviolet light, visible light or infrared light. Early light-emitting diodes were used for display devices such as indicator lights and display panels. With the advancement of semiconductor technology, a variety of high-brightness, same-quality light-emitting diode devices have been developed. At the same time, white light emitting diode devices are also widely used in display, illumination, and other related fields. Compared with the traditional light source, the white light emitting diode device has the advantages of low energy consumption efficiency, long life, and is not easy to be broken. Therefore, the white light diode device is recognized as a self-contained lamp. It has become a major display/lighting device with traditional practice such as camp lights. When μ H is used to make HLEDs, it must be matched with fluorescent materials with different emission wavelengths. Two or two, the light of different bands can achieve the effect of mixing white light. The apricot is transmitted to the white LED. The blue LED can be used with the yellow ultraviolet LED, and the green fluorescent powder can be used. Fluorescent powder. in! In the white LED process, the desired glare material and the high-level 201034759 molecular adhesive are usually mixed into a fluorescent compound, and then the fluorescent rubber is injected into the cup-shaped LEf wafer holder by a dispensing tube. However, the proportion of phosphor powder in the fluorescent compound is usually relatively low, which makes the distribution of the phosphor powder in the rubber compound difficult to control, and causes the entire LED to emit $new or brightness*. The above problems are particularly serious in LED enamels using a variety of phosphors, because different types of phosphor powders have different densities. 萤 The luminescent powder of this glory (4) towel will be stratified. In addition, when the dispensing method is performed, only a single LED chip can be processed at the same time, and it is impossible to perform multiple or large-area dispensing, which is associated with a low rate. Therefore, it is urgent to propose an efficient glare material application method, which not only improves the uniformity of illumination of the LED device, but also improves the yield of the L£d device. SUMMARY OF THE INVENTION One aspect of the present invention provides a method for spraying a glare material, which can apply a calender material to a light-emitting element Q quickly and over a large area to form uniform fluorescent light. Thin layer of powder. According to a specific embodiment of the invention, the above spraying method comprises at least the following steps. Applying pressure to the phosphor paste in at least two of the communicating containers. By adjusting the pressure applied to the container, there is a pressure difference between the containers, thereby controlling the phosphor powder slurry. The flow between the containers. The phosphor powder slurry is atomized and sprayed onto the light-emitting element through a spraying device. The basic spirit of the present invention and other objects of the present invention, as well as the technical means and preferred embodiments of the present invention, can be readily understood by those of ordinary skill in the art. [Embodiment] One aspect of the present invention provides a method for spraying a fluorescent material. For example, the spraying method can rapidly and widely apply a fluorescent material to a light-emitting element such as a light-emitting diode. Above the body, a uniform thin layer of phosphor powder is formed. Specifically, the phosphor powder slurry can be directly coated on the upper