CN102177594B - 发光装置 - Google Patents
发光装置 Download PDFInfo
- Publication number
- CN102177594B CN102177594B CN200980139944.4A CN200980139944A CN102177594B CN 102177594 B CN102177594 B CN 102177594B CN 200980139944 A CN200980139944 A CN 200980139944A CN 102177594 B CN102177594 B CN 102177594B
- Authority
- CN
- China
- Prior art keywords
- wavelength
- light
- radiation
- emitting device
- semiconductor chip
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Images
Classifications
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
- F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
- F21K9/60—Optical arrangements integrated in the light source, e.g. for improving the colour rendering index or the light extraction
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V9/00—Elements for modifying spectral properties, polarisation or intensity of the light emitted, e.g. filters
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of semiconductor or other solid state devices
- H01L25/03—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes
- H01L25/04—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
- H01L25/075—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H10H20/00
- H01L25/0753—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H10H20/00 the devices being arranged next to each other
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/81—Bodies
- H10H20/822—Materials of the light-emitting regions
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/85—Packages
- H10H20/851—Wavelength conversion means
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/85—Packages
- H10H20/851—Wavelength conversion means
- H10H20/8511—Wavelength conversion means characterised by their material, e.g. binder
- H10H20/8512—Wavelength conversion materials
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
- F21Y2115/00—Light-generating elements of semiconductor light sources
- F21Y2115/10—Light-emitting diodes [LED]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
- H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
- H01L2224/321—Disposition
- H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/32225—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/81—Bodies
- H10H20/813—Bodies having a plurality of light-emitting regions, e.g. multi-junction LEDs or light-emitting devices having photoluminescent regions within the bodies
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- General Engineering & Computer Science (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Optics & Photonics (AREA)
- Led Device Packages (AREA)
- Non-Portable Lighting Devices Or Systems Thereof (AREA)
- Led Devices (AREA)
- Optical Filters (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE102008050643.5A DE102008050643B4 (de) | 2008-10-07 | 2008-10-07 | Leuchtmittel |
| DE102008050643.5 | 2008-10-07 | ||
| PCT/DE2009/001140 WO2010040327A1 (de) | 2008-10-07 | 2009-08-11 | Leuchtmittel |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN102177594A CN102177594A (zh) | 2011-09-07 |
| CN102177594B true CN102177594B (zh) | 2014-07-02 |
Family
ID=41442228
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN200980139944.4A Expired - Fee Related CN102177594B (zh) | 2008-10-07 | 2009-08-11 | 发光装置 |
Country Status (8)
| Country | Link |
|---|---|
| US (1) | US8410507B2 (enExample) |
| EP (1) | EP2335292A1 (enExample) |
| JP (1) | JP5827895B2 (enExample) |
| KR (1) | KR101612576B1 (enExample) |
| CN (1) | CN102177594B (enExample) |
