JP5827895B2 - 発光手段 - Google Patents
発光手段 Download PDFInfo
- Publication number
- JP5827895B2 JP5827895B2 JP2011529442A JP2011529442A JP5827895B2 JP 5827895 B2 JP5827895 B2 JP 5827895B2 JP 2011529442 A JP2011529442 A JP 2011529442A JP 2011529442 A JP2011529442 A JP 2011529442A JP 5827895 B2 JP5827895 B2 JP 5827895B2
- Authority
- JP
- Japan
- Prior art keywords
- wavelength
- light emitting
- radiation
- emitting means
- semiconductor device
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Images
Classifications
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
- F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
- F21K9/60—Optical arrangements integrated in the light source, e.g. for improving the colour rendering index or the light extraction
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V9/00—Elements for modifying spectral properties, polarisation or intensity of the light emitted, e.g. filters
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of semiconductor or other solid state devices
- H01L25/03—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes
- H01L25/04—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
- H01L25/075—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H10H20/00
- H01L25/0753—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H10H20/00 the devices being arranged next to each other
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/81—Bodies
- H10H20/822—Materials of the light-emitting regions
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/85—Packages
- H10H20/851—Wavelength conversion means
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/85—Packages
- H10H20/851—Wavelength conversion means
- H10H20/8511—Wavelength conversion means characterised by their material, e.g. binder
- H10H20/8512—Wavelength conversion materials
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
- F21Y2115/00—Light-generating elements of semiconductor light sources
- F21Y2115/10—Light-emitting diodes [LED]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
- H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
- H01L2224/321—Disposition
- H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/32225—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/81—Bodies
- H10H20/813—Bodies having a plurality of light-emitting regions, e.g. multi-junction LEDs or light-emitting devices having photoluminescent regions within the bodies
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- General Engineering & Computer Science (AREA)
- Optics & Photonics (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Led Device Packages (AREA)
- Non-Portable Lighting Devices Or Systems Thereof (AREA)
- Led Devices (AREA)
- Optical Filters (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE102008050643.5A DE102008050643B4 (de) | 2008-10-07 | 2008-10-07 | Leuchtmittel |
| DE102008050643.5 | 2008-10-07 | ||
| PCT/DE2009/001140 WO2010040327A1 (de) | 2008-10-07 | 2009-08-11 | Leuchtmittel |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2012505527A JP2012505527A (ja) | 2012-03-01 |
| JP2012505527A5 JP2012505527A5 (enExample) | 2012-06-07 |
| JP5827895B2 true JP5827895B2 (ja) | 2015-12-02 |
Family
ID=41442228
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2011529442A Expired - Fee Related JP5827895B2 (ja) | 2008-10-07 | 2009-08-11 | 発光手段 |
Country Status (8)
| Country | Link |
|---|---|
| US (1) | US8410507B2 (enExample) |
| EP (1) | EP2335292A1 (enExample) |