surface and the side wall of the singular or plural light-emitting diodes by the above-described spraying method. BRIEF DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, a spraying method proposed in an embodiment of the present invention will be further described with reference to FIG. Figure 1 is a schematic illustration of a spray apparatus that can be used to perform a phosphor material spray process in accordance with an embodiment of the present invention. The spraying device 100 shown in FIG. 1 is a dual storage tank spraying device having a first storage tank 102 and a second storage tank 122 connected thereto, and the first and second storage tanks 102 and 122 pass through the connecting tubes 104 and 124. Connected. The spray apparatus 1A also includes a spray device 110 that includes a chamber 112, a spray nozzle I14 and a valve needle 116. The first and second storage tanks 102 and 122 are respectively connected to the gas source (not shown) for supplying pressure through the gas supply pipes 106 and 126, and the spray device 110 is passed through the gas supply pipes m and 12 and the gas source for supplying pressure. (not shown), the gas sources connected to the respective gas supply pipes may be the same or different gas sources. It will be understood by those having ordinary skill in the art to which the present invention pertains, although a double storage tank coating # is illustrated herein, the method proposed by the present invention can also utilize a spraying apparatus having more storage tanks. . As shown in Fig. 1, the phosphor powder slurry 1〇8 is filled in the first and second storage tanks 1G2 and 122 and the connecting tubes 104 and 124 which are in communication with each other. According to the method of the embodiment of the present invention, the gas source can be separately applied to the first and second storage tanks 1〇2 and 122 via the gas supply pipes 106 and 126 by the gas source; at this time, the gas source can be used as the flow rate control device. The amount of pressure to be applied may depend on the properties of the phosphor paste 108 itself (e.g., viscosity or concentration of phosphor powder), the diameter of the connecting tubes 104 and 124, the desired flow rate, the spray pressure, and the like. Generally, a suitable pressure is from about 0.001 MPa to about 1 MPa. More specifically, the appropriate pressure magnitude may be about o.ooi, 〇oj, 〇.1, 1, 2, 3, 4, 5, 6, 7, 8, 9, or 1%. 〇 As a source of flow rate control, a timing switch pressurizer or a continuous pressurizer can be used to generate the appropriate pressure. In the case of a timing switch pressurization device, a suitable turn-on frequency is about 1-2 times per second 'eg, about 1, 5, 1 , 20, 30, 40, 50, 100, 120, 150 per second. Or 200 times. The pressure applied to the first and second storage tanks 1 and 2 can be further adjusted so that a pressure difference exists between the storage tanks to control the flow of the phosphor powder between the containers. In more detail, the pressure applied to the first storage tank 102 is P1, and the pressure applied to the second storage tank 122 is P2; if Pi is greater than P2, the fluorescent powder slurry 1〇8 will Moving from the first storage tank 102 to the second storage tank 122 via the connecting pipe 104, the phosphor paste 1 8 will be directed from the second casting tank 122 to the first storage tank 102 via the joint 124. Moving; and if the time is substantially equal (ie, the pressure difference is zero), the phosphor powder 1〇8 does not substantially flow. In addition, the greater the difference in pressure difference, the faster the flow rate of the