JP5827895B2 - 発光手段 - Google Patents
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- JP5827895B2 JP5827895B2 JP2011529442A JP2011529442A JP5827895B2 JP 5827895 B2 JP5827895 B2 JP 5827895B2 JP 2011529442 A JP2011529442 A JP 2011529442A JP 2011529442 A JP2011529442 A JP 2011529442A JP 5827895 B2 JP5827895 B2 JP 5827895B2
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- 239000004065 semiconductor Substances 0.000 claims description 120
- 230000005855 radiation Effects 0.000 claims description 94
- 238000006243 chemical reaction Methods 0.000 claims description 57
- 230000003595 spectral effect Effects 0.000 claims description 55
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 claims description 25
- 238000001228 spectrum Methods 0.000 claims description 23
- 238000010521 absorption reaction Methods 0.000 claims description 10
- 238000010586 diagram Methods 0.000 claims description 8
- 239000000203 mixture Substances 0.000 claims description 8
- 230000005670 electromagnetic radiation Effects 0.000 claims description 6
- 230000005693 optoelectronics Effects 0.000 claims description 6
- 229910052727 yttrium Inorganic materials 0.000 claims description 3
- 102100032047 Alsin Human genes 0.000 claims description 2
- 101710187109 Alsin Proteins 0.000 claims description 2
- 229910052688 Gadolinium Inorganic materials 0.000 claims description 2
- 229910052765 Lutetium Inorganic materials 0.000 claims description 2
- 229910052782 aluminium Inorganic materials 0.000 claims description 2
- 229910052733 gallium Inorganic materials 0.000 claims description 2
- 238000009877 rendering Methods 0.000 description 26
- 230000000875 corresponding effect Effects 0.000 description 12
- 230000009102 absorption Effects 0.000 description 7
- 239000010410 layer Substances 0.000 description 6
- 239000000463 material Substances 0.000 description 6
- 238000000295 emission spectrum Methods 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- 230000009103 reabsorption Effects 0.000 description 3
- 238000012360 testing method Methods 0.000 description 3
- 239000003086 colorant Substances 0.000 description 2
- 238000011156 evaluation Methods 0.000 description 2
- 238000005259 measurement Methods 0.000 description 2
- 150000004767 nitrides Chemical class 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- 229910052684 Cerium Inorganic materials 0.000 description 1
- 239000006096 absorbing agent Substances 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- GWXLDORMOJMVQZ-UHFFFAOYSA-N cerium Chemical compound [Ce] GWXLDORMOJMVQZ-UHFFFAOYSA-N 0.000 description 1
- 239000011247 coating layer Substances 0.000 description 1
- 230000002596 correlated effect Effects 0.000 description 1
- 230000008878 coupling Effects 0.000 description 1
- 238000010168 coupling process Methods 0.000 description 1
- 238000005859 coupling reaction Methods 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 238000004512 die casting Methods 0.000 description 1
- 238000000605 extraction Methods 0.000 description 1
- 230000002349 favourable effect Effects 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 238000005286 illumination Methods 0.000 description 1
