JP5840953B2 - Ledの組み合わせの改良された実装 - Google Patents
Ledの組み合わせの改良された実装 Download PDFInfo
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- JP5840953B2 JP5840953B2 JP2011548822A JP2011548822A JP5840953B2 JP 5840953 B2 JP5840953 B2 JP 5840953B2 JP 2011548822 A JP2011548822 A JP 2011548822A JP 2011548822 A JP2011548822 A JP 2011548822A JP 5840953 B2 JP5840953 B2 JP 5840953B2
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- light emitting
- emitting diodes
- integrated circuit
- temperature sensitive
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- 238000012546 transfer Methods 0.000 claims description 22
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- 238000000034 method Methods 0.000 claims description 12
- 239000000463 material Substances 0.000 claims description 9
- 230000017525 heat dissipation Effects 0.000 claims description 8
- 239000002470 thermal conductor Substances 0.000 claims description 3
- 238000004806 packaging method and process Methods 0.000 claims description 2
- 230000035945 sensitivity Effects 0.000 claims 1
- 238000013461 design Methods 0.000 description 7
- 238000012545 processing Methods 0.000 description 6
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- 230000006870 function Effects 0.000 description 3
- 230000003287 optical effect Effects 0.000 description 3
- 238000012536 packaging technology Methods 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- 238000013459 approach Methods 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 230000001419 dependent effect Effects 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000007787 solid Substances 0.000 description 2
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- 238000006243 chemical reaction Methods 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
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- 230000002708 enhancing effect Effects 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 238000002955 isolation Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
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- 230000001105 regulatory effect Effects 0.000 description 1
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- 229910000679 solder Inorganic materials 0.000 description 1
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Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/16—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits
- H01L25/167—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits comprising optoelectronic devices, e.g. LED, photodiodes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/64—Heat extraction or cooling elements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
- H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
- H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/64—Heat extraction or cooling elements
- H01L33/647—Heat extraction or cooling elements the elements conducting electric current to or from the semiconductor body
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/484—Connecting portions
- H01L2224/48463—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
- H01L2224/48465—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond the other connecting portion not on the bonding area being a wedge bond, i.e. ball-to-wedge, regular stitch
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/30—Technical effects
- H01L2924/301—Electrical effects
- H01L2924/3025—Electromagnetic shielding
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Computer Hardware Design (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Led Device Packages (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Description
Claims (14)
- 複数の取付け領域と、