| JP (1) | JP5827895B2 (enExample) |
| KR (1) | KR101612576B1 (enExample) |
| CN (1) | CN102177594B (enExample) |
| DE (1) | DE102008050643B4 (enExample) |
| TW (1) | TWI398024B (enExample) |
| WO (1) | WO2010040327A1 (enExample) |
Families Citing this family (21)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US8273588B2 (en) * | 2009-07-20 | 2012-09-25 | Osram Opto Semiconductros Gmbh | Method for producing a luminous device and luminous device |
| DE102010046790A1 (de) * | 2010-09-28 | 2012-03-29 | Osram Opto Semiconductors Gmbh | Optoelektronisches Halbleiterbauelement und Verfahren zu dessen Herstellung |
| EP3848985B1 (en) * | 2011-04-22 | 2023-06-07 | Seoul Semiconductor Co., Ltd. | White light equipment |
| DE102011085645B4 (de) * | 2011-11-03 | 2014-06-26 | Osram Gmbh | Leuchtdiodenmodul und Verfahren zum Betreiben eines Leuchtdiodenmoduls |
| US8779687B2 (en) | 2012-02-13 | 2014-07-15 | Xicato, Inc. | Current routing to multiple LED circuits |
| DE102012202927B4 (de) * | 2012-02-27 | 2021-06-10 | Osram Gmbh | Lichtquelle mit led-chip und leuchtstoffschicht |
| JP6363061B2 (ja) * | 2012-04-06 | 2018-07-25 | フィリップス ライティング ホールディング ビー ヴィ | 白色発光モジュール |
| DE102012111564A1 (de) * | 2012-11-29 | 2014-06-18 | Osram Opto Semiconductors Gmbh | Beleuchtungsvorrichtung |
| FR3001334B1 (fr) * | 2013-01-24 | 2016-05-06 | Centre Nat De La Rech Scient (Cnrs) | Procede de fabrication de diodes blanches monolithiques |
| DE102013205179A1 (de) * | 2013-03-25 | 2014-09-25 | Osram Gmbh | Verfahren zum Herstellen einer elektromagnetische Strahlung emittierenden Baugruppe und elektromagnetische Strahlung emittierende Baugruppe |
| TW201517323A (zh) * | 2013-08-27 | 2015-05-01 | Glo公司 | 模製發光二極體封裝及其製造方法 |
| US9410664B2 (en) | 2013-08-29 | 2016-08-09 | Soraa, Inc. | Circadian friendly LED light source |
| JP6358457B2 (ja) | 2014-01-20 | 2018-07-18 | パナソニックIpマネジメント株式会社 | 発光装置、照明用光源及び照明装置 |
| EP3201953B1 (en) * | 2014-10-01 | 2019-08-07 | Lumileds Holding B.V. | Light source with tunable emission spectrum |
| JP2016219519A (ja) * | 2015-05-18 | 2016-12-22 | サンケン電気株式会社 | 発光装置 |
| US10303040B2 (en) * | 2017-02-08 | 2019-05-28 | Kapteyn Murnane Laboratories, Inc. | Integrated wavelength conversion and laser source |
| US10685941B1 (en) | 2019-07-09 | 2020-06-16 | Intematix Corporation | Full spectrum white light emitting devices |
| US10371325B1 (en) * | 2018-06-25 | 2019-08-06 | Intematix Corporation | Full spectrum white light emitting devices |
| US11887973B2 (en) | 2019-07-09 | 2024-01-30 | Intematix Corporation | Full spectrum white light emitting devices |
| JP2022553664A (ja) | 2019-10-23 | 2022-12-26 | インテマティックス・コーポレーション | 高色域フォトルミネッセンス波長変換白色発光デバイス |
| CN111540734B (zh) * | 2020-05-08 | 2021-08-24 | 开发晶照明(厦门)有限公司 | 发光装置 |
Family Cites Families (45)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| BR9709998B1 (pt) * | 1996-06-26 | 2010-04-20 | elemento de construção semicondutor, irradiador de luz, com elemento de conversão de luminescência | |
| US7014336B1 (en) * | 1999-11-18 | 2006-03-21 | Color Kinetics Incorporated | Systems and methods for generating and modulating illumination conditions |
| US6577073B2 (en) * | 2000-05-31 | 2003-06-10 | Matsushita Electric Industrial Co., Ltd. | Led lamp |
| KR20080087049A (ko) * | 2001-09-03 | 2008-09-29 | 마츠시타 덴끼 산교 가부시키가이샤 | 형광체 층, 반도체발광장치, 반도체발광소자의 제조방법 |
| JP3707688B2 (ja) * | 2002-05-31 | 2005-10-19 | スタンレー電気株式会社 | 発光装置およびその製造方法 |
