JP5837804B2 - Anisotropic conductive film composition, anisotropic conductive film produced therefrom, and apparatus including the anisotropic conductive film - Google Patents

Description

  The present invention relates to an anisotropic conductive film composition, an anisotropic conductive film produced therefrom, and an apparatus including the same.

  An anisotropic conductive film refers to an adhesive film in which conductive particles such as metal particles such as nickel and gold or polymer particles coated with such a metal are dispersed. When an anisotropic conductive film is placed between the circuits to be connected and then heated and pressurized under certain conditions, the circuit terminals are electrically connected by conductive particles, and between adjacent circuits. The pitch is filled with an insulating adhesive resin so that the conductive particles exist independently of each other, so that high insulation is provided.

  Such an anisotropic conductive film must have adhesive strength. In order to increase the adhesive strength, there is a method of adding a high molecular weight polyurethane resin.

JP 2004-164874 A

  However, when a high molecular weight polyurethane resin is added, the compatibility with other acrylic binder resins or low molecular weight (meth) acrylate monomers becomes poor, which may cause difficulty in the production of anisotropic conductive films. .

  Also, the anisotropic conductive film must have good reliability. However, since a normal anisotropic conductive film does not contain a component capable of preventing curing shrinkage in the cured portion, there is a limit to increasing the reliability.

  Therefore, even when a polyurethane resin is added, it is necessary to develop an anisotropic conductive film having good compatibility with other components and improved adhesion and reliability.

  As a result of intensive studies to solve the above problems, it has been found that the above problems can be solved by an anisotropic conductive film containing polyurethane beads and conductive particles.

  In addition, the anisotropic conductive film of the present invention has an initial connection resistance of more than 0 and less than or equal to 1.2Ω, a connection resistance change rate after 500 hours at 85 ° C. and 85% humidity, and more than 0 and less than 50%. Can be included.

  In one embodiment, the average particle size of the polyurethane beads may be 0.1 μm or more and less than 5 μm.

  In one embodiment, the polyurethane beads may be included at 0.1 to 10% by weight with respect to 100% by weight of the anisotropic conductive film.

  In one embodiment, the glass transition temperature (Tg) of the polyurethane beads can be between −50 and 100 ° C.

  In one embodiment, the anisotropic conductive film may include a thermoplastic resin, polyurethane beads, urethane (meth) acrylate, (meth) acrylate monomer, radical initiator, and conductive particles.

  In one embodiment, the thermoplastic resin may include one or more selected from the group consisting of polyurethane-based resins; and acrylonitrile-based, acrylic-based, butadiene-based, polyamide-based, olefin-based, and silicon-based resins.

  In one embodiment, the polyurethane-based resin may be included at 10 to 60% by weight with respect to 100% by weight of the anisotropic conductive film.

  In one embodiment, the average particle size (D50) of the polyurethane beads / the average particle size (D50) of the conductive particles may be less than 1.

  In one embodiment, the anisotropic conductive film has a thermoplastic resin of 15 to 82% by weight, polyurethane beads of 0.1 to 10% by weight, and urethane (meth) acrylate 15 to 100% by weight of the anisotropic conductive film. It may contain 40% by weight, 1 to 20% by weight of (meth) acrylate monomer, 0.9 to 5% by weight of radical initiator and 1 to 10% by weight of conductive particles.

  The anisotropic conductive film composition of the present invention may contain a thermoplastic resin, polyurethane beads, urethane (meth) acrylate, (meth) acrylate monomer, radical initiator, and conductive particles.

  The apparatus of the present invention may include an anisotropic conductive film manufactured with the anisotropic conductive film or the anisotropic conductive film composition.

  According to the present invention, there is provided an anisotropic conductive composition that has polyurethane beads and has no compatibility problem, good adhesion, and high reliability, an anisotropic conductive film manufactured therefrom, and an apparatus including the same. be able to.

  The anisotropic conductive film of the present invention may have an initial connection resistance of more than 0 and 1.2Ω or less, and a connection resistance change rate after 500 hours at 85 ° C. and 85% humidity may be more than 0 and less than 50%.

  The connection resistance change rate can be expressed by the following formula 1.

