JP5837804B2 - 異方導電性フィルム組成物、これから製造された異方導電性フィルム、及び該異方導電性フィルムを含む装置 - Google Patents

異方導電性フィルム組成物、これから製造された異方導電性フィルム、及び該異方導電性フィルムを含む装置 Download PDF

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JP5837804B2
JP5837804B2 JP2011251728A JP2011251728A JP5837804B2 JP 5837804 B2 JP5837804 B2 JP 5837804B2 JP 2011251728 A JP2011251728 A JP 2011251728A JP 2011251728 A JP2011251728 A JP 2011251728A JP 5837804 B2 JP5837804 B2 JP 5837804B2
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meth
acrylate
conductive film
anisotropic conductive
weight
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JP2012140594A (ja
Inventor
相 植 ▲はい▼
相 植 ▲はい▼
東 善 魚
東 善 魚
▲けい▼ 勳 申
▲けい▼ 勳 申
長 鉉 ▲そう▼
長 鉉 ▲そう▼
鎭 圭 金
鎭 圭 金
連 助 高
連 助 高
慈 英 黄
慈 英 黄
憬 修 朴
憬 修 朴
康 培 尹
康 培 尹
鎭 晟 朴
鎭 晟 朴
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Cheil Industries Inc
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Cheil Industries Inc
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    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L75/00—Compositions of polyureas or polyurethanes; Compositions of derivatives of such polymers
    • C08L75/04—Polyurethanes
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
    • C08J5/18—Manufacture of films or sheets
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers
    • C09J7/22—Plastics; Metallised plastics
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/20—Conductive material dispersed in non-conductive organic material
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/30—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier
    • C09J2301/312—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier parameters being the characterizing feature
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/30—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier
    • C09J2301/314—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier the adhesive layer and/or the carrier being conductive
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/40—Additional features of adhesives in the form of films or foils characterized by the presence of essential components
    • C09J2301/408—Additional features of adhesives in the form of films or foils characterized by the presence of essential components additives as essential feature of the adhesive layer

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  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Manufacturing & Machinery (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Physics & Mathematics (AREA)
  • Materials Engineering (AREA)
  • Dispersion Chemistry (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Non-Insulated Conductors (AREA)
  • Conductive Materials (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Manufacture Of Macromolecular Shaped Articles (AREA)
JP2011251728A 2010-12-31 2011-11-17 異方導電性フィルム組成物、これから製造された異方導電性フィルム、及び該異方導電性フィルムを含む装置 Active JP5837804B2 (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
KR1020100140042A KR101385032B1 (ko) 2010-12-31 2010-12-31 이방 전도성 필름 조성물 및 이로부터 제조된 이방 전도성 필름
KR10-2010-0140042 2010-12-31

Publications (2)

Publication Number Publication Date
JP2012140594A JP2012140594A (ja) 2012-07-26
JP5837804B2 true JP5837804B2 (ja) 2015-12-24

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JP2011251728A Active JP5837804B2 (ja) 2010-12-31 2011-11-17 異方導電性フィルム組成物、これから製造された異方導電性フィルム、及び該異方導電性フィルムを含む装置

Country Status (4)

Country Link
JP (1) JP5837804B2 (ko)
KR (1) KR101385032B1 (ko)
CN (1) CN102533139B (ko)
TW (1) TWI577727B (ko)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103378236B (zh) * 2012-04-25 2017-04-05 清华大学 具有微构造的外延结构体
KR101702718B1 (ko) * 2014-11-20 2017-02-06 삼성에스디아이 주식회사 이방성 도전 필름, 이의 조성물 및 이를 이용한 반도체 장치
KR101716551B1 (ko) 2014-11-27 2017-03-14 삼성에스디아이 주식회사 이방 도전성 필름 및 이를 이용한 반도체 장치
JP6320660B1 (ja) * 2016-05-23 2018-05-09 タツタ電線株式会社 導電性接着剤組成物
KR102097773B1 (ko) * 2016-09-27 2020-04-06 (주)엘지하우시스 전도성 필름 및 이의 제조방법
WO2018181589A1 (ja) * 2017-03-29 2018-10-04 日立化成株式会社 接着剤組成物及び構造体
WO2024070436A1 (ja) * 2022-09-28 2024-04-04 綜研化学株式会社 異方導電性材料、異方導電性シートおよび異方導電性ペースト並びに接続構造体および接続構造体の製造方法

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2000060614A1 (fr) * 1999-04-01 2000-10-12 Mitsui Chemicals, Inc. Pate a conduction anisotrope
JP2002285135A (ja) * 2001-03-27 2002-10-03 Shin Etsu Polymer Co Ltd 異方導電性接着剤及びこれを用いた接続構造
JP2003249287A (ja) * 2002-02-25 2003-09-05 Shin Etsu Polymer Co Ltd 異方導電性接着剤、ヒートシールコネクター及び接続構造
CN100413890C (zh) * 2002-06-06 2008-08-27 索尼化学株式会社 树脂粒子、导电粒子及由其构成的各向异性导电粘合剂
JP2006143800A (ja) * 2004-11-17 2006-06-08 Kyowa Sangyo Kk 塗料および塗装物品
KR20070117562A (ko) * 2005-03-31 2007-12-12 닛신보세키 가부시키 가이샤 구상 폴리머 미립자 및 그 제조 방법
CN101154470B (zh) * 2006-09-29 2010-12-29 深圳富泰宏精密工业有限公司 外壳
CA2676264C (en) * 2007-01-22 2016-01-05 Mobius Technologies, Inc. Composite panel with solid polyurethane binder, and process for manufacture
JPWO2009116363A1 (ja) * 2008-03-21 2011-07-21 株式会社きもと 光学用フィルム、積層体及びタッチパネル
KR101127099B1 (ko) * 2008-11-27 2012-03-23 제일모직주식회사 이방 전도성 필름용 조성물 및 이를 이용한 이방 전도성 필름
KR101279980B1 (ko) * 2010-12-29 2013-07-05 제일모직주식회사 이방 전도성 필름 조성물 및 이로부터 제조된 이방 전도성 필름

Also Published As

Publication number Publication date
CN102533139B (zh) 2015-01-14
CN102533139A (zh) 2012-07-04
JP2012140594A (ja) 2012-07-26
TW201229115A (en) 2012-07-16
KR20120077912A (ko) 2012-07-10
KR101385032B1 (ko) 2014-04-14
TWI577727B (zh) 2017-04-11

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