- 238000001746 injection moulding Methods 0.000 description 1
- 238000004020 luminiscence type Methods 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 description 1
- -1 phosphor yttrium aluminum Chemical compound 0.000 description 1
- 230000001737 promoting effect Effects 0.000 description 1
- 230000035945 sensitivity Effects 0.000 description 1
- 230000001953 sensory effect Effects 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 229910019655 synthetic inorganic crystalline material Inorganic materials 0.000 description 1
- 229910019901 yttrium aluminum garnet Inorganic materials 0.000 description 1
- VWQVUPCCIRVNHF-UHFFFAOYSA-N yttrium atom Chemical compound [Y] VWQVUPCCIRVNHF-UHFFFAOYSA-N 0.000 description 1
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
- F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
- F21K9/60—Optical arrangements integrated in the light source, e.g. for improving the colour rendering index or the light extraction
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V9/00—Elements for modifying spectral properties, polarisation or intensity of the light emitted, e.g. filters
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
- H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
- H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
- H01L25/0753—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/02—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies
- H01L33/26—Materials of the light emitting region
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/50—Wavelength conversion elements
- H01L33/501—Wavelength conversion elements characterised by the materials, e.g. binder
- H01L33/502—Wavelength conversion materials
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
- F21Y2115/00—Light-generating elements of semiconductor light sources
- F21Y2115/10—Light-emitting diodes [LED]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
- H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
- H01L2224/321—Disposition
- H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/32225—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/02—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies
- H01L33/08—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies with a plurality of light emitting regions, e.g. laterally discontinuous light emitting layer or photoluminescent region integrated within the semiconductor body
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/50—Wavelength conversion elements
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- Power Engineering (AREA)
- Computer Hardware Design (AREA)
- Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- General Engineering & Computer Science (AREA)
- Optics & Photonics (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Led Device Packages (AREA)
- Optical Filters (AREA)
- Non-Portable Lighting Devices Or Systems Thereof (AREA)
- Led Devices (AREA)
Description
Claims (13)
- 発光手段(1)であって、
− 動作時に少なくとも1つの第1の波長(L1)と少なくとも1つの第2の波長(L2)で電磁放射を放出する少なくとも1つのオプトエレクトロニクス半導体デバイスであって、前記第1の波長(L1)および前記第2の波長(L2)が、互いに異なっており、前記第1の波長(L1)が430nm付近であり、前記第2の波長(L2)が470nm付近であり、それぞれの許容誤差が10nmである、