(In Formula 1, A is the initial connection resistance, and B is the connection resistance after 500 hours at 85 ° C. and 85% humidity)
The connection resistance change rate may be more than 0 and less than 50%, preferably more than 0 and 46% or less. Therefore, the anisotropic conductive film of this invention can provide high reliability with respect to connection resistance.

  The initial connection resistance is more than 0 and 1.2Ω or less, preferably 0.1 to 1.0Ω, and the connection resistance after 500 hours at 85 ° C. and 85% humidity is more than 0 and 5Ω or less, preferably 0.1 to 3Ω. possible.

  The connection resistance can be measured by an ordinary method for measuring an anisotropic conductive film. In the present application, a value measured by a four-probe method (four-probe method) is adopted.

  The anisotropic conductive film of the present invention may contain polyurethane beads, thermoplastic resin, urethane (meth) acrylate, (meth) acrylate monomer, radical initiator, and conductive particles.

  The average particle diameter (D50) of the polyurethane beads is preferably smaller than the average particle diameter (D50) of the conductive particles which are other components contained in the anisotropic conductive film. In other words, the ratio of the average particle diameter of the polyurethane beads to the average particle diameter of the conductive particles (average particle diameter of the polyurethane beads / average particle diameter of the conductive particles) is preferably less than 1. In the case of the said range, it is excellent in thin film coating property, an electrical property (initial connection resistance and connection resistivity), and adhesive force. Preferably, the average particle diameter of the polyurethane beads / the average particle diameter of the conductive particles is 0.005 or more and less than 1, more preferably 0.01 to 0.7.

  If the particle diameter of the polyurethane beads / the particle diameter of the conductive particles is 1 or more, the polyurethane beads in the anisotropic conductive film are inhibited from being sufficiently pressed by the polyurethane beads during thermocompression bonding, In some cases, a sufficient contact area between the inner metal electrode and the conductive particles cannot be ensured. If the particle size of the polyurethane beads / the particle size of the conductive particles is less than 1, it is stable after the thermocompression bonding due to the increase in the modulus due to the introduction of the polyurethane beads without inhibiting the crimping of the conductive particles as described above. Since a cured structure can be ensured, electrical characteristics and adhesive strength can be improved.

  In addition, the value calculated | required by measuring a 50 weight% cumulative average particle diameter by a laser diffraction scattering method is employ | adopted for the average particle diameter of a polyurethane bead and the following electroconductive particle.

(Polyurethane beads)
Polyurethane beads are spherical organic fine particles made of a crosslinked urethane resin, and have a single-layer structure that is not a multilayer structure. Despite being a single layer, polyurethane beads have a chemical structure similar to that of polyurethane resins or urethane acrylates contained in anisotropic conductive films, so they have good compatibility with other components that make up the film. In addition, since it has excellent dispersion characteristics, connection reliability can be improved. Also, when the polyurethane beads and the high molecular weight polyurethane resin are blended, the compatibility of the composition can be improved. The difference in compatibility due to the difference in molecular weight is a phenomenon that occurs between general linear polymers or cross-linked polymers, but there is no compatibility problem when added in a bead type. In particular, a high bond strength can be expressed by forming a secondary bond such as a hydrogen bond with a polyurethane resin or urethane acrylate. In addition, the presence of particles in the form of beads that are not in resin form prevents curing shrinkage when the anisotropic conductive film is cured, thereby reducing the internal stress of the anisotropic conductive film and increasing the connection reliability. .

  Polyurethane beads may be included in a binder part that serves as a matrix for forming an anisotropic conductive film together with a thermoplastic resin.

  The average particle size of the polyurethane beads may be 0.1 μm or more and less than 5 μm.

  When the average particle diameter of the polyurethane beads is within the above range, stress relaxation is further improved, the reliability under high temperature and high humidity is excellent, the thin film formation is suitably performed, and the electrical characteristics and connection reliability are good. Preferably, the diameter of the polyurethane beads can be 0.1 μm to 3 μm, more preferably 0.1 μm to less than 2 μm, most preferably 0.1 μm to 1 μm.

