JP5801685B2 - 配線基板、発光装置及び配線基板の製造方法 - Google Patents

配線基板、発光装置及び配線基板の製造方法 Download PDF

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Publication number
JP5801685B2
JP5801685B2 JP2011233288A JP2011233288A JP5801685B2 JP 5801685 B2 JP5801685 B2 JP 5801685B2 JP 2011233288 A JP2011233288 A JP 2011233288A JP 2011233288 A JP2011233288 A JP 2011233288A JP 5801685 B2 JP5801685 B2 JP 5801685B2
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JP
Japan
Prior art keywords
layer
substrate
wiring board
insulating layer
wiring
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2011233288A
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English (en)
Japanese (ja)
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JP2013093386A5 (enExample
JP2013093386A (ja
Inventor
清水　浩
浩 清水
木村　康之
康之 木村
直 荒井
直 荒井
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shinko Electric Industries Co Ltd
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Shinko Electric Industries Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shinko Electric Industries Co Ltd filed Critical Shinko Electric Industries Co Ltd
Priority to JP2011233288A priority Critical patent/JP5801685B2/ja
Priority to US13/655,802 priority patent/US9257354B2/en
Priority to EP12189184.0A priority patent/EP2587533B1/en
Priority to CN201210430706.2A priority patent/CN103066184B/zh
Publication of JP2013093386A publication Critical patent/JP2013093386A/ja
Publication of JP2013093386A5 publication Critical patent/JP2013093386A5/ja
Application granted granted Critical
Publication of JP5801685B2 publication Critical patent/JP5801685B2/ja
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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/67—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their insulating layers or insulating parts
    • H10W70/68—Shapes or dispositions thereof
    • H10W70/6875—Shapes or dispositions thereof being on a metallic substrate, e.g. insulated metal substrates [IMS]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W42/00—Arrangements for protection of devices
    • H10W42/121—Arrangements for protection of devices protecting against mechanical damage
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/67—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their insulating layers or insulating parts
    • H10W70/69—Insulating materials thereof
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09372—Pads and lands
    • H05K2201/09409—Multiple rows of pads, lands, terminals or dummy patterns; Multiple rows of mounted components
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/855—Optical field-shaping means, e.g. lenses
    • H10H20/856—Reflecting means
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/551—Materials of bond wires
    • H10W72/552—Materials of bond wires comprising metals or metalloids, e.g. silver
    • H10W72/5522—Materials of bond wires comprising metals or metalloids, e.g. silver comprising gold [Au]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/551—Materials of bond wires
    • H10W72/552—Materials of bond wires comprising metals or metalloids, e.g. silver
    • H10W72/5524—Materials of bond wires comprising metals or metalloids, e.g. silver comprising aluminium [Al]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/551—Materials of bond wires
    • H10W72/552—Materials of bond wires comprising metals or metalloids, e.g. silver
    • H10W72/5525—Materials of bond wires comprising metals or metalloids, e.g. silver comprising copper [Cu]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/754—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked insulating package substrate, interposer or RDL

Landscapes

  • Led Device Packages (AREA)
  • Planar Illumination Modules (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Manufacturing Of Printed Wiring (AREA)
JP2011233288A 2011-10-24 2011-10-24 配線基板、発光装置及び配線基板の製造方法 Active JP5801685B2 (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2011233288A JP5801685B2 (ja) 2011-10-24 2011-10-24 配線基板、発光装置及び配線基板の製造方法
US13/655,802 US9257354B2 (en) 2011-10-24 2012-10-19 Wiring substrate, light emitting device, and method for manufacturing wiring substrate
EP12189184.0A EP2587533B1 (en) 2011-10-24 2012-10-19 Wiring substrate, light emitting device, and method for manufacturing wiring substrate
CN201210430706.2A CN103066184B (zh) 2011-10-24 2012-10-22 配线基板、发光装置、以及配线基板的制造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2011233288A JP5801685B2 (ja) 2011-10-24 2011-10-24 配線基板、発光装置及び配線基板の製造方法

Publications (3)

Publication Number Publication Date
JP2013093386A JP2013093386A (ja) 2013-05-16
JP2013093386A5 JP2013093386A5 (enExample) 2014-09-11
JP5801685B2 true JP5801685B2 (ja) 2015-10-28

Family

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JP2011233288A Active JP5801685B2 (ja) 2011-10-24 2011-10-24 配線基板、発光装置及び配線基板の製造方法

