JP5832092B2 - 少ない吸湿性の可塑剤含有フィルムを有する光起電力モジュール - Google Patents
少ない吸湿性の可塑剤含有フィルムを有する光起電力モジュール Download PDFInfo
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- JP5832092B2 JP5832092B2 JP2010527470A JP2010527470A JP5832092B2 JP 5832092 B2 JP5832092 B2 JP 5832092B2 JP 2010527470 A JP2010527470 A JP 2010527470A JP 2010527470 A JP2010527470 A JP 2010527470A JP 5832092 B2 JP5832092 B2 JP 5832092B2
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- 239000004014 plasticizer Substances 0.000 title claims description 38
- 125000002777 acetyl group Chemical class [H]C([H])([H])C(*)=O 0.000 claims description 37
- 229920002554 vinyl polymer Polymers 0.000 claims description 36
- DHKHKXVYLBGOIT-UHFFFAOYSA-N acetaldehyde Diethyl Acetal Natural products CCOC(C)OCC DHKHKXVYLBGOIT-UHFFFAOYSA-N 0.000 claims description 26
- 239000004065 semiconductor Substances 0.000 claims description 20
- 229920002037 poly(vinyl butyral) polymer Polymers 0.000 claims description 16
- 239000004372 Polyvinyl alcohol Substances 0.000 claims description 14
- 238000004519 manufacturing process Methods 0.000 claims description 14
- 229920002451 polyvinyl alcohol Polymers 0.000 claims description 14
- 230000009477 glass transition Effects 0.000 claims description 10
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 7
- PYGXAGIECVVIOZ-UHFFFAOYSA-N Dibutyl decanedioate Chemical compound CCCCOC(=O)CCCCCCCCC(=O)OCCCC PYGXAGIECVVIOZ-UHFFFAOYSA-N 0.000 claims description 5
- SAOKZLXYCUGLFA-UHFFFAOYSA-N bis(2-ethylhexyl) adipate Chemical compound CCCCC(CC)COC(=O)CCCCC(=O)OCC(CC)CCCC SAOKZLXYCUGLFA-UHFFFAOYSA-N 0.000 claims description 5
- BJQHLKABXJIVAM-UHFFFAOYSA-N bis(2-ethylhexyl) phthalate Chemical compound CCCCC(CC)COC(=O)C1=CC=CC=C1C(=O)OCC(CC)CCCC BJQHLKABXJIVAM-UHFFFAOYSA-N 0.000 claims description 5
- VJHINFRRDQUWOJ-UHFFFAOYSA-N dioctyl sebacate Chemical compound CCCCC(CC)COC(=O)CCCCCCCCC(=O)OCC(CC)CCCC VJHINFRRDQUWOJ-UHFFFAOYSA-N 0.000 claims description 5
- OJXOOFXUHZAXLO-UHFFFAOYSA-M magnesium;1-bromo-3-methanidylbenzene;bromide Chemical compound [Mg+2].[Br-].[CH2-]C1=CC=CC(Br)=C1 OJXOOFXUHZAXLO-UHFFFAOYSA-M 0.000 claims description 5
- 230000001698 pyrogenic effect Effects 0.000 claims description 5
- 229910004298 SiO 2 Inorganic materials 0.000 claims description 4
- OLAQBFHDYFMSAJ-UHFFFAOYSA-L 1,2-bis(7-methyloctyl)cyclohexane-1,2-dicarboxylate Chemical compound CC(C)CCCCCCC1(C([O-])=O)CCCCC1(CCCCCCC(C)C)C([O-])=O OLAQBFHDYFMSAJ-UHFFFAOYSA-L 0.000 claims description 3
- 239000004803 Di-2ethylhexylphthalate Substances 0.000 claims description 3
- 125000004432 carbon atom Chemical group C* 0.000 claims description 3
- 150000001875 compounds Chemical class 0.000 claims description 3
- 229910021645 metal ion Inorganic materials 0.000 claims description 3
- 239000011118 polyvinyl acetate Substances 0.000 claims description 3
- 229920002689 polyvinyl acetate Polymers 0.000 claims description 3
- 229940116351 sebacate Drugs 0.000 claims description 3
- 229910052799 carbon Inorganic materials 0.000 claims description 2