| US7005679B2 (en) | 2003-05-01 | 2006-02-28 | Cree, Inc. | Multiple component solid state white light |
| JP2004356141A (ja) | 2003-05-27 | 2004-12-16 | Stanley Electric Co Ltd | 半導体光学素子 |
| US7268370B2 (en) * | 2003-06-05 | 2007-09-11 | Matsushita Electric Industrial Co., Ltd. | Phosphor, semiconductor light emitting device, and fabrication method thereof |
| TWI263356B (en) | 2003-11-27 | 2006-10-01 | Kuen-Juei Li | Light-emitting device |
| US7102152B2 (en) | 2004-10-14 | 2006-09-05 | Avago Technologies Ecbu Ip (Singapore) Pte. Ltd. | Device and method for emitting output light using quantum dots and non-quantum fluorescent material |
| US7318651B2 (en) * | 2003-12-18 | 2008-01-15 | Avago Technologies Ecbu Ip (Singapore) Pte. Ltd. | Flash module with quantum dot light conversion |
| TW200525779A (en) | 2004-01-27 | 2005-08-01 | Super Nova Optoelectronics Corp | White-like light emitting device and its manufacturing method |
| DE102004026125A1 (de) | 2004-05-28 | 2005-12-22 | Osram Opto Semiconductors Gmbh | Optoelektronisches Bauteil und Verfahren zu dessen Herstellung |
| DE102004052245A1 (de) | 2004-06-30 | 2006-02-02 | Osram Opto Semiconductors Gmbh | Strahlungsemittierender Halbleiterchip und strahlungsemittierendes Halbleiterbauelement mit einem derartigen Halbleiterchip |
| DE102004047763A1 (de) | 2004-09-30 | 2006-04-13 | Osram Opto Semiconductors Gmbh | Mehrfachleuchtdiodenanordnung |
| US8324641B2 (en) * | 2007-06-29 | 2012-12-04 | Ledengin, Inc. | Matrix material including an embedded dispersion of beads for a light-emitting device |
| US7404652B2 (en) * | 2004-12-15 | 2008-07-29 | Avago Technologies Ecbu Ip Pte Ltd | Light-emitting diode flash module with enhanced spectral emission |
| US8125137B2 (en) * | 2005-01-10 | 2012-02-28 | Cree, Inc. | Multi-chip light emitting device lamps for providing high-CRI warm white light and light fixtures including the same |
| US7821023B2 (en) * | 2005-01-10 | 2010-10-26 | Cree, Inc. | Solid state lighting component |
| US7859006B2 (en) * | 2005-02-23 | 2010-12-28 | Mitsubishi Chemical Corporation | Semiconductor light emitting device member, method for manufacturing such semiconductor light emitting device member and semiconductor light emitting device using such semiconductor light emitting device member |
| CA2614575C (en) * | 2005-04-06 | 2015-03-31 | Tir Technology Lp | White light luminaire with adjustable correlated colour temperature |
| TWM279023U (en) | 2005-04-29 | 2005-10-21 | Super Nova Optoelectronics Cor | White light emitting diode device |
| JP2007049114A (ja) * | 2005-05-30 | 2007-02-22 | Sharp Corp | 発光装置とその製造方法 |
| EP1894257A1 (en) * | 2005-06-23 | 2008-03-05 | Rensselaer Polytechnic Institute | Package design for producing white light with short-wavelength leds and down-conversion materials |
| CN101253637A (zh) * | 2005-08-30 | 2008-08-27 | 奥斯兰姆奥普托半导体有限责任公司 | 光电子器件 |
| DE102005041064B4 (de) * | 2005-08-30 | 2023-01-19 | OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung | Oberflächenmontierbares optoelektronisches Bauelement und Verfahren zu dessen Herstellung |
| DE102006020529A1 (de) * | 2005-08-30 | 2007-03-01 | Osram Opto Semiconductors Gmbh | Optoelektronisches Bauelement |
| DE102005046450A1 (de) * | 2005-09-28 | 2007-04-05 | Osram Opto Semiconductors Gmbh | Optoelektronischer Halbleiterchip, Verfahren zu dessen Herstellung und optoelektronisches Bauteil |