phosphor powder slurry 108, so that the flow rate can also be controlled by adjusting the pressure difference; according to an embodiment of the invention, a suitable phosphor powder The flow rate of the aggregate is about 1-100 mm/sec from 201034759. In more detail, the flow rate of the phosphor powder slurry may be about 1, 2, 5, 10, 20, 30, 40, 50, 60, 70, 80, 90 or 100 mm/sec. In general, this adjustment step can be performed manually or automatically. For example, a timer can be used to set the point at which the gas source starts and ends the supply of gas. Alternatively, the software program can be used to control the timing at which the gas source starts and ends the supply of gas by the nose device. In addition, the upper limit liquid level acceptable in the storage tank can be determined in advance
限液位，並根據上述上限液位與下限液位而適時地調節螢 光粉漿料的流向和/或流速。 根據本發明具體實施例提出之方法，可透過噴塗裝置 110將螢光粉漿料108霧化並喷塗至發光元件（未繪示） 上。根據第1圖所示的裝置，可利用氣源經由供氣管ιΐ8 與120分別施加一霧化壓力&以及一渦流壓力匕至喷嘴 114内，其中霧化壓力可讓螢光粉漿料1〇8和氣體混合而 產生氣霧化的喷霧；而渦流壓力可使得氣霧化的螢光粉漿 料形成-向下喷射的渦流；從而可將氣霧化的螢光 喷塗至發光元件上。 更具體而言’可利用二流體氣霧化喷嘴來實踐上述霧 化與喷塗步驟。當螢光粉漿料通關針116 *進入 氣霧化喷嘴巾時’其能夠形成氣霧化的喷霧並利用渴流壓 力將霧化的螢光粉衆料噴塗於發光元件的上表面與二側 壁’亦即可達成所謂的共形塗佈（_f_al_i%)。 應施加的壓力大小可隨著於螢光粉漿料108本身性質 (如黏度）、喷塗速率、噴塗面積、漿料氣霧化程度以及滿 流強度等因素而加以調整。一般而言，適當的壓力大小約 201034759 為 0.01 MPa 至約 20 MPa。舉 約請、oicum、5:„上述 小可為 本發=體實施例，州的數值可：2:二根據 的影響== = =塗量會受到多種條件 ，收與122内的壓力和一/或壓=施第二 高度和/或頻率以及渦流壓力等。 &啟的 Ο Ο 2㈣置11G未進行喷料，_ιΐ6 而使得榮光粉_1〇8不會從連接管ι〇4或124 二^播人口 128 ’然而螢输㈣⑽仍可在第-與第 涂成子θ 1〇2、122間循環流動。當嘴塗裝置110要進行喷 ^，可提高閥針116使其不再頂住漿料人口 m，此時 榮光粉㈣⑽即可由連接管1G4 &丨24進入漿料入口 ，進而透過喷嘴114進行噴塗。 .可利用各種習知的手段，來控制麟116的開啟與關 閉，舉例來說’可利用一加壓裝置來改變施加於閥針116 上的壓力，藉以控制閥針116開啟的高度與頻率；或者是， 可利用電磁閥來控制閥針116的開啟高度與頻率。此外， 在較佳的情形中，亦可利用脈衝控制裝置來控制閥針116 的開啟與關閉，且適當的脈衝頻率為每秒約卜5、1〇、2〇、 3〇、40、50次。當然，亦可使用其他適當的開啟構件，來 控制閥針116的開啟高度與頻率，進而控制螢光粉漿料的 噴塗速度與喷塗量。 根據本發明具體實施例提出的方法，當螢光粉漿料108 在儲存槽102、122與連接管1〇4、124間流動時，可同時 8 201034759 進行喷塗步驟。另-方面，當螢光粉漿料⑽並未出現過 量沈殿且品質良好的情形下’亦可先停止螢光粉漿料108 在儲存槽Η)2、122與連接管104、124間的流動，然後再 進行喷塗步驟。 此外，在進行上述喷塗步驟時，可依需求另行加熱正 在進行喷塗之發光7G件’以使得在倾步驟中可同時乾燥 喷塗於發光元件上之螢光粉聚料，避免因流量過大所造成 Ο Ο 表面張力聚集之問題。如此—來’可進—步提升發光元件 上螢光粉漿料分布的均勻性。 根據本發明具體實施例提出之方法，可複 =光二極體表面進行喻塗，而於上述發光二極體的上 表面與二侧壁上形成一均句的螢光粉薄層。 光材驟，直到發光元件上形成的# 二例來說，可， ㈣為止。 千上的螢練_之厚度約為3-10 漿料行；塗了時’可採用不同配方的螢光粉 放射波長=為紅以光: 就可以採用放射波長主要而在第二次噴塗時 述僅為例示，本發明所屬二二的肇光粉體。以上所 依需求調整所使用的螢光粉:二：:具有通常知識者當町 根據先前技術以點膠法步 材料和高分子黏著_合製 膠料材料時’需將#光 料無法用於本發明具體實施例：出然而此種螢光膠 赁塗方法。因此，木 201034759 發明亦提出了適用於上述喷塗方法的螢光粉漿料組成。 根據本發明具體實施例，上述螢光粉漿料組成至少包 含螢光粉體、聚合物以及溶劑，且螢光粉漿料的黏度約為 0.1-200 cps。具體而言，適用於上述方法之螢光粉漿料的 濃度可為約 0.1、0.5、1、2、5、10、20、50、80、100、 120、150、180 或 200 cps。 根據本發明具體實施例，可利用任何適當的螢光粉 體，只要其能夠受到LED發出的光線激發而發射出具備所 0 想發射波長的光線即可。具體而言，當利用藍光led晶片 或紫外光LED晶片來製備白光LED裝置時，所用的螢光 粉體之可激發波長約為250-500 nm;而發射波長約為 500-600 nm。此外，上述螢光粉體的粒徑大小約為3-40 μιη。 舉例來說，適當的螢光粉體可以是鋁氧化物螢光粉（如 釔鋁石榴石化物（Y3Al5012:Ce)螢光粉或铽鋁石榴石化物 (Tb3Al5012:Ce)螢光粉）、矽氧化物螢光粉（如猛摻雜矽 酸鋅化物（Mn-dopedZn2Si04)螢光粉）、氮化物螢光粉（如 q (Ca，Sr，Ba)xSiyNz : Eu螢光粉）或氮氧化物螢光粉（如銪活 化氮氧化物螢光粉）。 製備螢光粉漿料組成時，可用的聚合物可以是矽酮基 聚合物（silicone base).、梦氧烧基聚合物（sii〇xane base)、 溶凝膠混聚物（sol-gel hybrid base)、環氧基聚合物、石夕環 氧混聚物（silicone-epoxy hybrid 0r silic〇n_ep〇xy hybrid， 請確認）或上述之任意組合。 可以根據所需之螢光粉體量或所需之螢光粉漿料黏度 等特性，而改變螢光粉漿料組成份的配比，其中螢光粉體 201034759 與聚合物的重量比約為10 : 1至1 : 10間，例如約10 : 1、 10 : 1.5、10 : 2、10 : 3、1〇 : 5、10 : 8、1 : 1、1 : 1.5、1 : 2、1 : 4、1 : 5、1 : 8或1 : 1〇。此外，螢光粉體與聚合物 佔整個螢光粉漿料之重量百分比約為5-95%，更詳細地 說’上述重量百分比可為約5%、10%、15%、20%、30%、 40%、50%、60%、70%、80%、90%或 95%。聚合物佔整 個螢光粉漿料之重量百分比約為5-70%，如約5%、10%、 15%、20%、30%、40%、50%、60%或70%，且較佳為 20-40%。 螢光粉漿料組成中所含的溶劑可以是C3酮類（如丙 酮）或C4酮類（如曱乙酮）、具有至少一鹵素取代基的C1_C4 直鏈烧類、C5-C7直鏈燒類（如正庚燒）、環院類、 C1-C4直鏈烧醇類、C2-C4醚類、醋酸乙酯、苯類（如曱 苯、一曱本或一曱笨的結構異構物）、乙腈、四氫Π夫味、石 油醚、含氟溶劑、矽酮溶劑或上述之任意組合。 根據本發明具體實施例，更可依需求於螢光粉漿料組 成中加入添加劑。一般而言，添加劑可幫助螢光粉漿料懸 浮及穩定或增加其發光亮度。舉例來說，上述添加劑可以 是增稠劑、抗沉劑、增亮劑或平坦劑。 