- 229910052739 hydrogen Inorganic materials 0.000 claims description 2
- 125000004435 hydrogen atom Chemical group [H]* 0.000 claims description 2
- 229910052760 oxygen Inorganic materials 0.000 claims description 2
- 125000004430 oxygen atom Chemical group O* 0.000 claims description 2
- 239000010410 layer Substances 0.000 description 23
- 238000000034 method Methods 0.000 description 16
- 239000011521 glass Substances 0.000 description 11
- 239000000853 adhesive Substances 0.000 description 8
- 230000001070 adhesive effect Effects 0.000 description 7
- 239000002131 composite material Substances 0.000 description 6
- 238000005259 measurement Methods 0.000 description 6
- 238000010438 heat treatment Methods 0.000 description 5
- 238000010030 laminating Methods 0.000 description 5
- 238000007740 vapor deposition Methods 0.000 description 4
- QTBSBXVTEAMEQO-UHFFFAOYSA-M Acetate Chemical compound CC([O-])=O QTBSBXVTEAMEQO-UHFFFAOYSA-M 0.000 description 3
- 229910052784 alkaline earth metal Inorganic materials 0.000 description 3
- 150000002500 ions Chemical class 0.000 description 3
- 239000000203 mixture Substances 0.000 description 3
- 229920003023 plastic Polymers 0.000 description 3
- 239000004033 plastic Substances 0.000 description 3
- ZTQSAGDEMFDKMZ-UHFFFAOYSA-N Butyraldehyde Chemical compound CCCC=O ZTQSAGDEMFDKMZ-UHFFFAOYSA-N 0.000 description 2
- FAPWRFPIFSIZLT-UHFFFAOYSA-M Sodium chloride Chemical compound [Na+].[Cl-] FAPWRFPIFSIZLT-UHFFFAOYSA-M 0.000 description 2
- XTXRWKRVRITETP-UHFFFAOYSA-N Vinyl acetate Chemical compound CC(=O)OC=C XTXRWKRVRITETP-UHFFFAOYSA-N 0.000 description 2
- 238000006359 acetalization reaction Methods 0.000 description 2
- 239000002313 adhesive film Substances 0.000 description 2
- WNLRTRBMVRJNCN-UHFFFAOYSA-L adipate(2-) Chemical compound [O-]C(=O)CCCCC([O-])=O WNLRTRBMVRJNCN-UHFFFAOYSA-L 0.000 description 2
- 150000001299 aldehydes Chemical class 0.000 description 2
- -1 alkaline earth metal salts Chemical class 0.000 description 2
- HORIEOQXBKUKGQ-UHFFFAOYSA-N bis(7-methyloctyl) cyclohexane-1,2-dicarboxylate Chemical compound CC(C)CCCCCCOC(=O)C1CCCCC1C(=O)OCCCCCCC(C)C HORIEOQXBKUKGQ-UHFFFAOYSA-N 0.000 description 2
- 238000005266 casting Methods 0.000 description 2
- 239000003795 chemical substances by application Substances 0.000 description 2
- 239000013078 crystal Substances 0.000 description 2
- 230000007423 decrease Effects 0.000 description 2
- 238000000151 deposition Methods 0.000 description 2
- 230000008021 deposition Effects 0.000 description 2
- 239000004806 diisononylester Substances 0.000 description 2
- 238000005538 encapsulation Methods 0.000 description 2
- 239000005038 ethylene vinyl acetate Substances 0.000 description 2
- HHLFWLYXYJOTON-UHFFFAOYSA-N glyoxylic acid Chemical compound OC(=O)C=O HHLFWLYXYJOTON-UHFFFAOYSA-N 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 150000007524 organic acids Chemical class 0.000 description 2
- 235000005985 organic acids Nutrition 0.000 description 2
