JP5821811B2 - 絶縁性基板、金属張積層板、プリント配線板、及び半導体装置 - Google Patents

絶縁性基板、金属張積層板、プリント配線板、及び半導体装置 Download PDF

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Publication number
JP5821811B2
JP5821811B2 JP2012191863A JP2012191863A JP5821811B2 JP 5821811 B2 JP5821811 B2 JP 5821811B2 JP 2012191863 A JP2012191863 A JP 2012191863A JP 2012191863 A JP2012191863 A JP 2012191863A JP 5821811 B2 JP5821811 B2 JP 5821811B2
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JP
Japan
Prior art keywords
layer
fiber base
resin
insulating substrate
thickness
Prior art date
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Expired - Fee Related
Application number
JP2012191863A
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English (en)
Japanese (ja)
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JP2013016835A (ja
JP2013016835A5 (https=
Inventor
小野塚　偉師
偉師 小野塚
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sumitomo Bakelite Co Ltd
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Sumitomo Bakelite Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sumitomo Bakelite Co Ltd filed Critical Sumitomo Bakelite Co Ltd
Priority to JP2012191863A priority Critical patent/JP5821811B2/ja
Publication of JP2013016835A publication Critical patent/JP2013016835A/ja
Publication of JP2013016835A5 publication Critical patent/JP2013016835A5/ja
Application granted granted Critical
Publication of JP5821811B2 publication Critical patent/JP5821811B2/ja
Expired - Fee Related legal-status Critical Current
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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H10W74/15—Encapsulations, e.g. protective coatings characterised by their shape or disposition on active surfaces of flip-chip devices, e.g. underfills
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/721—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors
    • H10W90/724—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors between a chip and a stacked insulating package substrate, interposer or RDL

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  • Production Of Multi-Layered Print Wiring Board (AREA)
JP2012191863A 2010-11-18 2012-08-31 絶縁性基板、金属張積層板、プリント配線板、及び半導体装置 Expired - Fee Related JP5821811B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2012191863A JP5821811B2 (ja) 2010-11-18 2012-08-31 絶縁性基板、金属張積層板、プリント配線板、及び半導体装置

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2010258172 2010-11-18
JP2010258172 2010-11-18
JP2012191863A JP5821811B2 (ja) 2010-11-18 2012-08-31 絶縁性基板、金属張積層板、プリント配線板、及び半導体装置

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
JP2011209540A Division JP5115645B2 (ja) 2010-11-18 2011-09-26 絶縁性基板、金属張積層板、プリント配線板、及び半導体装置

Publications (3)

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JP2013016835A JP2013016835A (ja) 2013-01-24
JP2013016835A5 JP2013016835A5 (https=) 2015-01-29
JP5821811B2 true JP5821811B2 (ja) 2015-11-24

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ID=47432428

Family Applications (2)

Application Number Title Priority Date Filing Date
JP2012191863A Expired - Fee Related JP5821811B2 (ja) 2010-11-18 2012-08-31 絶縁性基板、金属張積層板、プリント配線板、及び半導体装置
JP2012191864A Expired - Fee Related JP5152432B2 (ja) 2010-11-18 2012-08-31 絶縁性基板、金属張積層板、プリント配線板、及び半導体装置

Family Applications After (1)

Application Number Title Priority Date Filing Date
JP2012191864A Expired - Fee Related JP5152432B2 (ja) 2010-11-18 2012-08-31 絶縁性基板、金属張積層板、プリント配線板、及び半導体装置

Country Status (1)

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JP (2) JP5821811B2 (https=)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102494332B1 (ko) * 2015-07-15 2023-02-02 삼성전기주식회사 전자소자 패키지
KR101916379B1 (ko) * 2016-01-22 2018-11-08 한솔테크닉스(주) 커브드형 회로기판
JP2022119300A (ja) * 2021-02-04 2022-08-17 イビデン株式会社 プリント配線板の検査方法
WO2025154213A1 (ja) * 2024-01-17 2025-07-24 株式会社レゾナック 半導体パッケージを製造する方法、半導体パッケージ用基板材料、及び半導体パッケージ用基板材料を製造する方法

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3168870B2 (ja) * 1995-04-26 2001-05-21 松下電工株式会社 多層積層板の製造方法
JP2001177244A (ja) * 1999-12-17 2001-06-29 Hitachi Chem Co Ltd 多層板の製造方法
JP2002134918A (ja) * 2000-10-26 2002-05-10 Matsushita Electric Works Ltd 多層プリント配線板の製造方法
JP3499837B2 (ja) * 2001-03-13 2004-02-23 住友ベークライト株式会社 プリプレグの製造方法
KR101360531B1 (ko) * 2006-04-28 2014-02-10 스미토모 베이클리트 컴퍼니 리미티드 땜납 레지스트 재료 및 그것을 이용한 배선판 및 반도체 패키지
CN101543150B (zh) * 2006-11-10 2012-11-28 日本电气株式会社 多层布线基板
KR101103451B1 (ko) * 2007-01-29 2012-01-09 스미토모 베이클리트 컴퍼니 리미티드 적층체, 기판의 제조 방법, 기판 및 반도체 장치

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JP2013016835A (ja) 2013-01-24
JP5152432B2 (ja) 2013-02-27
JP2012231195A (ja) 2012-11-22

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