下文提出一製備實例，其係根據上述本發明具體實施 例提出的螢光粉漿料組成來製備螢光粉漿料，並根據上述 喷塗方法將該螢光粉漿料噴塗於一藍光led晶片（Cree， 型號：Blue C460-EZ1000 ;啟動電壓 2 9 3 8V，35〇mA ;晶 片尺寸 LxWxH = 980x980x100 微米）上。 製備實例1 201034759 將8克矽樹脂（ShinEstu，KER2500, A、B雙劑型，A 劑：B劑= 1:1 (各4克））倒入100毫升樣品瓶中，加入32 克曱苯溶劑於室溫下攪拌一小時。其後，將12克YAG螢 光粉（型號：YAG 4-3-2)加入上述梦樹脂溶液中並擾拌兩 小時，即可得到本發明具體實施例提出之螢光粉漿料，此 一漿料粉漿料的黏度約為 10 cps ° 將上述螢光粉漿料平均地加入第1圖所示的噴塗設備 100的第一儲存槽1〇2與第二儲存槽122中，並利用氣源 Ο 經由供氣管與126分別施加壓力至第一與第二儲存槽 丨〇2與122，以控制螢光粉漿料於其中之流動。 舉例來說，當欲使螢光粉漿料由第1儲存槽1〇2進入 第二儲存槽中時，可控制氣源施加的壓力，使得p2小於Pi。 而當第一儲存槽102中的螢光粉漿料存量低於預定的下限 液位或者是第二儲存槽122中的螢光粉漿料存量高於預定 上限液位時，可控制螢光粉漿料使其改由第二儲存槽122 流入第一儲存槽102。或者是，亦可在其他適當的時機， 〇 利用本發明具體實施例提出的方法來調節螢光粉漿料的流 向或流速。上述加壓與調節步驟可視需要重覆進行。 當噴塗步驟開始時，將閥針116以約200微米的高度 開啟’並以每秒約1〇次的開啟頻率進行開關動作以供給漿 料至噴嘴114 ’而閥針116每次開啟時間為2〇毫秒。根據 本製備實例，在進行上述喷塗步驟的同時，仍然利用前述 調節手段，使得螢光粉漿料在第一與第二儲存槽1〇2、122 間循環流動。 噴塗時，將喷嘴114設置於距離LED晶片約9公分處， 12 201034759 利用氣源透過供氣管118施加約0.2 MPa的壓力至喷嘴114 内部，以使得喷出的螢光粉漿料可和氣體混合而霧化，並 透過供氣管120施加約0.2 MPa的喷出壓力。在本製備實 例中’喷塗速度約為60 mm/sec。重覆進行上述噴塗動作， 直到LED晶片表面的螢光粉體及碎樹脂負載量達每平方公 分4 mg為止。 第2圖為根據本製備實例製得之白光LED裝置的色溫 分布圖，顯示了上述白光LED裝置不同角度發出之光線的 Ο 色溫。由第2圖可以發現’上述白光LED裝置在180度的 發光面中’發出的光線色溫皆在約6400-6700 K之間。由 此可知，根據本發明提出之方法，能夠將螢光材料均勻地 施覆於發光元件的上表面與二侧壁。The liquid level is limited, and the flow direction and/or flow rate of the phosphor powder slurry is adjusted in time according to the above upper limit liquid level and lower limit liquid level. According to the method of the specific embodiment of the present invention, the phosphor powder slurry 108 can be atomized and sprayed onto the light-emitting element (not shown) through the spraying device 110. According to the apparatus shown in Fig. 1, a gas source can be used to apply an atomizing pressure & and a vortex pressure to the nozzle 114 via the air supply pipes ι 8 and 120, respectively, wherein the atomizing pressure allows the phosphor powder slurry to be licked. 8 mixing with the gas to produce an aerosolized spray; and the vortex pressure allows the aerosolized phosphor paste to form a downward jet vortex; thus, the aerosolized phosphor can be sprayed onto the light-emitting element . More specifically, the above-described atomization and spraying steps can be practiced using a two-fluid gas atomizing nozzle. When the phosphor powder pass-through needle 116* enters the aerosolizing nozzle towel, it can form an aerosolized spray and spray the atomized phosphor powder onto the upper surface of the light-emitting element by using the thirst pressure. The so-called conformal coating (_f_al_i%) can also be achieved for the side walls. The amount of pressure that should be applied can be adjusted as a function of the nature of the phosphor paste 108 (e.g., viscosity), spray rate, spray area, degree of slurry aerosolization, and full flow strength. In general, a suitable pressure is from about 0.01 MPa to about 20 MPa. For example, oicum, 5: „The above small can be the body of the body = body example, the state value can be: 2: the effect of the second basis == = = the amount of coating will be subject to a variety of conditions, to receive the pressure within 122 and / or pressure = apply the second height and / or frequency and eddy current pressure, etc. & Ο Ο Ο 2 (four) set 11G is not sprayed, _ιΐ6 so that glory powder _1 〇 8 will not from the connection tube ι〇4 or 124 The population of 128 is broadcasted. However, the fire (4) (10) can still circulate between the first and the first coated θ 1 〇 2, 122. When the nozzle coating device 110 is to be sprayed, the valve needle 116 can be raised to make it no longer top. When the slurry population m is lived, the glory powder (4) (10) can enter the slurry inlet through the connecting pipe 1G4 & 24, and then spray through the nozzle 114. Various conventional means can be used to control