JP2013016835A5 - - Google Patents

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Publication number
JP2013016835A5
JP2013016835A5 JP2012191863A JP2012191863A JP2013016835A5 JP 2013016835 A5 JP2013016835 A5 JP 2013016835A5 JP 2012191863 A JP2012191863 A JP 2012191863A JP 2012191863 A JP2012191863 A JP 2012191863A JP 2013016835 A5 JP2013016835 A5 JP 2013016835A5
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JP
Japan
Prior art keywords
surface side
fiber base
insulating substrate
layer
thickness
Prior art date
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Application number
JP2012191863A
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English (en)
Japanese (ja)
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JP2013016835A (ja
JP5821811B2 (ja
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Priority to JP2012191863A priority Critical patent/JP5821811B2/ja
Priority claimed from JP2012191863A external-priority patent/JP5821811B2/ja
Publication of JP2013016835A publication Critical patent/JP2013016835A/ja
Publication of JP2013016835A5 publication Critical patent/JP2013016835A5/ja
Application granted granted Critical
Publication of JP5821811B2 publication Critical patent/JP5821811B2/ja
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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JP2012191863A 2010-11-18 2012-08-31 絶縁性基板、金属張積層板、プリント配線板、及び半導体装置 Expired - Fee Related JP5821811B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2012191863A JP5821811B2 (ja) 2010-11-18 2012-08-31 絶縁性基板、金属張積層板、プリント配線板、及び半導体装置

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2010258172 2010-11-18
JP2010258172 2010-11-18
JP2012191863A JP5821811B2 (ja) 2010-11-18 2012-08-31 絶縁性基板、金属張積層板、プリント配線板、及び半導体装置

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
JP2011209540A Division JP5115645B2 (ja) 2010-11-18 2011-09-26 絶縁性基板、金属張積層板、プリント配線板、及び半導体装置

Publications (3)

Publication Number Publication Date
JP2013016835A JP2013016835A (ja) 2013-01-24
JP2013016835A5 true JP2013016835A5 (https=) 2015-01-29
JP5821811B2 JP5821811B2 (ja) 2015-11-24

Family

ID=47432428

Family Applications (2)

Application Number Title Priority Date Filing Date
JP2012191863A Expired - Fee Related JP5821811B2 (ja) 2010-11-18 2012-08-31 絶縁性基板、金属張積層板、プリント配線板、及び半導体装置
JP2012191864A Expired - Fee Related JP5152432B2 (ja) 2010-11-18 2012-08-31 絶縁性基板、金属張積層板、プリント配線板、及び半導体装置

Family Applications After (1)

Application Number Title Priority Date Filing Date
JP2012191864A Expired - Fee Related JP5152432B2 (ja) 2010-11-18 2012-08-31 絶縁性基板、金属張積層板、プリント配線板、及び半導体装置

Country Status (1)

Country Link
JP (2) JP5821811B2 (https=)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102494332B1 (ko) * 2015-07-15 2023-02-02 삼성전기주식회사 전자소자 패키지
KR101916379B1 (ko) * 2016-01-22 2018-11-08 한솔테크닉스(주) 커브드형 회로기판
JP2022119300A (ja) * 2021-02-04 2022-08-17 イビデン株式会社 プリント配線板の検査方法
WO2025154213A1 (ja) * 2024-01-17 2025-07-24 株式会社レゾナック 半導体パッケージを製造する方法、半導体パッケージ用基板材料、及び半導体パッケージ用基板材料を製造する方法

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3168870B2 (ja) * 1995-04-26 2001-05-21 松下電工株式会社 多層積層板の製造方法
JP2001177244A (ja) * 1999-12-17 2001-06-29 Hitachi Chem Co Ltd 多層板の製造方法
JP2002134918A (ja) * 2000-10-26 2002-05-10 Matsushita Electric Works Ltd 多層プリント配線板の製造方法
JP3499837B2 (ja) * 2001-03-13 2004-02-23 住友ベークライト株式会社 プリプレグの製造方法
WO2007126130A1 (ja) * 2006-04-28 2007-11-08 Sumitomo Bakelite Co., Ltd. ソルダーレジスト材料及びそれを用いた配線板並びに半導体パッケージ
CN101543150B (zh) * 2006-11-10 2012-11-28 日本电气株式会社 多层布线基板
CN101584259B (zh) * 2007-01-29 2011-09-14 住友电木株式会社 层叠体、基板的制造方法、基板及半导体装置

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