DE102008050643B4 - Leuchtmittel - Google Patents

Leuchtmittel Download PDF

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Publication number
DE102008050643B4
DE102008050643B4 DE102008050643.5A DE102008050643A DE102008050643B4 DE 102008050643 B4 DE102008050643 B4 DE 102008050643B4 DE 102008050643 A DE102008050643 A DE 102008050643A DE 102008050643 B4 DE102008050643 B4 DE 102008050643B4
Authority
DE
Germany
Prior art keywords
wavelength
radiation
semiconductor chip
semiconductor component
conversion
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE102008050643.5A
Other languages
German (de)
English (en)
Other versions
DE102008050643A1 (de
Inventor
Dr. Stauß Peter
Dr. Baumann Frank
Dr. Windisch Reiner
Dr. Peter Matthias
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Ams Osram International GmbH
Original Assignee
Osram Opto Semiconductors GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority to DE102008050643.5A priority Critical patent/DE102008050643B4/de
Application filed by Osram Opto Semiconductors GmbH filed Critical Osram Opto Semiconductors GmbH
Priority to KR1020117000333A priority patent/KR101612576B1/ko
Priority to EP09776087A priority patent/EP2335292A1/de
Priority to PCT/DE2009/001140 priority patent/WO2010040327A1/de
Priority to US13/122,779 priority patent/US8410507B2/en
Priority to CN200980139944.4A priority patent/CN102177594B/zh
Priority to JP2011529442A priority patent/JP5827895B2/ja
Priority to TW098133682A priority patent/TWI398024B/zh
Publication of DE102008050643A1 publication Critical patent/DE102008050643A1/de
Application granted granted Critical
Publication of DE102008050643B4 publication Critical patent/DE102008050643B4/de
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F21K9/60—Optical arrangements integrated in the light source, e.g. for improving the colour rendering index or the light extraction
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V9/00—Elements for modifying spectral properties, polarisation or intensity of the light emitted, e.g. filters
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of semiconductor or other solid state devices
    • H01L25/03—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes
    • H01L25/04—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/075—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H10H20/00
    • H01L25/0753—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H10H20/00 the devices being arranged next to each other
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/81—Bodies
    • H10H20/822—Materials of the light-emitting regions
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/851—Wavelength conversion means
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/851—Wavelength conversion means
    • H10H20/8511—Wavelength conversion means characterised by their material, e.g. binder
    • H10H20/8512—Wavelength conversion materials
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2115/00—Light-generating elements of semiconductor light sources
    • F21Y2115/10—Light-emitting diodes [LED]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
    • H01L2224/321—Disposition
    • H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/32225—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/81—Bodies
    • H10H20/813—Bodies having a plurality of light-emitting regions, e.g. multi-junction LEDs or light-emitting devices having photoluminescent regions within the bodies

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • General Engineering & Computer Science (AREA)
  • Optics & Photonics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Led Device Packages (AREA)
  • Non-Portable Lighting Devices Or Systems Thereof (AREA)
  • Led Devices (AREA)
  • Optical Filters (AREA)
DE102008050643.5A 2008-10-07 2008-10-07 Leuchtmittel Expired - Fee Related DE102008050643B4 (de)

Priority Applications (8)

Application Number Priority Date Filing Date Title
DE102008050643.5A DE102008050643B4 (de) 2008-10-07 2008-10-07 Leuchtmittel
EP09776087A EP2335292A1 (de) 2008-10-07 2009-08-11 Leuchtmittel
PCT/DE2009/001140 WO2010040327A1 (de) 2008-10-07 2009-08-11 Leuchtmittel
US13/122,779 US8410507B2 (en) 2008-10-07 2009-08-11 Thermal light source having a high color rendering quality
KR1020117000333A KR101612576B1 (ko) 2008-10-07 2009-08-11 램프
CN200980139944.4A CN102177594B (zh) 2008-10-07 2009-08-11 发光装置
JP2011529442A JP5827895B2 (ja) 2008-10-07 2009-08-11 発光手段
TW098133682A TWI398024B (zh) 2008-10-07 2009-10-05 發光媒體

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE102008050643.5A DE102008050643B4 (de) 2008-10-07 2008-10-07 Leuchtmittel

Publications (2)

Publication Number Publication Date
DE102008050643A1 DE102008050643A1 (de) 2010-04-08
DE102008050643B4 true DE102008050643B4 (de) 2022-11-03

Family

ID=41442228

Family Applications (1)

Application Number Title Priority Date Filing Date
DE102008050643.5A Expired - Fee Related DE102008050643B4 (de) 2008-10-07 2008-10-07 Leuchtmittel

Country Status (8)

Country Link
US (1) US8410507B2 (enExample)
EP (1) EP2335292A1 (enExample)
JP (1) JP5827895B2 (enExample)
KR (1) KR101612576B1 (enExample)
CN (1) CN102177594B (enExample)
DE (1) DE102008050643B4 (enExample)
TW (1) TWI398024B (enExample)
WO (1) WO2010040327A1 (enExample)