the opening and closing of the Lin 116. For example, a pressurizing device can be utilized to vary the pressure applied to the valve needle 116 to control the height and frequency at which the valve needle 116 is open; alternatively, a solenoid valve can be utilized to control the opening height and frequency of the valve needle 116. In addition, in a preferred case, the pulse control device can also be used to control the valve needle 116. Open and close, and the appropriate pulse frequency is about 5, 1 〇, 2 〇, 3 〇, 40, 50 times per second. Of course, other suitable opening members can also be used to control the opening height of the valve needle 116 and The frequency, in turn, controls the spraying speed and the amount of spraying of the phosphor powder slurry. According to the method proposed by the embodiment of the present invention, the phosphor powder slurry 108 flows between the storage tanks 102, 122 and the connecting tubes 1 and 4, 124. At the same time, the spraying step can be carried out at the same time 8 201034759. On the other hand, when the phosphor powder slurry (10) does not have excessive sedimentation and the quality is good, the phosphor powder slurry 108 can be stopped first in the storage tank 2 2 , the flow between the 122 and the connecting tubes 104, 124, and then the spraying step. In addition, in the above spraying step, the illuminating 7G piece that is being sprayed may be separately heated as needed to enable the tilting step At the same time, the phosphor powder aggregate sprayed on the light-emitting element is dried to avoid the problem of the surface tension of the crucible caused by excessive flow. Thus, the uniformity of the distribution of the phosphor paste on the light-emitting element can be improved. Specific according to the present invention In the method proposed in the embodiment, the surface of the photodiode can be coated, and a thin layer of phosphor powder is formed on the upper surface and the two sidewalls of the light-emitting diode. In the case of #二上,可, (4). The thickness of the swell of 千 _ is about 3-10 paste line; when applied, 'the fluorescent powder of different formula can be used to emit wavelength = red to light : The radiation wavelength can be used mainly in the second spraying, and the second spraying method is only exemplified. The phosphor powder used in the present invention belongs to the above two. The above-mentioned fluorescent powder used is adjusted according to the demand: 2:: According to the prior art, in the case of a dispensing method and a polymer adhesive _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ Therefore, the wood 201034759 invention also proposes a phosphor powder slurry composition suitable for the above spraying method. According to a specific embodiment of the present invention, the phosphor powder slurry composition comprises at least a phosphor powder, a polymer and a solvent, and the phosphor powder paste has a viscosity of about 0.1 to 200 cps. Specifically, the concentration of the phosphor paste suitable for the above method may be about 0.1, 0.5, 1, 2, 5, 10, 20, 50, 80, 100, 120, 150, 180 or 200 cps. In accordance with an embodiment of the present invention, any suitable phosphor powder may be utilized as long as it is capable of being excited by the light emitted by the LED to emit light having a desired wavelength of emission. Specifically, when a white LED device is fabricated using a blue LED chip or an ultraviolet LED chip, the phosphor powder used has an excitation wavelength of about 250 to 500 nm and an emission wavelength of about 500 to 600 nm. Further, the above phosphor powder has a particle size of