  The glass transition temperature (Tg) of the polyurethane beads can be −50 to 100 ° C. The glass transition temperature of polyurethane beads is lower than the glass transition temperature of organic fine particles made of an acrylic resin generally used in anisotropic conductive films. As described above, when beads having a low glass transition temperature are used, the function of stress relaxation can be reliably exhibited with the properties of an elastic body.

  The polyurethane beads may be included at 0.1 to 10% by weight with respect to 100% by weight of the anisotropic conductive film. Within the said range, high adhesive force and reliability can be provided to an anisotropic conductive film. Preferably, it may be contained at 1 to 6% by weight.

  One type of polyurethane beads may be used alone, or a plurality of types may be used.

(Thermoplastic resin)
A thermoplastic resin can contain 1 or more types chosen from the group which consists of a normal thermoplastic resin as a binder part which plays the role of a matrix required for formation of an anisotropically conductive film. For example, the thermoplastic resin can include one or more selected from the group consisting of polyurethane, acrylonitrile, acrylic, butadiene, polyamide, olefin, and silicon resins. More preferably, the thermoplastic resin may include a polyurethane resin, an acrylic resin, and a butadiene resin. A thermoplastic resin may be used individually by 1 type, and may be used together 2 or more types.

  In particular, the anisotropic conductive film of the present invention may contain a polyurethane resin as a thermoplastic resin for compatibility with polyurethane beads. At this time, the polyurethane-based resin may be included at 10 to 60% by weight with respect to 100% by weight of the anisotropic conductive film. When a polyurethane resin is used within the above range, it represents an improvement in adhesive strength and an improvement in reliability properties due to an increase in hydrogen bonds with polyurethane beads. Preferably, the polyurethane resin may be contained in the anisotropic conductive film at 30 to 40% by weight.

  The thermoplastic resin may be contained in the anisotropic conductive film at 15 to 82% by weight, preferably 30 to 70% by weight. Within the said range, film formation can be performed suitably.

  The weight average molecular weight of the thermoplastic resin may be 1,000 to 1,000,000 g / mol. Within the above range, film formation can be suitably performed, and phase separation does not occur because of compatibility with (meth) acrylates involved in other curing reactions.

  The glass transition temperature of the thermoplastic resin can be 30-120 ° C. Within this range, the reliability is good and the initial impression is good, so that sufficient electrical characteristics can be expressed.

(Urethane (meth) acrylate)
Urethane (meth) acrylate includes a urethane bond and unsaturated double bonds at both ends, and constitutes a cured portion. The urethane (meth) acrylate can improve the compatibility of the film by forming hydrogen bonds with the thermoplastic resin, particularly the polyurethane resin and polyurethane beads contained in the binder part of the film while being contained in the cured part.

  Urethane (meth) acrylate can be produced by making an isocyanate-excess intermediate by a polymerization reaction of a polyol and a diisocyanate and then polymerizing it with a (meth) acrylate having a hydroxy group. The type, temperature and time of the polymerization reaction are not particularly limited.

  As said polyol, it can use from ester type polyol, ether type polyol, or carbonate type polyol, and is not specifically limited.

  Examples of the diisocyanate include C6-C20 aromatic diisocyanate, C1-C10 aliphatic diisocyanate, and C3-C20 alicyclic diisocyanate, and are not particularly limited.

  As the (meth) acrylate having a hydroxy group, a C1-C20 (meth) acrylate having a hydroxy group can be used and is not particularly limited.

  The weight average molecular weight of the urethane (meth) acrylate may be 5,000 to 50,000 g / mol. Within the said range, formation of a film is performed suitably and compatibility can improve.

  Urethane (meth) acrylate may be contained at 15 to 40% by weight with respect to 100% by weight of the anisotropic conductive film. Within this range, the compatibility of the anisotropic conductive film can be improved. Preferably, it may be contained at 15 to 30% by weight.

  Urethane (meth) acrylate may be used individually by 1 type, and may be used multiple types.