前記オプトエレクトロニクス半導体デバイスと、
− 前記第1の波長(L1)を、少なくとも部分的に、異なる周波数を有する放射に変換する少なくとも1つの変換手段(3)であって、この変換が、前記発光手段(1)によって放出される放射スペクトルが、標準色度図において、黒体曲線との間の平均距離が0.05以下である色度座標を有するように行われる、前記変換手段(3)と、
を備え、
前記第2の波長(L2)は、前記変換手段(3)の主動作範囲よりも短い波長であり、前記変換手段(3)の主動作範囲は、前記変換手段(3)の最も強い発光帯が位置するスペクトル範囲を意味し、前記主動作範囲は、連続的なスペクトル範囲であり、前記主動作範囲の境界は、前記主動作範囲の最大強度の約13.6%に相当する強度を有し、
前記変換手段(3)は、前記第1の波長(L1)を有する光の第1の割合を変換し、前記第1の割合は少なくとも50%であり、前記第2の波長(L2)を有する光の第2の割合を変換し、前記第2の割合は最大で90%であり、前記第1の割合は前記第2の割合よりも少なくとも5%は大きく、
前記変換手段(3)は第1の蛍光体Aおよび第2の蛍光体Bを有し、蛍光体Aの吸収の最大値は420nm〜480nmの間(両端値を含む)であるのに対して、蛍光体Bの吸収の最大値は短波長方向に単調に増大する吸収率を有し、
前記第1および第2の波長(L1、L2)の放射が前記変換手段(3)に到達する前、前記第1の波長(L1)の放射は前記第2の波長(L2)の放射よりも高い最大強度を有し、
前記第1および第2の波長(L1、L2)の放射が前記変換手段(3)を通った後、前記第1の波長(L1)の放射は前記第2の波長(L2)の放射よりも低い最大強度を有し、前記第2の波長(L2)の放射の最大強度は、前記変換手段(3)により放出される放射の最大強度よりも低く、
前記蛍光体Aは、主波長が550nm〜575nmの間(両端値を含む)であり、前記蛍光体Bは、主波長が595nm〜610nmの間(両端値を含む)である、
発光手段(1)。 - 前記半導体デバイス(2)が、前記第1の波長(L1)で放出する少なくとも1つの半導体チップ(20a)と、前記第2の波長(L2)で放出する少なくとも1つの半導体チップ(20b)とを備えている、
請求項1に記載の発光手段(1)。 - 前記半導体デバイス(2)が、少なくとも2つの活性領域(21a,21b)を備えている少なくとも1つの半導体チップ(20)、を備えており、前記活性領域(21a,21b)のうちの少なくとも第1の活性領域が、動作時に前記第1の波長(L1)を有する放射を放出するように設計されており、前記活性領域(21a,21b)のうちの少なくとも第2の活性領域が、動作時に前記第2の波長(L2)を有する放射を放出するように設計されている、
請求項1に記載の発光手段(1)。 - 前記半導体デバイス(2)が、第1の部分(22)と第2の部分(23)とを有する活性ゾーン(21)、を有する少なくとも1つの半導体チップ(20)、を備えており、動作時、前記第1の部分(22)が前記第1の波長(L1)を有する放射を放出し、前記第2の部分(23)が前記第2の波長(L2)を有する放射を放出する、
請求項1に記載の発光手段(1)。 - 前記半導体デバイス(2)によって放出される前記放射のスペクトル幅(B)が少なくとも50nmである、
請求項1から請求項4のいずれかに記載の発光手段(1)。 - 前記蛍光体Aは、一般的な組成式が(Y,Gd,Lu)3(Al,Ga)5O12:Ce3+である、
請求項1から請求項5のいずれかに記載の発光手段(1)。 - 前記蛍光体Bは、一般的な組成式が(Ca,Sr,Ba)AlSiN3:Eu2+あるいは(Ca,Sr,Ba)2Si2N5:Eu2+である、
請求項1から請求項6のいずれかに記載の発光手段(1)。 - 前記発光手段(1)の色温度が、2500゜K〜6500゜K(の間)(両端値を含む)である、
請求項1から請求項7のいずれかに記載の発光手段(1)。 - 前記第1の割合は前記第2の割合よりも少なくとも10%は大きい、
請求項1から請求項8のいずれかに記載の発光手段(1)。 - 前記第2の波長(L2)で放射パワーの少なくとも75%が前記変換手段(3)を透過し、前記第1の波長(L1)で放射パワーの少なくとも95%が前記変換手段(3)によって変換される、
請求項1から請求項9のいずれかに記載の発光手段(1)。 - 前記半導体デバイス(2)が、少なくとも600nmの第3の波長を有する光を動作時に放出する少なくとも1つの半導体チップ(2)、を備えている、
請求項1から請求項10のいずれかに記載の発光手段(1)。 - 前記第1の波長(L1)の強度と前記第2の波長(L2)の強度の比率を設定する目的に使用できる制御ユニット(5)、
を備えている、
請求項2に記載の発光手段(1)。 - 前記変換手段(3)は前記第1の波長(L1)の放射の少なくとも95%を波長変換し、前記第2の波長(L2)の放射の最大で90%を波長変換する、
請求項1から請求項12のいずれかに記載の発光手段(1)。
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE102008050643.5A DE102008050643B4 (de) | 2008-10-07 | 2008-10-07 | Leuchtmittel |
DE102008050643.5 | 2008-10-07 | ||
PCT/DE2009/001140 WO2010040327A1 (de) | 2008-10-07 | 2009-08-11 | Leuchtmittel |
Publications (3)
Publication Number | Publication Date |
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JP2012505527A JP2012505527A (ja) | 2012-03-01 |
JP2012505527A5 JP2012505527A5 (ja) | 2012-06-07 |
JP5827895B2 true JP5827895B2 (ja) | 2015-12-02 |
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JP2011529442A Active JP5827895B2 (ja) | 2008-10-07 | 2009-08-11 | 発光手段 |
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US (1) | US8410507B2 (ja) |
EP (1) | EP2335292A1 (ja) |
JP (1) | JP5827895B2 (ja) |
KR (1) | KR101612576B1 (ja) |
CN (1) | CN102177594B (ja) |
DE (1) | DE102008050643B4 (ja) |
TW (1) | TWI398024B (ja) |