- 229920001200 poly(ethylene-vinyl acetate) Polymers 0.000 description 2
- SCVFZCLFOSHCOH-UHFFFAOYSA-M potassium acetate Chemical compound [K+].CC([O-])=O SCVFZCLFOSHCOH-UHFFFAOYSA-M 0.000 description 2
- 230000005855 radiation Effects 0.000 description 2
- 229920005989 resin Polymers 0.000 description 2
- 239000011347 resin Substances 0.000 description 2
- 238000004544 sputter deposition Methods 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- HGBOYTHUEUWSSQ-UHFFFAOYSA-N valeric aldehyde Natural products CCCCC=O HGBOYTHUEUWSSQ-UHFFFAOYSA-N 0.000 description 2
- 238000009736 wetting Methods 0.000 description 2
- WTTWSMJHJFNCQB-UHFFFAOYSA-N 2-(dibenzylamino)ethanol Chemical compound C=1C=CC=CC=1CN(CCO)CC1=CC=CC=C1 WTTWSMJHJFNCQB-UHFFFAOYSA-N 0.000 description 1
- GCDUWJFWXVRGSM-UHFFFAOYSA-N 2-[2-(2-heptanoyloxyethoxy)ethoxy]ethyl heptanoate Chemical compound CCCCCCC(=O)OCCOCCOCCOC(=O)CCCCCC GCDUWJFWXVRGSM-UHFFFAOYSA-N 0.000 description 1
- SSKNCQWPZQCABD-UHFFFAOYSA-N 2-[2-[2-(2-heptanoyloxyethoxy)ethoxy]ethoxy]ethyl heptanoate Chemical compound CCCCCCC(=O)OCCOCCOCCOCCOC(=O)CCCCCC SSKNCQWPZQCABD-UHFFFAOYSA-N 0.000 description 1
- OYPRJOBELJOOCE-UHFFFAOYSA-N Calcium Chemical compound [Ca] OYPRJOBELJOOCE-UHFFFAOYSA-N 0.000 description 1
- VGGSQFUCUMXWEO-UHFFFAOYSA-N Ethene Chemical compound C=C VGGSQFUCUMXWEO-UHFFFAOYSA-N 0.000 description 1
- IMROMDMJAWUWLK-UHFFFAOYSA-N Ethenol Chemical compound OC=C IMROMDMJAWUWLK-UHFFFAOYSA-N 0.000 description 1
- 239000005977 Ethylene Substances 0.000 description 1
- FYYHWMGAXLPEAU-UHFFFAOYSA-N Magnesium Chemical compound [Mg] FYYHWMGAXLPEAU-UHFFFAOYSA-N 0.000 description 1
- 229920001744 Polyaldehyde Polymers 0.000 description 1
- 239000002253 acid Substances 0.000 description 1
- 150000007513 acids Chemical class 0.000 description 1
- 239000012790 adhesive layer Substances 0.000 description 1
- 239000003513 alkali Substances 0.000 description 1
- 229910052783 alkali metal Inorganic materials 0.000 description 1
- 150000001340 alkali metals Chemical class 0.000 description 1
- 230000000181 anti-adherent effect Effects 0.000 description 1
- 238000001479 atomic absorption spectroscopy Methods 0.000 description 1
- 230000004888 barrier function Effects 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- DQXBYHZEEUGOBF-UHFFFAOYSA-N but-3-enoic acid;ethene Chemical compound C=C.OC(=O)CC=C DQXBYHZEEUGOBF-UHFFFAOYSA-N 0.000 description 1
- 229910052791 calcium Inorganic materials 0.000 description 1
- 239000011575 calcium Substances 0.000 description 1
- 238000007707 calorimetry Methods 0.000 description 1
- 125000003178 carboxy group Chemical group [H]OC(*)=O 0.000 description 1
- 239000000969 carrier Substances 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
- 230000001143 conditioned effect Effects 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 238000004132 cross linking Methods 0.000 description 1
- 239000003431 cross linking reagent Substances 0.000 description 1
- 230000032798 delamination Effects 0.000 description 1