| DE (1) | DE102008050643B4 (enExample) |
| TW (1) | TWI398024B (enExample) |
| WO (1) | WO2010040327A1 (enExample) |
Families Citing this family (21)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US8273588B2 (en) * | 2009-07-20 | 2012-09-25 | Osram Opto Semiconductros Gmbh | Method for producing a luminous device and luminous device |
| DE102010046790A1 (de) * | 2010-09-28 | 2012-03-29 | Osram Opto Semiconductors Gmbh | Optoelektronisches Halbleiterbauelement und Verfahren zu dessen Herstellung |
| US9109762B2 (en) | 2011-04-22 | 2015-08-18 | Kabushiki Kaisha Toshiba | White light source and white light source system including the same |
| DE102011085645B4 (de) * | 2011-11-03 | 2014-06-26 | Osram Gmbh | Leuchtdiodenmodul und Verfahren zum Betreiben eines Leuchtdiodenmoduls |
| US8779687B2 (en) * | 2012-02-13 | 2014-07-15 | Xicato, Inc. | Current routing to multiple LED circuits |
| DE102012202927B4 (de) * | 2012-02-27 | 2021-06-10 | Osram Gmbh | Lichtquelle mit led-chip und leuchtstoffschicht |
| EP3382755B1 (en) * | 2012-04-06 | 2020-01-08 | Signify Holding B.V. | White light emitting module |
| DE102012111564A1 (de) * | 2012-11-29 | 2014-06-18 | Osram Opto Semiconductors Gmbh | Beleuchtungsvorrichtung |
| FR3001334B1 (fr) * | 2013-01-24 | 2016-05-06 | Centre Nat De La Rech Scient (Cnrs) | Procede de fabrication de diodes blanches monolithiques |
| DE102013205179A1 (de) * | 2013-03-25 | 2014-09-25 | Osram Gmbh | Verfahren zum Herstellen einer elektromagnetische Strahlung emittierenden Baugruppe und elektromagnetische Strahlung emittierende Baugruppe |
| WO2015031179A1 (en) * | 2013-08-27 | 2015-03-05 | Glo Ab | Molded led package and method of making same |
| US9410664B2 (en) | 2013-08-29 | 2016-08-09 | Soraa, Inc. | Circadian friendly LED light source |
| JP6358457B2 (ja) | 2014-01-20 | 2018-07-18 | パナソニックIpマネジメント株式会社 | 発光装置、照明用光源及び照明装置 |
| KR20170069240A (ko) * | 2014-10-01 | 2017-06-20 | 코닌클리케 필립스 엔.브이. | 조절가능한 방출 스펙트럼을 갖는 광원 |
| JP2016219519A (ja) * | 2015-05-18 | 2016-12-22 | サンケン電気株式会社 | 発光装置 |
| US10303040B2 (en) * | 2017-02-08 | 2019-05-28 | Kapteyn Murnane Laboratories, Inc. | Integrated wavelength conversion and laser source |
| US10685941B1 (en) | 2019-07-09 | 2020-06-16 | Intematix Corporation | Full spectrum white light emitting devices |
| US10371325B1 (en) | 2018-06-25 | 2019-08-06 | Intematix Corporation | Full spectrum white light emitting devices |
| US11887973B2 (en) | 2019-07-09 | 2024-01-30 | Intematix Corporation | Full spectrum white light emitting devices |
| KR20220088454A (ko) * | 2019-10-23 | 2022-06-27 | 인터매틱스 코포레이션 | 고색 영역 포토루미네선스 파장 변환된 백색 발광 디바이스 |
| CN111540734B (zh) * | 2020-05-08 | 2021-08-24 | 开发晶照明(厦门)有限公司 | 发光装置 |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2007025515A1 (de) * | 2005-08-30 | 2007-03-08 | Osram Opto Semiconductors Gmbh | Oberflächenmontierbares optoelektronisches halbleiterbauelement und verfahren zu dessen herstellung |
| CN101138104A (zh) * | 2005-06-23 | 2008-03-05 | 伦斯勒工业学院 | 利用短波长led和下变频材料产生白光的封装设计 |
| CN101253637A (zh) * | 2005-08-30 | 2008-08-27 | 奥斯兰姆奥普托半导体有限责任公司 | 光电子器件 |
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| DE29724582U1 (de) * | 1996-06-26 | 2002-07-04 | OSRAM Opto Semiconductors GmbH & Co. oHG, 93049 Regensburg | Lichtabstrahlendes Halbleiterbauelement mit Lumineszenzkonversionselement |
| US7014336B1 (en) * | 1999-11-18 | 2006-03-21 | Color Kinetics Incorporated | Systems and methods for generating and modulating illumination conditions |