前記複数の取付け領域のうちのいくつかの領域上にそれぞれ取り付けられ且つ特定の色の光を放射するよう構成される複数の発光ダイオードと、
前記複数の取付け領域のうちの前記いくつかの領域以外の領域上に取り付けられ且つ前記複数の発光ダイオードの少なくとも1つを駆動するよう構成される少なくとも1つの集積回路とを含むようにパッケージ化され、
前記複数の発光ダイオードのうちの最も温度感受性のある発光ダイオードが、前記複数の発光ダイオードのうちの温度感受性のより少ない発光ダイオードと前記少なくとも1つの集積回路との間に配置され、
前記複数の発光ダイオードは、少なくとも2つの異なる大きさの前記取付け領域の上に取り付けられ、
前記最も温度感受性のある発光ダイオードのための前記取付け領域は、前記温度感受性のより少ない発光ダイオードのための前記取付け領域よりも大きい、
装置。 - 前記複数の発光ダイオードは、前記少なくとも1つの集積回路が取り付けられる少なくとも1つの取付け領域から分離される少なくとも1つの取付け領域の上に取り付けられる、請求項1に記載の装置。
- 前記複数の発光ダイオードと前記少なくとも1つの集積回路との間に配置される少なくとも1つの熱遮蔽材を含む、請求項1に記載の装置。
- 前記複数の発光ダイオードと前記少なくとも1つの集積回路との間に配置され且つ熱を伝達するよう構成される少なくとも1つの熱導体を含む、請求項1に記載の装置。
- 前記最も温度感受性のある発光ダイオードと前記温度感受性のより少ない発光ダイオードのうちの少なくとも1つとの間に配置される少なくとも1つの熱遮蔽材を含む、請求項1に記載の装置。
- 前記温度感受性のより少ない発光ダイオードのうちの少なくとも2つの間に配置される少なくとも1つの熱遮蔽材を含む、請求項1に記載の装置。
- 前記少なくとも1つの取付け領域の少なくとも1つは、前記複数の発光ダイオードと前記少なくとも1つの集積回路との間の距離が最大限化されるような方法で非対称的に成形される、請求項1に記載の装置。
- 少なくとも1つの材料を含み且つ前記複数の発光ダイオードと前記少なくとも1つの集積回路とを取り囲む構造を含み、
該構造は、異なる伝熱特性を有する少なくとも2つの部分を含む、
請求項1に記載の装置。 - 当該装置の断面が少なくとも局所的に減少される、請求項1に記載の装置。
- 前記複数の発光ダイオードの少なくとも1つ及び/又は前記少なくとも1つの集積回路を熱的に遮蔽するよう構成される少なくとも1つのリング状構造を含む、請求項1に記載の装置。
- 前記複数の発光ダイオードの少なくとも1つ及び/又は前記少なくとも1つの集積回路によって放射される熱を消散するよう構成される少なくとも1つのリング形状ヒートシンクを含む、請求項1に記載の装置。
- 熱消散増強素子を含む基板と、
請求項1乃至11のうちのいずれか1項に記載の少なくとも1つの装置とを含み、
前記少なくとも1つの装置は、前記基板の上に取り付けられる、
システム。 - 特定の色の光を放射するようそれぞれ構成される複数の発光ダイオードを、複数の取付け領域のうちのいくつかの領域上に取り付けること、及び、
前記複数の発光ダイオードのうちの少なくとも1つを駆動するよう構成される少なくとも1つの集積回路を、前記複数の取付け領域のうちの前記いくつかの領域以外の領域上に取り付けて、パッケージ化することを含み、
前記複数の発光ダイオードのうちの最も温度感受性のある発光ダイオードが、前記複数の発光ダイオードのうちの温度感受性のより少ない発光ダイオードと、前記少なくとも1つの集積回路との間に配置され、
前記複数の発光ダイオードは、少なくとも2つの異なる大きさの前記取付け領域の上に取り付けられ、
前記最も温度感受性のある発光ダイオードのための前記取付け領域は、前記温度感受性のより少ない発光ダイオードのための前記取付け領域よりも大きい、
方法。 - コンピュータプログラムがコンピュータの上で遂行されるとき、前記コンピュータに請求項13に記載の方法のステップを遂行させるためのプログラムコード手段を含む、コンピュータプログラム。
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
EP09152100 | 2009-02-05 | ||
EP09152100.5 | 2009-02-05 | ||
PCT/IB2010/050441 WO2010089696A2 (en) | 2009-02-05 | 2010-02-02 | Improved packaging for led combinations |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2012517115A JP2012517115A (ja) | 2012-07-26 |
JP5840953B2 true JP5840953B2 (ja) | 2016-01-06 |
Family
ID=42290145
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2011548822A Active JP5840953B2 (ja) | 2009-02-05 | 2010-02-02 | Ledの組み合わせの改良された実装 |
Country Status (10)
Country | Link |
---|---|
US (1) | US20110291124A1 (ja) |
EP (1) | EP2394300B1 (ja) |
JP (1) | JP5840953B2 (ja) |
KR (1) | KR101689312B1 (ja) |
CN (1) | CN102308384B (ja) |
BR (1) | BRPI1005425B1 (ja) |
PL (1) | PL2394300T3 (ja) |
RU (1) | RU2528611C2 (ja) |
TR (1) | TR201815475T4 (ja) |
WO (1) | WO2010089696A2 (ja) |
Families Citing this family (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US9041042B2 (en) * | 2010-09-20 | 2015-05-26 | Cree, Inc. | High density multi-chip LED devices |
JP5968911B2 (ja) | 2011-01-14 | 2016-08-10 | フィリップス ライティング ホールディング ビー ヴィ | 照明装置 |
TWI495056B (zh) * | 2012-04-24 | 2015-08-01 | Genesis Photonics Inc | 基板結構 |
DE102016122237A1 (de) * | 2016-11-18 | 2018-05-24 | Osram Opto Semiconductors Gmbh | Multipixel-LED-Bauteil und Verfahren zum Betreiben eines Multipixel-LED-Bauteils |
JP6794498B1 (ja) * | 2019-06-04 | 2020-12-02 | 浜松ホトニクス株式会社 | 発光装置、及び発光装置の製造方法 |
Family Cites Families (25)
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US5785418A (en) * | 1996-06-27 | 1998-07-28 | Hochstein; Peter A. | Thermally protected LED array |
JP3882266B2 (ja) * | 1997-05-19 | 2007-02-14 | 日亜化学工業株式会社 | 半導体装置 |
US6608642B1 (en) * | 1998-11-27 | 2003-08-19 | Sanyo Electric Co., Ltd. | Driver IC and optical print head |
JP2002033426A (ja) * | 2000-07-18 | 2002-01-31 | Ricoh Co Ltd | ステムおよび光ピックアップ |