- 238000009792 diffusion process Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000008393 encapsulating agent Substances 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 229920001038 ethylene copolymer Polymers 0.000 description 1
- 239000007789 gas Substances 0.000 description 1
- 229910052749 magnesium Inorganic materials 0.000 description 1
- 239000011777 magnesium Substances 0.000 description 1
- UEGPKNKPLBYCNK-UHFFFAOYSA-L magnesium acetate Chemical compound [Mg+2].CC([O-])=O.CC([O-])=O UEGPKNKPLBYCNK-UHFFFAOYSA-L 0.000 description 1
- 235000011285 magnesium acetate Nutrition 0.000 description 1
- 239000011654 magnesium acetate Substances 0.000 description 1
- 229940069446 magnesium acetate Drugs 0.000 description 1
- 239000000155 melt Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 150000007522 mineralic acids Chemical class 0.000 description 1
- 229920003229 poly(methyl methacrylate) Polymers 0.000 description 1
- 239000004926 polymethyl methacrylate Substances 0.000 description 1
- 235000011056 potassium acetate Nutrition 0.000 description 1
- 239000005336 safety glass Substances 0.000 description 1
- 150000003839 salts Chemical class 0.000 description 1
- CXMXRPHRNRROMY-UHFFFAOYSA-L sebacate(2-) Chemical compound [O-]C(=O)CCCCCCCCC([O-])=O CXMXRPHRNRROMY-UHFFFAOYSA-L 0.000 description 1
- RMAQACBXLXPBSY-UHFFFAOYSA-N silicic acid Chemical compound O[Si](O)(O)O RMAQACBXLXPBSY-UHFFFAOYSA-N 0.000 description 1
- 235000012239 silicon dioxide Nutrition 0.000 description 1
- 239000011780 sodium chloride Substances 0.000 description 1
- 230000003746 surface roughness Effects 0.000 description 1
- 229920001897 terpolymer Polymers 0.000 description 1
- 150000003751 zinc Chemical class 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/04—Oxygen-containing compounds
- C08K5/10—Esters; Ether-esters
- C08K5/12—Esters; Ether-esters of cyclic polycarboxylic acids
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B17/00—Layered products essentially comprising sheet glass, or glass, slag, or like fibres
- B32B17/06—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material
- B32B17/10—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material of synthetic resin
- B32B17/10005—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material of synthetic resin laminated safety glass or glazing
- B32B17/1055—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material of synthetic resin laminated safety glass or glazing characterized by the resin layer, i.e. interlayer
- B32B17/10688—Adjustment of the adherence to the glass layers
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B17/00—Layered products essentially comprising sheet glass, or glass, slag, or like fibres
- B32B17/06—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material
- B32B17/10—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material of synthetic resin
- B32B17/10005—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material of synthetic resin laminated safety glass or glazing