| TWI266441B (en) * | 2005-10-26 | 2006-11-11 | Lustrous Technology Ltd | COB-typed LED package with phosphor |
| JP4793029B2 (ja) * | 2006-03-03 | 2011-10-12 | 三菱化学株式会社 | 照明装置 |
| US8174032B2 (en) | 2006-03-16 | 2012-05-08 | Light Engines Corporation | Semiconductor white light sources |
| JP5306992B2 (ja) * | 2006-04-25 | 2013-10-02 | コーニンクレッカ フィリップス エヌ ヴェ | 白色光を作る蛍光照明 |
| DE102006024165A1 (de) * | 2006-05-23 | 2007-11-29 | Patent-Treuhand-Gesellschaft für elektrische Glühlampen mbH | Optoelektronischer Halbleiterchip mit einem Wellenlängenkonversionsstoff sowie optoelektronisches Halbleiterbauelement mit einem solchen Halbleiterchip und Verfahren zur Herstellung des optoelektronischen Halbleiterchips |
| DE102006025964A1 (de) | 2006-06-02 | 2007-12-06 | Osram Opto Semiconductors Gmbh | Mehrfachquantentopfstruktur, strahlungsemittierender Halbleiterkörper und strahlungsemittierendes Bauelement |
| JP4989936B2 (ja) | 2006-07-27 | 2012-08-01 | 株式会社朝日ラバー | 照明装置 |
| JP2008075080A (ja) * | 2006-08-23 | 2008-04-03 | Osaka Univ | 発光装置、画像表示装置及び照明装置 |
| JP2008111080A (ja) * | 2006-10-31 | 2008-05-15 | Mitsubishi Chemicals Corp | 蛍光体表面処理方法、蛍光体、蛍光体含有組成物、発光装置、画像表示装置、および照明装置 |
| US8113675B2 (en) * | 2006-11-07 | 2012-02-14 | Koninklijke Philips Electronics N.V. | Arrangement for emitting mixed light |
| DE102007029391A1 (de) * | 2007-06-26 | 2009-01-02 | Osram Opto Semiconductors Gmbh | Optoelektronischer Halbleiterchip |
| TWI355097B (en) * | 2007-07-18 | 2011-12-21 | Epistar Corp | Wavelength converting system |
| US20090026913A1 (en) * | 2007-07-26 | 2009-01-29 | Matthew Steven Mrakovich | Dynamic color or white light phosphor converted LED illumination system |
| DE102007058723A1 (de) | 2007-09-10 | 2009-03-12 | Osram Opto Semiconductors Gmbh | Lichtemittierende Struktur |
| US20090117672A1 (en) * | 2007-10-01 | 2009-05-07 | Intematix Corporation | Light emitting devices with phosphor wavelength conversion and methods of fabrication thereof |
| US7915627B2 (en) * | 2007-10-17 | 2011-03-29 | Intematix Corporation | Light emitting device with phosphor wavelength conversion |
| US8119028B2 (en) * | 2007-11-14 | 2012-02-21 | Cree, Inc. | Cerium and europium doped single crystal phosphors |
-
2008
- 2008-10-07 DE DE102008050643.5A patent/DE102008050643B4/de not_active Expired - Fee Related
-
2009
- 2009-08-11 EP EP09776087A patent/EP2335292A1/de not_active Withdrawn
- 2009-08-11 KR KR1020117000333A patent/KR101612576B1/ko not_active Expired - Fee Related
- 2009-08-11 WO PCT/DE2009/001140 patent/WO2010040327A1/de not_active Ceased
- 2009-08-11 CN CN200980139944.4A patent/CN102177594B/zh not_active Expired - Fee Related
- 2009-08-11 JP JP2011529442A patent/JP5827895B2/ja not_active Expired - Fee Related
- 2009-08-11 US US13/122,779 patent/US8410507B2/en not_active Expired - Fee Related
- 2009-10-05 TW TW098133682A patent/TWI398024B/zh not_active IP Right Cessation
Also Published As
| Publication number | Publication date |
|---|---|
| TWI398024B (zh) | 2013-06-01 |
| CN102177594B (zh) | 2014-07-02 |
| TW201025679A (en) | 2010-07-01 |
| US20110248295A1 (en) | 2011-10-13 |
| KR20110087264A (ko) | 2011-08-02 |
| KR101612576B1 (ko) | 2016-04-14 |
| CN102177594A (zh) | 2011-09-07 |
| JP2012505527A (ja) | 2012-03-01 |
| US8410507B2 (en) | 2013-04-02 |
| EP2335292A1 (de) | 2011-06-22 |
| WO2010040327A1 (de) | 2010-04-15 |
| DE102008050643B4 (de) | 2022-11-03 |
| DE102008050643A1 (de) | 2010-04-08 |
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