| US6577073B2 (en) | 2000-05-31 | 2003-06-10 | Matsushita Electric Industrial Co., Ltd. | Led lamp |
| KR100923804B1 (ko) * | 2001-09-03 | 2009-10-27 | 파나소닉 주식회사 | 반도체발광소자, 발광장치 및 반도체발광소자의 제조방법 |
| JP3707688B2 (ja) * | 2002-05-31 | 2005-10-19 | スタンレー電気株式会社 | 発光装置およびその製造方法 |
| US7005679B2 (en) | 2003-05-01 | 2006-02-28 | Cree, Inc. | Multiple component solid state white light |
| JP2004356141A (ja) | 2003-05-27 | 2004-12-16 | Stanley Electric Co Ltd | 半導体光学素子 |
| US7268370B2 (en) * | 2003-06-05 | 2007-09-11 | Matsushita Electric Industrial Co., Ltd. | Phosphor, semiconductor light emitting device, and fabrication method thereof |
| TWI263356B (en) | 2003-11-27 | 2006-10-01 | Kuen-Juei Li | Light-emitting device |
| US7102152B2 (en) | 2004-10-14 | 2006-09-05 | Avago Technologies Ecbu Ip (Singapore) Pte. Ltd. | Device and method for emitting output light using quantum dots and non-quantum fluorescent material |
| US7318651B2 (en) | 2003-12-18 | 2008-01-15 | Avago Technologies Ecbu Ip (Singapore) Pte. Ltd. | Flash module with quantum dot light conversion |
| TW200525779A (en) * | 2004-01-27 | 2005-08-01 | Super Nova Optoelectronics Corp | White-like light emitting device and its manufacturing method |
| DE102004026125A1 (de) | 2004-05-28 | 2005-12-22 | Osram Opto Semiconductors Gmbh | Optoelektronisches Bauteil und Verfahren zu dessen Herstellung |
| DE102004052245A1 (de) | 2004-06-30 | 2006-02-02 | Osram Opto Semiconductors Gmbh | Strahlungsemittierender Halbleiterchip und strahlungsemittierendes Halbleiterbauelement mit einem derartigen Halbleiterchip |
| DE102004047763A1 (de) | 2004-09-30 | 2006-04-13 | Osram Opto Semiconductors Gmbh | Mehrfachleuchtdiodenanordnung |
| US8324641B2 (en) * | 2007-06-29 | 2012-12-04 | Ledengin, Inc. | Matrix material including an embedded dispersion of beads for a light-emitting device |
| US7404652B2 (en) * | 2004-12-15 | 2008-07-29 | Avago Technologies Ecbu Ip Pte Ltd | Light-emitting diode flash module with enhanced spectral emission |
| US7821023B2 (en) * | 2005-01-10 | 2010-10-26 | Cree, Inc. | Solid state lighting component |
| US8125137B2 (en) * | 2005-01-10 | 2012-02-28 | Cree, Inc. | Multi-chip light emitting device lamps for providing high-CRI warm white light and light fixtures including the same |
| CN101128516B (zh) * | 2005-02-23 | 2012-03-21 | 三菱化学株式会社 | 半导体发光器件用部件及其制造方法以及使用了该部件的半导体发光器件 |
| WO2006105649A1 (en) | 2005-04-06 | 2006-10-12 | Tir Systems Ltd. | White light luminaire with adjustable correlated colour temperature |
| TWM279023U (en) | 2005-04-29 | 2005-10-21 | Super Nova Optoelectronics Cor | White light emitting diode device |
| JP2007049114A (ja) * | 2005-05-30 | 2007-02-22 | Sharp Corp | 発光装置とその製造方法 |
| DE102006020529A1 (de) * | 2005-08-30 | 2007-03-01 | Osram Opto Semiconductors Gmbh | Optoelektronisches Bauelement |
| DE102005046450A1 (de) * | 2005-09-28 | 2007-04-05 | Osram Opto Semiconductors Gmbh | Optoelektronischer Halbleiterchip, Verfahren zu dessen Herstellung und optoelektronisches Bauteil |
| TWI266441B (en) * | 2005-10-26 | 2006-11-11 | Lustrous Technology Ltd | COB-typed LED package with phosphor |
| JP4793029B2 (ja) * | 2006-03-03 | 2011-10-12 | 三菱化学株式会社 | 照明装置 |
| US8174032B2 (en) | 2006-03-16 | 2012-05-08 | Light Engines Corporation | Semiconductor white light sources |
| US8035287B2 (en) * | 2006-04-25 | 2011-10-11 | Koninklijke Philips Electronics N.V. | Fluorescent lighting creating white light |