Families Citing this family (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8273588B2 (en) * 2009-07-20 2012-09-25 Osram Opto Semiconductros Gmbh Method for producing a luminous device and luminous device
DE102010046790A1 (de) * 2010-09-28 2012-03-29 Osram Opto Semiconductors Gmbh Optoelektronisches Halbleiterbauelement und Verfahren zu dessen Herstellung
CN103493226B (zh) * 2011-04-22 2016-09-28 株式会社东芝 白光源以及包括所述白光源的白光源系统
DE102011085645B4 (de) * 2011-11-03 2014-06-26 Osram Gmbh Leuchtdiodenmodul und Verfahren zum Betreiben eines Leuchtdiodenmoduls
US8779687B2 (en) 2012-02-13 2014-07-15 Xicato, Inc. Current routing to multiple LED circuits
DE102012202927B4 (de) * 2012-02-27 2021-06-10 Osram Gmbh Lichtquelle mit led-chip und leuchtstoffschicht
US10090442B2 (en) 2012-04-06 2018-10-02 Philips Lighting Holding B.V. White light emitting module
DE102012111564A1 (de) * 2012-11-29 2014-06-18 Osram Opto Semiconductors Gmbh Beleuchtungsvorrichtung
FR3001334B1 (fr) * 2013-01-24 2016-05-06 Centre Nat De La Rech Scient (Cnrs) Procede de fabrication de diodes blanches monolithiques
DE102013205179A1 (de) 2013-03-25 2014-09-25 Osram Gmbh Verfahren zum Herstellen einer elektromagnetische Strahlung emittierenden Baugruppe und elektromagnetische Strahlung emittierende Baugruppe
TW201517323A (zh) * 2013-08-27 2015-05-01 Glo公司 模製發光二極體封裝及其製造方法
US9410664B2 (en) * 2013-08-29 2016-08-09 Soraa, Inc. Circadian friendly LED light source
JP6358457B2 (ja) 2014-01-20 2018-07-18 パナソニックＩｐマネジメント株式会社 発光装置、照明用光源及び照明装置
JP6782231B2 (ja) * 2014-10-01 2020-11-11 ルミレッズ ホールディング ベーフェー 放射スペクトルが調整可能な光源
JP2016219519A (ja) * 2015-05-18 2016-12-22 サンケン電気株式会社 発光装置
US10303040B2 (en) * 2017-02-08 2019-05-28 Kapteyn Murnane Laboratories, Inc. Integrated wavelength conversion and laser source
US10685941B1 (en) 2019-07-09 2020-06-16 Intematix Corporation Full spectrum white light emitting devices
US10371325B1 (en) * 2018-06-25 2019-08-06 Intematix Corporation Full spectrum white light emitting devices
US11887973B2 (en) 2019-07-09 2024-01-30 Intematix Corporation Full spectrum white light emitting devices
EP4049319B1 (en) * 2019-10-23 2025-11-19 Intematix Corporation High color gamut photoluminescence wavelength converted white light emitting devices
CN111540734B (zh) * 2020-05-08 2021-08-24 开发晶照明（厦门）有限公司 发光装置

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DE102004023110A1 (de) 2003-11-27 2005-06-30 Kun-Chui Lee Licht emittierende Vorrichtung
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JP2004356141A (ja) 2003-05-27 2004-12-16 Stanley Electric Co Ltd 半導体光学素子
DE102004023110A1 (de) 2003-11-27 2005-06-30 Kun-Chui Lee Licht emittierende Vorrichtung
US20050161690A1 (en) 2004-01-27 2005-07-28 Mu-Jen Lai Manufacturing method and device for white light emitting
US20050266588A1 (en) 2004-05-28 2005-12-01 Peter Stauss Optoelectronic component and method of fabricating same
DE102004052245A1 (de) 2004-06-30 2006-02-02 Osram Opto Semiconductors Gmbh Strahlungsemittierender Halbleiterchip und strahlungsemittierendes Halbleiterbauelement mit einem derartigen Halbleiterchip
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DE102005045106A1 (de) 2004-12-10 2006-06-29 Agilent Technologies, Inc. (n.d.Ges.d.Staates Delaware), Palo Alto Blitzmodul mit Quantenpunktlichtumwandlung
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DE102006020529A1 (de) 2005-08-30 2007-03-01 Osram Opto Semiconductors Gmbh Optoelektronisches Bauelement
DE102005041064A1 (de) 2005-08-30 2007-03-01 Osram Opto Semiconductors Gmbh Oberflächenmontierbares optoelektronisches Bauelement und Verfahren zu dessen Herstellung
US20070221925A1 (en) 2006-03-16 2007-09-27 Acol Technologies S.A. Semiconductor white light sources
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JP2008034188A (ja) 2006-07-27 2008-02-14 Asahi Rubber:Kk 照明装置

Also Published As

Publication number Publication date
KR20110087264A (ko) 2011-08-02
US8410507B2 (en) 2013-04-02
TW201025679A (en) 2010-07-01
EP2335292A1 (de) 2011-06-22
CN102177594A (zh) 2011-09-07
TWI398024B (zh) 2013-06-01
WO2010040327A1 (de) 2010-04-15
JP2012505527A (ja) 2012-03-01
CN102177594B (zh) 2014-07-02
US20110248295A1 (en) 2011-10-13
JP5827895B2 (ja) 2015-12-02
KR101612576B1 (ko) 2016-04-14
DE102008050643A1 (de) 2010-04-08

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