about 3 to 40 μm. For example, a suitable phosphor powder may be an aluminum oxide phosphor (such as yttrium aluminum pomegranate (Y3Al5012: Ce) phosphor or yttrium aluminum pomegranate (Tb3Al5012: Ce) phosphor), 矽Oxide phosphor (such as Mn-dopedZn2Si04 phosphor), nitride phosphor (such as q (Ca, Sr, Ba) x SiyNz : Eu phosphor) or NOx Fluorescent powder (such as strontium activated oxynitride fluorescein). When preparing the composition of the phosphor powder slurry, the usable polymer may be a silicone base, a sii〇xane base, or a sol-gel hybrid. Base), epoxy-polymer, silicon-epoxy hybrid 0r silic〇n_ep〇xy hybrid (please confirm) or any combination of the above. The proportion of the components of the phosphor powder slurry can be changed according to the required amount of the phosphor powder or the desired viscosity of the phosphor powder slurry, wherein the weight ratio of the phosphor powder 201034759 to the polymer is about 10 : 1 to 1: 10, for example about 10 : 1, 10 : 1.5, 10 : 2, 10 : 3, 1〇: 5, 10 : 8, 1: 1:, 1: 1.5, 1: 2: 1 : 4, 1: 5, 1: 8 or 1: 1〇. In addition, the weight percentage of the phosphor powder and the polymer to the entire phosphor powder slurry is about 5-95%, and more specifically, the above weight percentage may be about 5%, 10%, 15%, 20%, 30. %, 40%, 50%, 60%, 70%, 80%, 90% or 95%. The polymer accounts for about 5-70% by weight of the entire phosphor powder slurry, such as about 5%, 10%, 15%, 20%, 30%, 40%, 50%, 60% or 70%, and Good for 20-40%. The solvent contained in the phosphor powder slurry composition may be a C3 ketone (such as acetone) or a C4 ketone (such as acetophenone), a C1_C4 linear burnt having at least one halogen substituent, and a C5-C7 linear burn. Classes (such as Zhenggeng), Huanyuan, C1-C4 linear alcohols, C2-C4 ethers, ethyl acetate, benzenes (such as toluene, sulfonium or a silly structural isomer) ), acetonitrile, tetrahydrofurfur, petroleum ether, fluorinated solvent, fluorenone solvent or any combination of the above. According to a specific embodiment of the present invention, an additive may be added to the phosphor powder slurry composition as needed. In general, the additive helps the phosphor paste to suspend and stabilize or increase its brightness. For example, the above additives may be thickeners, anti-settling agents, brighteners or flat agents. A preparation example is described below, which prepares a phosphor powder slurry according to the composition of the phosphor powder slurry proposed in the above specific embodiment of the present invention, and sprays the phosphor powder slurry on a blue LED led wafer according to the above spraying method. (Cree, model: Blue C460-EZ1000; starting voltage 2 9 3 8V, 35 mA; wafer size LxWxH = 980x980x100 microns). Preparation Example 1 201034759 8 g of enamel resin (ShinEstu, KER 2500, A, B double dosage form, A agent: B agent = 1:1 (4 g each)) was poured into a 100 ml sample vial, and 32 g of a benzene solvent was added thereto. Stir at room temperature for one hour. Thereafter, 12 g of YAG phosphor powder (model: YAG 4-3-2) is added to the above dream resin solution and scrambled for two hours to obtain a phosphor powder slurry according to a specific embodiment of the present invention. The slurry powder slurry has a viscosity of about 10 cps. The above-mentioned phosphor powder slurry is evenly added to the first storage tank 1〇2 and the second storage tank 122 of the spraying apparatus 100 shown in FIG. The source 施加 applies pressure to the first and second storage tanks 2 and 122, respectively, via the gas supply pipe and the 126 to control the flow of the phosphor powder slurry therein. For example, when the phosphor