((Meth) acrylate monomer)
The (meth) acrylate monomer can constitute a cured portion together with urethane (meth) acrylate. The (meth) acrylate monomer serves as a reactive diluent and a reactive monomer in the anisotropic conductive film composition. The (meth) acrylate monomer is not particularly limited, but 1,6-hexanediol mono (meth) acrylate, 2-hydroxyethyl (meth) acrylate, 2-hydroxypropyl (meth) acrylate, 2-hydroxybutyl (meth) ) Acrylate, 2-hydroxy-3-phenyloxypropyl (meth) acrylate, 1,4-butanediol (meth) acrylate, 2-hydroxyethyl (meth) acryloyl phosphate, 4-hydroxycyclohexyl (meth) acrylate, neopentyl glycol Mono (meth) acrylate, trimethylolethane di (meth) acrylate, trimethylolpropane di (meth) acrylate, pentaerythritol tri (meth) acrylate, dipentaerythritol penta (meth) acryl , Pentaerythritol hexa (meth) acrylate, dipentaerythritol hexa (meth) acrylate, glycerin di (meth) acrylate, hydrofurfuryl (meth) acrylate, isodecyl (meth) acrylate, 2- (2-ethoxyethoxy) ethyl (Meth) acrylate, stearyl (meth) acrylate, lauryl (meth) acrylate, 2-phenoxyethyl (meth) acrylate, isobornyl (meth) acrylate, tridecyl (meth) acrylate, ethoxy addition type nonylphenol (meth) acrylate, ethylene glycol di (Meth) acrylate, triethylene glycol di (meth) acrylate, tetraethylene glycol di (meth) acrylate, polyethylene glycol di (meth) acrylate 1,3-butylene glycol di (meth) acrylate, tripropylene glycol di (meth) acrylate, ethoxy addition bisphenol-A di (meth) acrylate, cyclohexanedimethanol di (meth) acrylate, phenoxy-t-glycol (meth) It may be one or more selected from the group consisting of acrylate, 2-methacryloyloxymethyl phosphate, 2-methacryloyloxyethyl phosphate, dimethylol tricyclodecane di (meth) acrylate, trimethylolpropane benzoate acrylate, and mixtures thereof. It is not limited to these.

  The (meth) acrylate monomer may be contained in an amount of 1 to 20% by weight, preferably 2 to 15% by weight with respect to 100% by weight of the anisotropic conductive film. Within the said range, the connection reliability of an anisotropic conductive film may become high.

  One (meth) acrylate monomer may be used alone, or a plurality of (meth) acrylate monomers may be used.

(Radical initiator)
As a radical initiator which is another component of the cured portion of the anisotropic conductive film of the present invention, one or more kinds in a photopolymerization initiator or a thermosetting initiator can be used in combination.

  Examples of the photopolymerization initiator include benzophenone, methyl o-benzoylbenzoate, 4-benzoyl-4-methyldiphenyl sulfide, isopropylthioxanthone, diethylthioxanthone, ethyl 4-diethylbenzoate, benzoin ether, benzoylpropyl ether, 2- Although there are hydroxy-2-methyl-1-phenylpropan-1-one, diethoxyacetophenone, and the like, it is not limited thereto.

  The thermosetting initiator is not particularly limited, and a peroxide type or an azo type can be used. Examples of peroxide initiators include, but are not limited to, lauryl peroxide, benzoyl peroxide, cumene hydroperoxide, and the like. As the azo initiator, 2,2′-azobis (4-methoxy-2,4-dimethylvaleronitrile), dimethyl 2,2′-azobis (2-methylpropionate), 2,2′-azobis ( N-cyclohexyl-2-methylpropioamide) and the like can be used, but are not limited thereto.

  The radical initiator may be included at 0.9 to 5% by weight, preferably 1 to 5% by weight with respect to 100% by weight of the anisotropic conductive film.

(Conductive particles)
The conductive particles are used as a filler for imparting conductive performance with the composition of the anisotropic conductive film of the present invention. Examples of the conductive particles include gold (Au), silver (Ag), nickel (Ni), copper (Cu), palladium (Pd), metal particles such as lead and tin, and metal particles of these alloys such as solder; Carbon; metal-coated resin particles (for example, polyethylene, polypropylene, polyester, polystyrene, polyvinyl alcohol, etc. and modified resins thereof are used as particles, and other conductive materials such as gold (Au), silver (Ag ), Nickel (Ni), copper (Cu), palladium (Pd), lead, tin, solder, etc.); conductive particles coated with insulating particles, and the like.