- B32B17/1055—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material of synthetic resin laminated safety glass or glazing characterized by the resin layer, i.e. interlayer
- B32B17/10761—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material of synthetic resin laminated safety glass or glazing characterized by the resin layer, i.e. interlayer containing vinyl acetal
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
- C08J5/18—Manufacture of films or sheets
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/04—Oxygen-containing compounds
- C08K5/10—Esters; Ether-esters
- C08K5/101—Esters; Ether-esters of monocarboxylic acids
- C08K5/103—Esters; Ether-esters of monocarboxylic acids with polyalcohols
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/04—Oxygen-containing compounds
- C08K5/10—Esters; Ether-esters
- C08K5/11—Esters; Ether-esters of acyclic polycarboxylic acids
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/04—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices
- H01L31/042—PV modules or arrays of single PV cells
- H01L31/048—Encapsulation of modules
- H01L31/0481—Encapsulation of modules characterised by the composition of the encapsulation material
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J2329/00—Characterised by the use of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by an alcohol, ether, aldehydo, ketonic, acetal, or ketal radical; Hydrolysed polymers of esters of unsaturated alcohols with saturated carboxylic acids; Derivatives of such polymer
- C08J2329/14—Homopolymers or copolymers of acetals or ketals obtained by polymerisation of unsaturated acetals or ketals or by after-treatment of polymers of unsaturated alcohols
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
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- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Photovoltaic Devices (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Laminated Bodies (AREA)
- Joining Of Glass To Other Materials (AREA)
- Manufacture Of Macromolecular Shaped Articles (AREA)
Description
光起電力モジュールは、外部の影響から保護するために透明カバーを備えている感光性半導体層からなる。感光性半導体層としては、担体上の単結晶ソーラーセルまたは多結晶の薄手の半導体層を使用することができる。薄層のソーラーモジュールは、多くの場合に透明板の上に、例えば蒸着、気相析出、スパッタリングまたは湿式析出によって施こされている感光性半導体層からなる。
従って、本発明の課題は、光起電力モジュールの製造のために、少ない吸湿性を有するポリビニルアセタールを基礎とする可塑剤含有フィルムを提供することである。
従って、本発明の対象は、
a)前面透明カバーと
b)1つ以上の感光性半導体層と
c)ポリビニルアセタールを基礎とする少なくとも1つの可塑剤含有フィルムと
d)背面のカバーとからなる貼合せシートを含む光起電力モジュールであり、この場合ポリビニルアセタールは、20質量%未満のポリビニルアルコール含量を有する。
名称 略記 100×O/(C+H)
ジ−2−エチルヘキシルセバケート (DOS) 5.3
ジ−2−エチルヘキシルアジペート (DOA) 6.3
ジ−2−エチルヘキシルフタレート (DOP) 6.5
ジヘキシルアジペート (DHA) 7.7
ジブチルセバケート (DBS) 7.7
ジ−2−ブトキシエチルセバケート (DBES) 9.4
トリエチレングリコール−ビス−2−エチルヘキサノエート (3G8) 9.4
1,2−シクロヘキサンジカルボン酸ジイソノニルエステル (DINCH) 5.4
名称 略記 100×O/(C+H)
トリエチレングリコール−ビス−n−ヘプタノエート 3G7 10.3
テトラエチレングリコール−ビス−n−ヘプタノエート 4G7 10.9
ジ−2−ブトキシエチルアジペート DBEA 11.5
ジ−2−ブトキシエトキシエチルアジペート DBEEA 12.5