WO (1) | WO2010040327A1 (ja) |
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DE102010046790A1 (de) * | 2010-09-28 | 2012-03-29 | Osram Opto Semiconductors Gmbh | Optoelektronisches Halbleiterbauelement und Verfahren zu dessen Herstellung |
EP3848985B1 (en) * | 2011-04-22 | 2023-06-07 | Seoul Semiconductor Co., Ltd. | White light equipment |
DE102011085645B4 (de) | 2011-11-03 | 2014-06-26 | Osram Gmbh | Leuchtdiodenmodul und Verfahren zum Betreiben eines Leuchtdiodenmoduls |
US8779687B2 (en) * | 2012-02-13 | 2014-07-15 | Xicato, Inc. | Current routing to multiple LED circuits |
DE102012202927B4 (de) * | 2012-02-27 | 2021-06-10 | Osram Gmbh | Lichtquelle mit led-chip und leuchtstoffschicht |
EP3382755B1 (en) * | 2012-04-06 | 2020-01-08 | Signify Holding B.V. | White light emitting module |
DE102012111564A1 (de) * | 2012-11-29 | 2014-06-18 | Osram Opto Semiconductors Gmbh | Beleuchtungsvorrichtung |
FR3001334B1 (fr) * | 2013-01-24 | 2016-05-06 | Centre Nat De La Rech Scient (Cnrs) | Procede de fabrication de diodes blanches monolithiques |
DE102013205179A1 (de) * | 2013-03-25 | 2014-09-25 | Osram Gmbh | Verfahren zum Herstellen einer elektromagnetische Strahlung emittierenden Baugruppe und elektromagnetische Strahlung emittierende Baugruppe |
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JP6358457B2 (ja) | 2014-01-20 | 2018-07-18 | パナソニックIpマネジメント株式会社 | 発光装置、照明用光源及び照明装置 |
US20180231191A1 (en) * | 2014-10-01 | 2018-08-16 | Koninklijke Philips N.V. | Light source with tunable emission spectrum |
JP2016219519A (ja) * | 2015-05-18 | 2016-12-22 | サンケン電気株式会社 | 発光装置 |
US10303040B2 (en) * | 2017-02-08 | 2019-05-28 | Kapteyn Murnane Laboratories, Inc. | Integrated wavelength conversion and laser source |
US10685941B1 (en) | 2019-07-09 | 2020-06-16 | Intematix Corporation | Full spectrum white light emitting devices |
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CN111540734B (zh) * | 2020-05-08 | 2021-08-24 | 开发晶照明(厦门)有限公司 | 发光装置 |
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2008
- 2008-10-07 DE DE102008050643.5A patent/DE102008050643B4/de active Active
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2009
- 2009-08-11 WO PCT/DE2009/001140 patent/WO2010040327A1/de active Application Filing
- 2009-08-11 JP JP2011529442A patent/JP5827895B2/ja active Active
- 2009-08-11 CN CN200980139944.4A patent/CN102177594B/zh active Active
- 2009-08-11 US US13/122,779 patent/US8410507B2/en active Active
- 2009-08-11 KR KR1020117000333A patent/KR101612576B1/ko active IP Right Grant
- 2009-08-11 EP EP09776087A patent/EP2335292A1/de not_active Withdrawn
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CN102177594A (zh) | 2011-09-07 |
DE102008050643A1 (de) | 2010-04-08 |
CN102177594B (zh) | 2014-07-02 |
KR101612576B1 (ko) | 2016-04-14 |
US20110248295A1 (en) | 2011-10-13 |
EP2335292A1 (de) | 2011-06-22 |
TWI398024B (zh) | 2013-06-01 |
JP2012505527A (ja) | 2012-03-01 |
US8410507B2 (en) | 2013-04-02 |
WO2010040327A1 (de) | 2010-04-15 |
TW201025679A (en) | 2010-07-01 |
KR20110087264A (ko) | 2011-08-02 |
DE102008050643B4 (de) | 2022-11-03 |
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