  The size of the conductive particles is not particularly limited, but those having an average particle size larger than the average particle size of the polyurethane beads are preferable. By doing so, expression of stable electrical characteristics and connection reliability can be improved. Furthermore, adhesion performance is also improved. For example, the average particle size of the conductive particles can be 1 μm to 20 μm. Preferably, it can be 1 μm to 5 μm.

  The conductive particles may be included at 1 to 10% by weight with respect to 100% by weight of the anisotropic conductive film. Considering electrical characteristics such as a short circuit within the above range, stable electrical characteristics can be expressed. Preferably it may be contained at 1 to 5% by weight.

  In addition, the anisotropic conductive film of the present invention may further contain additives such as a polymerization inhibitor, an antioxidant, and a heat stabilizer in order to provide additional physical properties as long as the basic physical properties are not impaired. it can. Although an additive in particular is not restrict | limited, 0.01 to 10weight% may be contained with respect to 100 weight% of anisotropic conductive films.

  The polymerization inhibitor may be selected from the group consisting of hydroquinone, hydroquinone monomethyl ether, p-benzoquinone, phenothiazine and mixtures thereof. As the antioxidant, phenolic or hydroxycinnamate-based substances can be used. For example, tetrakis- (methylene- (3,5-di-t-butyl-4-hydroxycinnamate) methane, 3,5-bis (1,1-dimethylethyl) -4-hydroxybenzenepropanoic acid, thiol di-2 , 1-ethanediyl ester and the like can be used.

  When forming an anisotropic conductive film, no special equipment or equipment is required. For example, the following anisotropic conductive film composition is dissolved in an organic solvent such as toluene to form a solution, and then stirred for a certain time within a range where the conductive particles are not pulverized, and this is placed on the release film. An anisotropic conductive film can be obtained by applying a constant thickness, for example, 10 to 50 μm, followed by drying for a predetermined time to volatilize toluene or the like.

  Another aspect of the present invention provides an anisotropic conductive film composition comprising polyurethane beads, thermoplastic resin, urethane (meth) acrylate, (meth) acrylate monomer, radical initiator and conductive particles.

  The contents of the polyurethane beads, thermoplastic resin, urethane (meth) acrylate, (meth) acrylate monomer, radical initiator, and conductive particles are as described above.

  Still another embodiment of the present invention provides an apparatus including the anisotropic conductive film formed of the anisotropic conductive film or the anisotropic conductive film composition. Examples of the device include various display devices and semiconductor devices including a liquid crystal display device using an anisotropic conductive film as a connection material between modules.

  Hereinafter, the configuration and operation of the present invention will be described in more detail with reference to preferred embodiments of the present invention. However, this is presented as a preferred example of the present invention and should not be construed as limiting the present invention in any way.

  Since the contents not described here can be sufficiently technically analogized by those skilled in the art, description thereof will be omitted.

Example 1: Production of anisotropic conductive film composition Polyurethane beads (manufactured by Negami Kogyo Co., Ltd., average particle size: 0.1 μm, glass transition temperature 15 ° C.) as a binder resin part that acts as a matrix for film formation 3% by weight; polyurethane resin (UN5500, manufactured by Negami Kogyo Co., Ltd., weight average molecular weight 50,000) 32% by weight; NBR (acrylonitrile-butadiene rubber) resin (N) dissolved in toluene / methyl ethyl ketone at 30% by volume -34, manufactured by Nippon Zeon Co., Ltd.) 5% by weight; and acrylic resin (alkyl methacrylate resin, weight average molecular weight 90,000 g / mol, acid value 2 KOH mg / mg, MMA (methyl methacrylate), BA (butyl acrylate), Cyclohexyl metaacryl 24% by weight of copolymer). As a cured part in which the curing reaction is carried out, urethane acrylate (UN 5507, manufactured by Negami Kogyo Co., Ltd.) 25% by weight, 2-methacryloyloxyethyl phosphate 1% by weight as reactive monomer, pentaerythritol tri (meth) acrylate 2% by weight, 2 -It was included at 2.5% by weight of hydroxyethyl (meth) acrylate. Lauryl peroxide 2.5 wt% as a thermosetting initiator; conductive particles (grade: NIEYB2-003-S, average particle size: 3 μm, Sekisui Chemical Co., Ltd.) as an electrically conductive filler 3 without insulation treatment A film composition was produced by including the content by weight.