JP3782325B2 (ja) * | 2001-07-27 | 2006-06-07 | 株式会社日立製作所 | ディスク駆動装置 |
US20070001177A1 (en) * | 2003-05-08 | 2007-01-04 | Koninklijke Philips Electronics N.V. | Integrated light-emitting diode system |
US7198387B1 (en) * | 2003-12-18 | 2007-04-03 | B/E Aerospace, Inc. | Light fixture for an LED-based aircraft lighting system |
EP1709692A1 (en) * | 2004-01-29 | 2006-10-11 | Acol Technologies S.A. | Light emitting diode with integral heat dissipation means |
CN1943049A (zh) * | 2004-04-19 | 2007-04-04 | 松下电器产业株式会社 | 发光元件驱动用半导体芯片、发光装置以及照明装置 |
WO2005104249A1 (ja) * | 2004-04-21 | 2005-11-03 | Matsushita Electric Industrial Co., Ltd. | 発光素子駆動用半導体チップ、発光装置、及び照明装置 |
JP4555026B2 (ja) * | 2004-08-27 | 2010-09-29 | 日本特殊陶業株式会社 | 光電変換モジュール、積層基板接合体 |
JP2006054312A (ja) * | 2004-08-11 | 2006-02-23 | Sanyo Electric Co Ltd | 発光素子 |
JP4757477B2 (ja) * | 2004-11-04 | 2011-08-24 | 株式会社 日立ディスプレイズ | 光源ユニット、それを用いた照明装置及びそれを用いた表示装置 |
US7208738B2 (en) * | 2005-02-28 | 2007-04-24 | Sundar Natarajan Yoganandan | Light source utilizing an infrared sensor to maintain brightness and color of an LED device |
US7952112B2 (en) * | 2005-04-29 | 2011-05-31 | Philips Lumileds Lighting Company Llc | RGB thermal isolation substrate |
US7269008B2 (en) * | 2005-06-29 | 2007-09-11 | Intel Corporation | Cooling apparatus and method |
JP4935004B2 (ja) * | 2005-07-01 | 2012-05-23 | ソニー株式会社 | 表示装置 |
US7230222B2 (en) * | 2005-08-15 | 2007-06-12 | Avago Technologies Ecbu Ip (Singapore) Pte. Ltd. | Calibrated LED light module |
JP5103875B2 (ja) * | 2006-02-17 | 2012-12-19 | 日亜化学工業株式会社 | 発光装置 |
TW200807652A (en) * | 2006-04-20 | 2008-02-01 | Koninkl Philips Electronics Nv | Thermal isolation of electronic devices in submount used for LEDs lighting applications |
US20080217633A1 (en) * | 2007-03-01 | 2008-09-11 | Wu Yin Chang | Light emitting diode structure |
WO2008156020A1 (ja) * | 2007-06-19 | 2008-12-24 | Sharp Kabushiki Kaisha | 基板及び照明装置 |
US8421093B2 (en) * | 2007-07-13 | 2013-04-16 | Rohm Co., Ltd. | LED module and LED dot matrix display |
US20090140271A1 (en) * | 2007-11-30 | 2009-06-04 | Wen-Jyh Sah | Light emitting unit |
RU74869U1 (ru) * | 2008-02-20 | 2008-07-20 | Закрытое акционерное общество "Научно-производственный центр "Научно-исследовательский институт Микроприборов" | Устройство освещения пассажирского салона авиатранспортного средства |
-
2010
- 2010-02-02 US US13/147,602 patent/US20110291124A1/en not_active Abandoned
- 2010-02-02 CN CN201080006746.3A patent/CN102308384B/zh active Active
- 2010-02-02 BR BRPI1005425-1A patent/BRPI1005425B1/pt not_active IP Right Cessation
- 2010-02-02 RU RU2011136638/28A patent/RU2528611C2/ru active
- 2010-02-02 JP JP2011548822A patent/JP5840953B2/ja active Active
- 2010-02-02 PL PL10703518T patent/PL2394300T3/pl unknown
- 2010-02-02 TR TR2018/15475T patent/TR201815475T4/tr unknown
- 2010-02-02 WO PCT/IB2010/050441 patent/WO2010089696A2/en active Application Filing
- 2010-02-02 EP EP10703518.0A patent/EP2394300B1/en active Active
- 2010-02-02 KR KR1020117020656A patent/KR101689312B1/ko active IP Right Grant
Also Published As
Publication number | Publication date |
---|---|
PL2394300T3 (pl) | 2019-01-31 |
RU2011136638A (ru) | 2013-03-10 |
CN102308384A (zh) | 2012-01-04 |
CN102308384B (zh) | 2015-06-17 |
EP2394300B1 (en) | 2018-08-15 |
RU2528611C2 (ru) | 2014-09-20 |
US20110291124A1 (en) | 2011-12-01 |
JP2012517115A (ja) | 2012-07-26 |
WO2010089696A2 (en) | 2010-08-12 |
TR201815475T4 (tr) | 2018-11-21 |
WO2010089696A3 (en) | 2010-09-30 |
BRPI1005425B1 (pt) | 2019-11-05 |
BRPI1005425A2 (pt) | 2017-12-12 |
EP2394300A2 (en) | 2011-12-14 |
KR101689312B1 (ko) | 2016-12-23 |
KR20110121697A (ko) | 2011-11-08 |
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