Country Status (4)

Country Link
US (1) US9257354B2 (enExample)
EP (1) EP2587533B1 (enExample)
JP (1) JP5801685B2 (enExample)
CN (1) CN103066184B (enExample)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6068175B2 (ja) * 2013-02-12 2017-01-25 新光電気工業株式会社 配線基板、発光装置、配線基板の製造方法及び発光装置の製造方法
JP6111832B2 (ja) * 2013-05-06 2017-04-12 株式会社デンソー 多層基板およびこれを用いた電子装置、電子装置の製造方法
DE102013215350A1 (de) * 2013-08-05 2015-02-05 Osram Opto Semiconductors Gmbh Verfahren zum Herstellen einer Beleuchtungsanordnung
JP5918809B2 (ja) * 2014-07-04 2016-05-18 株式会社イースタン 配線基板の製造方法および配線基板
CN104538532B (zh) * 2015-01-30 2017-09-15 矽照光电（厦门）有限公司 一种led封装方法
JP6974724B2 (ja) * 2018-03-08 2021-12-01 日亜化学工業株式会社 発光装置の製造方法
JP7100707B2 (ja) * 2018-08-28 2022-07-13 京セラ株式会社 配線基板および電子装置
KR102684757B1 (ko) * 2019-08-22 2024-07-16 삼성디스플레이 주식회사 표시 장치
US11830833B2 (en) 2020-07-24 2023-11-28 Innolux Corporation Electronic substrate and electronic device
CN113972308B (zh) * 2020-07-24 2025-08-26 群创光电股份有限公司 电子基板以及电子装置
CN113690228B (zh) * 2021-08-05 2023-06-23 福建天电光电有限公司 集成式led发光器件及其制备方法

Family Cites Families (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH07235618A (ja) 1994-02-25 1995-09-05 Mitsui Toatsu Chem Inc 多端子半導体パッケージ
JPH10270591A (ja) * 1997-03-21 1998-10-09 Nec Corp 半導体装置用パッケージおよびその製造方法
CN1222918C (zh) * 2001-08-27 2005-10-12 佳能株式会社 布线基板及使用该布线基板的图象显示装置
JP4067802B2 (ja) 2001-09-18 2008-03-26 松下電器産業株式会社 照明装置
WO2004077525A2 (en) * 2003-02-25 2004-09-10 Tessera, Inc. Ball grid array with bumps
DE10339770B4 (de) * 2003-08-27 2007-08-30 Infineon Technologies Ag Verfahren zum Herstellen einer FBGA-Anordnung
JP4856463B2 (ja) 2005-10-17 2012-01-18 株式会社 日立ディスプレイズ 液晶表示装置
JP2007235618A (ja) 2006-03-01 2007-09-13 Nec Soft Ltd ユーザアカウント名の自動割当システム、その方法、ユーザアカウント名取得装置およびプログラム
JP5259095B2 (ja) * 2006-06-19 2013-08-07 新光電気工業株式会社 半導体装置
US20090001404A1 (en) * 2007-06-29 2009-01-01 Ohata Takafumi Semiconductor light emitting device, process for producing the same, and led illuminating apparatus using the same
JP2009033088A (ja) * 2007-06-29 2009-02-12 Sharp Corp 半導体発光装置、その製造方法およびそれを用いたｌｅｄ照明装置
JP4825784B2 (ja) * 2007-12-13 2011-11-30 新光電気工業株式会社 半導体装置用パッケージおよびその製造方法
JP5665020B2 (ja) * 2009-12-22 2015-02-04 国立大学法人九州工業大学 配線用電子部品の製造方法
KR101067091B1 (ko) * 2010-03-31 2011-09-22 삼성전기주식회사 방열기판 및 그 제조방법
JP4970577B2 (ja) 2010-08-05 2012-07-11 ジャパンライフ株式会社 スペーサー
JP4762374B1 (ja) * 2011-02-14 2011-08-31 積水化学工業株式会社 感光性組成物及びプリント配線板

Also Published As

Publication number Publication date
CN103066184B (zh) 2017-03-29
US9257354B2 (en) 2016-02-09
EP2587533A1 (en) 2013-05-01
JP2013093386A (ja) 2013-05-16
US20130099273A1 (en) 2013-04-25
EP2587533B1 (en) 2018-11-21
CN103066184A (zh) 2013-04-24

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