JP5918809B2 - 配線基板の製造方法および配線基板 - Google Patents
配線基板の製造方法および配線基板 Download PDFInfo
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Description
本発明の実施形態1に係る配線基板10の製造方法について、図1〜図6を参照して説明する。図1〜図6は、本実施形態に係る製造工程中の配線基板10の要部模式的断面図である。なお、この配線基板10の表面(実装面)に電子部品(例えば、半導体素子、チップコンデンサなど)が実装されて、半導体装置(半導体パッケージ)が構成される。
本発明の実施形態2に係る配線基板10の製造方法について、図7〜図11を参照して説明する。図7〜図11は、本実施形態に係る製造工程中の配線基板10の要部模式的断面図である。
本発明の実施形態3に係る配線基板10の製造方法について、図14〜図16を参照して説明する。図14〜図16は、本実施形態に係る製造工程中の配線基板10の要部模式的断面図である。なお、本実施形態に係る配線基板10の製造方法は、前記実施形態2において、図7を参照して説明した工程までは同じ工程を経るため、以下では、それ以降の工程について説明する。
12 第1表面領域
14 第2表面領域
16 配線
18 基体
20 レジスト
22 樹脂体
24 樹脂開口部
24a 第1樹脂開口部
24b 第2樹脂開口部
26 第3表面領域
28 第4表面領域
30 マスク
32 第1開口部
34 第2開口部
36 樹脂凹部
100 半導体装置
101,102 半導体素子
103 ボンディングワイヤ
104 保護材
105 半導体装置
106 半導体素子
107 電極バンプ
Claims (7)
- (a)第1表面領域と、該第1表面領域の周囲の第2表面領域とを有し、配線が形成された基体を準備する工程と、
(b)前記第1表面領域を覆うレジストを形成する工程と、
(c)前記レジストを内包するように、前記第1および第2表面領域を樹脂体で覆う工程と、
(d)前記樹脂体から前記レジストを露出させる工程と、
(e)露出した前記レジストを除去することで、前記第1表面領域における前記基体を露出させる樹脂開口部を前記樹脂体に形成する工程と
を含むことを特徴とする配線基板の製造方法。 - 請求項1記載の配線基板の製造方法において、
前記(d)工程では、前記樹脂体を半硬化の状態で用い、
前記(d)工程の後、前記(e)工程の前に、前記樹脂体を完全に硬化する。 - 請求項1または2記載の配線基板の製造方法において、
前記(b)工程では、前記レジストとして感光性樹脂を用い、
前記(c)工程では、前記樹脂体として感熱性樹脂を用いる。 - 請求項1〜3のいずれか一項に記載の配線基板の製造方法において、
前記(a)工程では、前記配線と電気的に接続された電極パッドが前記第1表面領域に形成された前記基板を準備し、
前記(e)工程では、前記樹脂開口部から前記電極パッドを露出させる。 - 請求項1〜4のいずれか一項に記載の配線基板の製造方法において、
(f)前記(c)工程の後、前記(d)工程の前に、前記第1表面領域の上方に第1開口部を有するマスクを前記樹脂体上に形成する工程を更に含み、
前記(d)工程では、前記レジストを露出させるまで前記第1開口部から前記樹脂体を除去し、
前記(d)工程の後、前記マスクを除去する。 - 請求項5記載の配線基板の製造方法において、
前記(f)工程では、前記第1開口部の前記レジストに対する面積が該レジストよりも大きい前記マスクを用い、
前記(d)工程では、前記レジスト上の前記樹脂体の部分と、該部分の周囲部分とを除去し、
前記(e)工程では、前記樹脂開口部において該樹脂開口部の底面側より開口側が大きくなる段差を形成する。 - 請求項5または6記載の配線基板の製造方法において、
前記(a)工程では、前記第1表面領域とは異なる第3表面領域と、該第3表面領域の周囲の第4表面領域とを更に有する前記基板を準備し、
前記(c)工程では、前記第1および第2表面領域と共に、前記第3および第4表面領域を前記樹脂体で覆い、
前記(f)工程では、前記第3表面領域の上方に第2開口部を更に有する前記マスクを前記樹脂体上に形成し、
前記(d)工程では、前記第2開口部から前記樹脂体を除去し、樹脂凹部を前記樹脂体に形成する。
Priority Applications (6)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2014138850A JP5918809B2 (ja) | 2014-07-04 | 2014-07-04 | 配線基板の製造方法および配線基板 |
PCT/JP2015/064044 WO2016002360A1 (ja) | 2014-07-04 | 2015-05-15 | 配線基板の製造方法および配線基板 |
US15/316,589 US9922923B2 (en) | 2014-07-04 | 2015-05-15 | Method of manufacturing wiring substrate and wiring substrate |
KR1020167035861A KR20170026372A (ko) | 2014-07-04 | 2015-05-15 | 배선 기판의 제조 방법 및 배선 기판 |
CN201580031884.XA CN106463471B (zh) | 2014-07-04 | 2015-05-15 | 配线基板的制造方法和配线基板 |
TW104116912A TWI666736B (zh) | 2014-07-04 | 2015-05-27 | 配線基板的製造方法及配線基板 |
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JP2014138850A JP5918809B2 (ja) | 2014-07-04 | 2014-07-04 | 配線基板の製造方法および配線基板 |
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JP2016018815A JP2016018815A (ja) | 2016-02-01 |
JP5918809B2 true JP5918809B2 (ja) | 2016-05-18 |
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JP2014138850A Active JP5918809B2 (ja) | 2014-07-04 | 2014-07-04 | 配線基板の製造方法および配線基板 |
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US (1) | US9922923B2 (ja) |
JP (1) | JP5918809B2 (ja) |
KR (1) | KR20170026372A (ja) |
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CN106463471A (zh) | 2017-02-22 |
CN106463471B (zh) | 2019-03-08 |
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