| DE102006024165A1 (de) * | 2006-05-23 | 2007-11-29 | Patent-Treuhand-Gesellschaft für elektrische Glühlampen mbH | Optoelektronischer Halbleiterchip mit einem Wellenlängenkonversionsstoff sowie optoelektronisches Halbleiterbauelement mit einem solchen Halbleiterchip und Verfahren zur Herstellung des optoelektronischen Halbleiterchips |
| DE102006025964A1 (de) | 2006-06-02 | 2007-12-06 | Osram Opto Semiconductors Gmbh | Mehrfachquantentopfstruktur, strahlungsemittierender Halbleiterkörper und strahlungsemittierendes Bauelement |
| JP4989936B2 (ja) | 2006-07-27 | 2012-08-01 | 株式会社朝日ラバー | 照明装置 |
| JP2008075080A (ja) * | 2006-08-23 | 2008-04-03 | Osaka Univ | 発光装置、画像表示装置及び照明装置 |
| JP2008111080A (ja) * | 2006-10-31 | 2008-05-15 | Mitsubishi Chemicals Corp | 蛍光体表面処理方法、蛍光体、蛍光体含有組成物、発光装置、画像表示装置、および照明装置 |
| US8113675B2 (en) * | 2006-11-07 | 2012-02-14 | Koninklijke Philips Electronics N.V. | Arrangement for emitting mixed light |
| DE102007029391A1 (de) * | 2007-06-26 | 2009-01-02 | Osram Opto Semiconductors Gmbh | Optoelektronischer Halbleiterchip |
| TWI355097B (en) * | 2007-07-18 | 2011-12-21 | Epistar Corp | Wavelength converting system |
| US20090026913A1 (en) * | 2007-07-26 | 2009-01-29 | Matthew Steven Mrakovich | Dynamic color or white light phosphor converted LED illumination system |
| DE102007058723A1 (de) | 2007-09-10 | 2009-03-12 | Osram Opto Semiconductors Gmbh | Lichtemittierende Struktur |
| US20090117672A1 (en) * | 2007-10-01 | 2009-05-07 | Intematix Corporation | Light emitting devices with phosphor wavelength conversion and methods of fabrication thereof |
| US7915627B2 (en) * | 2007-10-17 | 2011-03-29 | Intematix Corporation | Light emitting device with phosphor wavelength conversion |
| US8119028B2 (en) * | 2007-11-14 | 2012-02-21 | Cree, Inc. | Cerium and europium doped single crystal phosphors |
-
2008
- 2008-10-07 DE DE102008050643.5A patent/DE102008050643B4/de not_active Expired - Fee Related
-
2009
- 2009-08-11 WO PCT/DE2009/001140 patent/WO2010040327A1/de not_active Ceased
- 2009-08-11 US US13/122,779 patent/US8410507B2/en not_active Expired - Fee Related
- 2009-08-11 KR KR1020117000333A patent/KR101612576B1/ko not_active Expired - Fee Related
- 2009-08-11 CN CN200980139944.4A patent/CN102177594B/zh not_active Expired - Fee Related
- 2009-08-11 EP EP09776087A patent/EP2335292A1/de not_active Withdrawn
- 2009-08-11 JP JP2011529442A patent/JP5827895B2/ja not_active Expired - Fee Related
- 2009-10-05 TW TW098133682A patent/TWI398024B/zh not_active IP Right Cessation
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101138104A (zh) * | 2005-06-23 | 2008-03-05 | 伦斯勒工业学院 | 利用短波长led和下变频材料产生白光的封装设计 |
| WO2007025515A1 (de) * | 2005-08-30 | 2007-03-08 | Osram Opto Semiconductors Gmbh | Oberflächenmontierbares optoelektronisches halbleiterbauelement und verfahren zu dessen herstellung |
| CN101253637A (zh) * | 2005-08-30 | 2008-08-27 | 奥斯兰姆奥普托半导体有限责任公司 | 光电子器件 |
Also Published As
| Publication number | Publication date |
|---|---|
| DE102008050643A1 (de) | 2010-04-08 |
| US8410507B2 (en) | 2013-04-02 |
| TWI398024B (zh) | 2013-06-01 |
| WO2010040327A1 (de) | 2010-04-15 |
| EP2335292A1 (de) | 2011-06-22 |
| JP2012505527A (ja) | 2012-03-01 |
| DE102008050643B4 (de) | 2022-11-03 |
| TW201025679A (en) | 2010-07-01 |
| JP5827895B2 (ja) | 2015-12-02 |
| KR20110087264A (ko) | 2011-08-02 |
| US20110248295A1 (en) | 2011-10-13 |
| KR101612576B1 (ko) | 2016-04-14 |
| CN102177594A (zh) | 2011-09-07 |
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