paste is to be introduced into the second storage tank from the first storage tank 1〇2, the pressure applied by the gas source can be controlled such that p2 is smaller than Pi. When the amount of the phosphor powder slurry in the first storage tank 102 is lower than the predetermined lower limit liquid level or the stock of the phosphor powder slurry in the second storage tank 122 is higher than the predetermined upper limit liquid level, the fluorescent powder can be controlled. The slurry is caused to flow from the second storage tank 122 into the first storage tank 102. Alternatively, the flow or flow rate of the phosphor paste slurry may be adjusted at other suitable times using the method set forth in the specific embodiments of the present invention. The above pressurization and adjustment steps may be repeated as needed. When the spraying step begins, the valve needle 116 is opened at a height of about 200 microns and is switched at an opening frequency of about 1 turn per second to supply the slurry to the nozzle 114' and the valve needle 116 is opened for 2 times each time. 〇 milliseconds. According to the present preparation example, while the above-described spraying step is carried out, the above-described adjusting means is still used to cause the phosphor powder slurry to circulate between the first and second storage tanks 1, 2, 122. When spraying, the nozzle 114 is disposed at about 9 cm from the LED wafer, 12 201034759 is applied with a gas source through the gas supply pipe 118 to a pressure of about 0.2 MPa to the inside of the nozzle 114, so that the sprayed phosphor paste can be mixed with the gas. The atomization is carried out, and a discharge pressure of about 0.2 MPa is applied through the gas supply pipe 120. In the present preparation example, the spraying speed was about 60 mm/sec. The above spraying operation is repeated until the phosphor powder and the resin load on the surface of the LED wafer are 4 mg per square centimeter. Fig. 2 is a graph showing the color temperature distribution of the white LED device obtained according to the present preparation example, showing the color temperature of the light emitted from different angles of the above-mentioned white LED device. It can be seen from Fig. 2 that the color temperature of the light emitted by the above-mentioned white LED device in the light-emitting surface of 180 degrees is between about 6,400 and 6,700 K. From this, it can be seen that according to the method of the present invention, the fluorescent material can be uniformly applied to the upper surface and the two side walls of the light-emitting element.
^發明上述具體實施例提出的喷塗方法可有效降低喷 塗時飛，的材料量，在實際運用上，本發明具體實施例提 出，喷塗方法之材料利用率高達約95%。如此一來，將可 丨Ϊ料的浪費進而降低成本。此外，當利用脈衝式流量 ❹二摇二統進行供料時，螢光粉漿料之塗佈流量較低，可有 佈料之轉印率。再者，上述喷塗法可將螢光材料塗 “元件的上表面與二侧壁上，而非僅限於發光元件 如此一來，發光元件的The spraying method proposed by the above specific embodiment can effectively reduce the amount of material flying during spraying. In practical use, the specific embodiment of the present invention provides that the material utilization rate of the spraying method is as high as about 95%. As a result, the waste of the waste can be reduced and the cost can be reduced. In addition, when the pulse flow rate is used for feeding, the coating flow rate of the phosphor powder slurry is low, and the transfer rate of the cloth can be obtained. Furthermore, the above spraying method can apply the fluorescent material to the upper surface and the two side walls of the element, instead of being limited to the light-emitting element, the light-emitting element