フィルムのガラス転移温度は、−50℃〜150℃の温度間隔で10K/分の加熱速度を使用しながらDIN 53765に記載の動的差分熱量測定法(Dynamischer Differenzkalorimetrie (DSC))により測定される。第1の加熱傾斜路、続いて冷却傾斜路、続いて第2の加熱傾斜路が使用される。ガラス転移温度の位置は、第2の加熱傾斜路に属する測定曲線でDIN 51007により算出される。DIN中心点(Tg DIN)は、半分の段高さでの水平方向での線と測定曲線との交叉点として定義されている。この段高さは、ガラス転移の前および後の測定曲線の基線との中間接線の2つの交叉点での垂直方向の距離によって定義される。
3G8:トリエチレングリコール−ビス−2−エチルヘキサノエート
DOS ジ−2−エチルヘキシルセバケート
DOA ジ−2−エチルヘキシルアジペート
DOP ジ−2−エチルヘキシルフタレート
DHA ジヘキシルアジペート
DBS ジブチルセバケート
DBES ジ−2−ブトキシエチルセバケート
DINCH 1,2シクロヘキサンジカルボン酸ジイソノニルエステル。
Claims (8)
- a)透明の前面カバーと
b)1つ以上の感光性半導体層と
c)ポリビニルアセタールを基礎とする少なくとも1つの可塑剤含有フィルムと
d)背面のカバーとからなる貼合せシート
を含む光起電力モジュールにおいて、
前記ポリビニルアセタールが20質量%未満のポリビニルアルコール含量を有し、前記可塑剤含有フィルムc)が少なくとも20℃のガラス転移温度Tg、最大26質量%の可塑剤含量、最大2.3質量%の含水量および0.001〜15質量%の熱分解法SiO 2 含量を有することを特徴とする、上記光起電力モジュール。 - ポリビニルアセタールが5質量%未満のポリビニルアセテート含量を有する、請求項1記載の光起電力モジュール。
- 可塑剤として、式100×O/(C+H)によって表わされる極性が9.4以下である1つ以上の化合物が使用されており、この場合O、CおよびHは、それぞれの分子中の酸素原子、炭素原子および水素原子の数を表わす、請求項1または2に記載の光起電力モジュール。
- 可塑剤としてジ−2−エチルヘキシルセバケート、ジ−2−エチルヘキシルアジペート、ジ−2−エチルヘキシルフタレート、ジヘキシルアジペート、ジブチルセバケート、ジ−2−ブトキシエチルセバケート、1,2−シクロヘキサンジカルボン酸ジイソノニルエステルおよびトリエチレングリコール−ビス−2−エチルヘキサノエートの群からの1つ以上の化合物が使用されている、請求項1から3までのいずれか1項に記載の光起電力モジュール。
- ポリビニルアセタールを基礎とする可塑剤含有フィルムが金属イオン50ppm未満を含有する、請求項1から4までのいずれか1項に記載の光起電力モジュール。
- ポリビニルアセタールを基礎とする可塑剤含有フィルムが0.001〜5質量%の熱分解法SiO 2 含量を有する、請求項1から5までのいずれか1項に記載の光起電力モジュール。
- ポリビニルアセタールとしてポリビニルブチラールが使用されている、請求項1から6までのいずれか1項に記載の光起電力モジュール。
- 光起電力モジュールの製造のための、ポリビニルアセタールを基礎とする可塑剤含有フィルムの使用であって、この場合このポリビニルアセタールは、20質量%未満のポリビニルアルコール含量を有し、かつ前記可塑剤含有フィルムが少なくとも20℃のガラス転移温度Tg、最大26質量%の可塑剤含量、最大2.3質量%の含水量および0.001〜15質量%の熱分解法SiO 2 含量を有する、上記光起電力モジュールの製造のための、ポリビニルアセタールを基礎とする可塑剤含有フィルムの使用。
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DE102007000818A DE102007000818A1 (de) | 2007-10-05 | 2007-10-05 | Photovoltaikmodule mit weichmacherhaltigen Folien geringer Feuchtigkeitsaufnahme |
DE102007000818.1 | 2007-10-05 | ||
PCT/EP2008/063305 WO2009047223A2 (de) | 2007-10-05 | 2008-10-06 | Photovoltaikmodule mit weichmacherhaltigen folien geringer feuchtigkeitsaufnahme |
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EP (1) | EP2206162A2 (ja) |
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2008
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- 2008-10-06 JP JP2010527470A patent/JP5832092B2/ja not_active Expired - Fee Related
- 2008-10-06 RU RU2010117695/28A patent/RU2010117695A/ru unknown
- 2008-10-06 CN CN2008801098160A patent/CN101933160B/zh not_active Expired - Fee Related
- 2008-10-06 EP EP08805057A patent/EP2206162A2/de not_active Withdrawn
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RU204880U1 (ru) * | 2020-11-10 | 2021-06-16 | Максим Александрович Потапов | Экструдер для переработки влажной массы в виде птичьего помета или навоза |
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CN101933160B (zh) | 2012-11-07 |
TWI457391B (zh) | 2014-10-21 |
RU2010117695A (ru) | 2011-11-10 |
US20100193024A1 (en) | 2010-08-05 |
EP2206162A2 (de) | 2010-07-14 |
DE102007000818A1 (de) | 2009-04-09 |
CN101933160A (zh) | 2010-12-29 |
WO2009047223A2 (de) | 2009-04-16 |
WO2009047223A3 (de) | 2010-05-27 |
JP2010541270A (ja) | 2010-12-24 |
TW200934819A (en) | 2009-08-16 |
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