JP5766318B2 - リードフレーム - Google Patents

リードフレーム Download PDF

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Publication number
JP5766318B2
JP5766318B2 JP2014027512A JP2014027512A JP5766318B2 JP 5766318 B2 JP5766318 B2 JP 5766318B2 JP 2014027512 A JP2014027512 A JP 2014027512A JP 2014027512 A JP2014027512 A JP 2014027512A JP 5766318 B2 JP5766318 B2 JP 5766318B2
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Japan
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plating
plating layer
layer
lead frame
current
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JP2014027512A
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English (en)
Japanese (ja)
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JP2014123760A5 (enExample
JP2014123760A (ja
Inventor
明 李
明 李
大悟 山浦
大悟 山浦
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsui High Tec Inc
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Mitsui High Tec Inc
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Publication date
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Priority to JP2014027512A priority Critical patent/JP5766318B2/ja
Publication of JP2014123760A publication Critical patent/JP2014123760A/ja
Publication of JP2014123760A5 publication Critical patent/JP2014123760A5/ja
Application granted granted Critical
Publication of JP5766318B2 publication Critical patent/JP5766318B2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

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  • Electroplating Methods And Accessories (AREA)
  • Lead Frames For Integrated Circuits (AREA)
JP2014027512A 2014-02-17 2014-02-17 リードフレーム Expired - Lifetime JP5766318B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2014027512A JP5766318B2 (ja) 2014-02-17 2014-02-17 リードフレーム

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2014027512A JP5766318B2 (ja) 2014-02-17 2014-02-17 リードフレーム

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
JP2011087575A Division JP5508329B2 (ja) 2011-04-11 2011-04-11 リードフレーム

Publications (3)

Publication Number Publication Date
JP2014123760A JP2014123760A (ja) 2014-07-03
JP2014123760A5 JP2014123760A5 (enExample) 2014-08-14
JP5766318B2 true JP5766318B2 (ja) 2015-08-19

Family

ID=51403959

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2014027512A Expired - Lifetime JP5766318B2 (ja) 2014-02-17 2014-02-17 リードフレーム

Country Status (1)

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JP (1) JP5766318B2 (enExample)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN108611668B (zh) * 2016-12-12 2020-05-05 中国航空工业标准件制造有限责任公司 一种改善无氰电镀锌产品外观质量的方法
CN109937479B (zh) * 2016-12-27 2023-01-13 古河电气工业株式会社 引线框材料及其制造方法以及半导体封装件
CN111557043B (zh) * 2018-03-23 2024-09-17 古河电气工业株式会社 引线框材料及其制造方法、以及使用其的半导体封装体
CN115172172A (zh) * 2022-06-20 2022-10-11 广东华智芯电子科技有限公司 镍金镀层的制备方法

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH04337657A (ja) * 1991-05-14 1992-11-25 Hitachi Cable Ltd 半導体装置用リードフレーム
JP3259894B2 (ja) * 1996-04-30 2002-02-25 ソニー株式会社 リードフレーム、その製造方法及びそのリードフレームを用いた半導体装置
JPH10265991A (ja) * 1997-03-24 1998-10-06 Nikko Kinzoku Kk 樹脂密着性に優れためっき材

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Publication number Publication date
JP2014123760A (ja) 2014-07-03

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