發光元件的整個發光部分皆可發出 法相比之下，根據本發明具體實施例利用 料施覆至發光元件上，至少具有以下的特 而喷塗、、 ^…一久1里此硬理旱一的發光元件（如led)， 法可處理單一或複數個發光元件，因而可提升產 13 201034759 能。其次’點膠法僅適用於杯體式LED封裝體，而利 塗法可將螢光粉漿料直接塗佈於非杯體式led封裝體，例 如採用鋁基板、陶瓷基板或矽基板之發光元件等。再者y 利用點膠法所施覆的螢光膠料會發生表面張力聚集 題，使得螢光材料在發光元件表面的分布不均；而利用二 塗法可形成薄膜狀的螢光材料’較無表面張力聚集 題。另外，由於在進行喷塗之前或同時會使得榮光粉浆料 在不同儲存容器間循環流動，可減少螢光粉沈降的 〇 *利时塗法可將不_螢光粉_配方分次喷塗可 避免不同螢光粉成份在單-流體中出現分層的問題 情形都使得利用喷塗法得到的螢光材料層具有較^ 度。此外’藉由喷嘴特別是二流體氣霧化喷嘴來進行U 時，能夠將螢光粉漿料和氣體現合而形成霧化的氣體ί 所產生的渦流能夠將螢光粉聚料均句地喷塗於發 =面與二側壁’將可降低不同發光部分發出不同色3 〇 — 本發明已以實施方式揭露如上，然其並非 疋本發明’任何熟習此技藝者， 限 範圍内，當可作各種之更動與潤不脫離本發明之精神和 圍當視後附之申請專利範園所“者=本發明之保護範 【圖式簡單說明】 為讓本發明之上述和其他 能更明顯易懂，所附圖式之說=下特徵、優點與實施例 第1圖緣示根據本發明—月 /、體實施例喷塗螢光材料時 14 201034759 所用之喷塗設備的概要圖式。 第2圖為根據本發明一製備實例之白光LED裝置的色 溫分布圖。 【主要元件符號說明】 100 喷塗設備 102 第一儲存槽 104、 124 連接管 106 ' 118、120、126 供氣管 108 螢光粉漿料 110 喷塗裝置 Ο 112 腔室 114 喷嘴 116 閥針 122 第二儲存槽 128 漿料入口The entire light-emitting portion of the light-emitting element can be emitted. In contrast, according to a specific embodiment of the present invention, the material is applied to the light-emitting element, and at least the following special spray coating, ^... A light-emitting element (such as a led) can process a single or a plurality of light-emitting elements, thereby improving production. Secondly, the 'dispensing method is only applicable to the cup-shaped LED package, and the coating method can directly apply the phosphor powder slurry to the non-cup type LED package, for example, an aluminum substrate, a ceramic substrate or a light-emitting element of a germanium substrate. . Furthermore, y, the fluorescent compound applied by the dispensing method may have a surface tension aggregation problem, so that the distribution of the fluorescent material on the surface of the light-emitting element is uneven; and the two-coating method can form a film-like fluorescent material. No surface tension gathering problem. In addition, since the glory powder slurry can be circulated between different storage containers before or at the same time of spraying, the sedimentation of the phosphor powder can be reduced, and the coating method can be used to spray the non-fluorescent powder. The problem of avoiding delamination of different phosphor components in a single-fluid makes the layer of phosphor material obtained by the spray method have a better degree. In addition, when U is carried out by a nozzle, in particular, a two-fluid gas atomizing nozzle, the fluorination generated by the phosphor powder slurry and the gas can be combined to form an atomized gas, and the fluorination can be uniformly sprayed. Applying to the hair surface and the two side walls will reduce the different illuminating portions to emit different colors. 3 - The present invention has been disclosed in the above embodiments, but it is not intended to be within the scope of the present invention. The various changes and improvements of the present invention are not deviated from the spirit of the present invention and the patent application of the present invention. "The protection of the present invention [simplified description of the drawings] To make the above and other aspects of the present invention more obvious and understandable BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a schematic view of a spraying apparatus used in the case of spraying a fluorescent material according to the present invention - 14 201034759. The figure shows a color temperature distribution diagram of a white light LED device according to a preparation example of the present invention. [Main component symbol description] 100 Spraying device 102 First storage tank 104, 124 Connecting pipe 106 '118, 120, 126 Air supply pipe 108 Fluorescent powder Slurry 11 0 Spraying device Ο 112 Chamber 114 Nozzle 116 Valve needle 122 Second storage tank 128 Slurry inlet