Example 2: Production of anisotropic conductive film composition Except that 21% by weight of acrylic resin and 6% by weight of polyurethane beads were used in Example 1, a film composition was prepared by carrying out the same method. Manufactured.

Examples 3 to 4: Manufacture of anisotropic conductive film composition Except that the size of the polyurethane beads in Example 1 was changed as shown in Table 1 below, the same method was carried out to form a film composition. Manufactured.

The glass transition temperature of polyurethane beads having an average particle diameter of 0.8 μm is 40 ° C., and the glass transition temperature of polyurethane beads having an average particle diameter of 1.0 μm is 40 ° C.
Comparative Example 1 Production of Anisotropic Conductive Film Composition A film composition was produced in the same manner as in Example 1 except that polyurethane beads were not used in Example 1.

Experimental Example: Measurement of Physical Properties of Anisotropic Conductive Film After diluting 20 g of the anisotropic conductive film composition produced in the examples and comparative examples using 1.5 g of toluene, the mixture was stirred for 30 minutes. The anisotropic conductive film was obtained by apply | coating with a thickness of 16 micrometers on a release film, making it dry for 5 minutes, and volatilizing toluene. The adhesive strength and connection resistance of the manufactured anisotropic conductive film and the reliability of the adhesive strength and connection resistance after 500 hours at 85 ° C. and 85% relative humidity were evaluated. The results are shown in Table 2.

<Method of measuring physical properties>
1. Adhesive strength: Anisotropic conductive films manufactured in Examples and Comparative Examples were allowed to stand at 25 ° C. for 1 hour, and then used ITO glass (indium tin oxide glass), COF, and TCP (Tape Carrier Package). The connection was made under temporary pressing conditions of 70 ° C. for 1 second and main pressing conditions of 180 ° C., 5 seconds and 4.5 MPa. Five pieces of each specimen were prepared, and 90 ° adhesive strength was measured for the produced specimen.

  2. Connection resistance: The connection resistance was measured for the specimen by a four-probe method.

  3. Reliability: The prepared specimen was maintained at 85 ° C. and 85% relative humidity for 500 hours, and the adhesive strength and connection resistance were measured by the same method as described above.

  As shown in Table 2, the anisotropic conductive film of the present invention containing polyurethane beads has good adhesion, low initial connection resistance, and good reliability in adhesion and connection resistance. On the other hand, it can be seen that the anisotropic conductive film of Comparative Example 1 containing no polyurethane beads is not reliable due to the connection resistance and the adhesive force. Moreover, the compatibility of the anisotropic conductive film composition of an Example was also favorable.

  The embodiments of the present invention have been described above with reference to the accompanying drawings and tables. However, the present invention is not limited to the above-described embodiments, and can be manufactured in various different forms. Those who have ordinary knowledge in the field can understand that the present invention can be implemented in other specific forms without changing the technical idea and essential features of the present invention. Therefore, it should be understood that the above embodiments are illustrative in all aspects and not limiting.

Claims (14)

Only contains a polyurethane beads and conductive particles,
The anisotropic conductive film wherein the ratio of the average particle diameter of the polyurethane beads to the average particle diameter of the conductive particles is less than 1, and the average particle diameter of the polyurethane beads is 0.1 μm or more and less than 2 μm . The initial connection resistance is greater than 0 and less than or equal to 1.2Ω, and the connection resistance change rate represented by the following formula 1 after 500 hours at 85 ° C. and 85% humidity is greater than 0 and less than 50%. Including anisotropic conductive film;
(In the formula 1, A is the initial connection resistance of the anisotropic conductive film, B is the anisotropically conductive film at 85 ° C. and 85% humidity is measured connection resistance after 500 hours) a ,
The anisotropic conductive film wherein the ratio of the average particle diameter of the polyurethane beads to the average particle diameter of the conductive particles is less than 1, and the average particle diameter of the polyurethane beads is 0.1 μm or more and less than 2 μm . The anisotropic conductive film of Claim 1 or 2 whose average particle diameter of the said polyurethane bead is 0.1-1 micrometer. The anisotropic conductive film according to any one of claims 1 to 3, before the average particle size of Kishirube conductive particles is characterized by a 1 m to 20 m. The polyurethane beads anisotropic conductive film according to any one of claims 1 to 4, characterized in that said included in 0.1 to 10% by weight relative to the anisotropically conductive film 100 wt%. Glass transition temperature of the polyurethane beads (Tg) of anisotropic conductive film according to any one of claims 1 to 5, characterized in that a -50 to 100 ° C.. Thermoplastic resin, and the anisotropic conductive film according to any one of claims 1 to 6, further comprising a urethane (meth) acrylate. The thermoplastic resin, polyurethane resin; claim 7, characterized in that it comprises, as well as acrylonitrile, acrylic, butadiene, polyamide, at least one member selected from the group consisting of olefin and silicon-based resin Anisotropic conductive film. The anisotropic resin according to claim 8 , wherein the thermoplastic resin is a polyurethane-based resin, and the polyurethane-based resin is included in an amount of 10 to 60% by weight with respect to 100% by weight of the anisotropic conductive film. Conductive film. 1,6-hexanediol mono (meth) acrylate, 2-hydroxyethyl (meth) acrylate, 2-hydroxypropyl (meth) acrylate, 2-hydroxybutyl (meth) acrylate, 2-hydroxy-3-phenyloxypropyl (meth) ) Acrylate, 1,4-butanediol (meth) acrylate, 2-hydroxyethyl (meth) acryloyl phosphate, 4-hydroxycyclohexyl (meth) acrylate, neopentyl glycol mono (meth) acrylate, trimethylolethane di (meth) acrylate , Trimethylolpropane di (meth) acrylate, pentaerythritol tri (meth) acrylate, dipentaerythritol penta (meth) acrylate, pentaerythritol hexa (meth) acrylate Dipentaerythritol hexa (meth) acrylate, glycerin di (meth) acrylate, hydrofurfuryl (meth) acrylate, isodecyl (meth) acrylate, 2- (2-ethoxyethoxy) ethyl (meth) acrylate, stearyl (meth) Acrylate, lauryl (meth) acrylate, 2-phenoxyethyl (meth) acrylate, isobornyl (meth) acrylate, tridecyl (meth) acrylate, ethoxy addition nonylphenol (meth) acrylate, ethylene glycol di (meth) acrylate, triethylene glycol di (Meth) acrylate, tetraethylene glycol di (meth) acrylate, polyethylene glycol di (meth) acrylate, 1,3-butylene glycol di (meth) acrylate Tripropylene glycol di (meth) acrylate, ethoxy addition type bisphenol-A di (meth) acrylate, cyclohexanedimethanol di (meth) acrylate, phenoxy-t-glycol (meth) acrylate, 2-methacryloyloxymethyl phosphate, 2-methacryloyl It further comprises one or more (meth) acrylic monomers selected from the group consisting of oxyethyl phosphate, dimethylol tricyclodecane di (meth) acrylate, trimethylolpropane benzoate acrylate, and mixtures thereof. the anisotropic conductive film according to any one of claims 1-9. Furthermore, a radical initiator is included, and the thermoplastic resin is 15 to 82% by weight, the polyurethane beads are 0.1 to 10% by weight, and the urethane (meth) acrylate is 15 to 40% by weight with respect to 100% by weight of the anisotropic conductive film. %, wherein (meth) acrylate monomer 1 to 20% by weight, different according to claim 10, characterized in that it comprises a radical initiator 0.9 to 5% by weight and 1 to 10% by weight the conductive particles Conductive film. Polyurethane beads, thermoplastic resin, urethane (meth) acrylate, (meth) acrylate monomer, viewed contains a radical initiator and the conductive particles, the ratio of the average particle size of the polyurethane beads to the average particle diameter of the conductive particles Is an anisotropic conductive film composition , wherein the polyurethane beads have an average particle size of 0.1 μm or more and less than 2 μm . An anisotropic conductive film formed from the anisotropic conductive film composition according to claim 12. Device comprising an anisotropic conductive film or anisotropic conductive film produced in anisotropic conductive film composition according to claim 12 according to any one of claims 1 to 11.