JP2007009334A5 - - Google Patents
Download PDFInfo
- Publication number
- JP2007009334A5 JP2007009334A5 JP2006287864A JP2006287864A JP2007009334A5 JP 2007009334 A5 JP2007009334 A5 JP 2007009334A5 JP 2006287864 A JP2006287864 A JP 2006287864A JP 2006287864 A JP2006287864 A JP 2006287864A JP 2007009334 A5 JP2007009334 A5 JP 2007009334A5
- Authority
- JP
- Japan
- Prior art keywords
- plating
- layer
- plating layer
- current
- lead frame
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000007747 plating Methods 0.000 claims description 163
- PXHVJJICTQNCMI-UHFFFAOYSA-N nickel Substances [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims description 118
- 239000000463 material Substances 0.000 claims description 23
- 229910052751 metal Inorganic materials 0.000 claims description 15
- 239000002184 metal Substances 0.000 claims description 15
- 238000005452 bending Methods 0.000 claims description 11
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 9
- 229910052802 copper Inorganic materials 0.000 claims description 9
- 239000010949 copper Substances 0.000 claims description 9
- 229910000881 Cu alloy Inorganic materials 0.000 claims description 8
- 229910000510 noble metal Inorganic materials 0.000 claims description 7
- 230000003746 surface roughness Effects 0.000 claims description 4
- 229910001030 Iron–nickel alloy Inorganic materials 0.000 claims description 3
- 239000000243 solution Substances 0.000 description 21
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 description 17
- 238000000034 method Methods 0.000 description 15
- 239000011347 resin Substances 0.000 description 15
- 229920005989 resin Polymers 0.000 description 15
- 239000013078 crystal Substances 0.000 description 14
- 239000010931 gold Substances 0.000 description 12
- 230000000694 effects Effects 0.000 description 11
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 10
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 description 10
- 239000001257 hydrogen Substances 0.000 description 10
- 229910052739 hydrogen Inorganic materials 0.000 description 10
- -1 First Substances 0.000 description 8
- 229910052737 gold Inorganic materials 0.000 description 8
- 239000002245 particle Substances 0.000 description 8
- VEXZGXHMUGYJMC-UHFFFAOYSA-M Chloride anion Chemical compound [Cl-] VEXZGXHMUGYJMC-UHFFFAOYSA-M 0.000 description 7
- 229910052763 palladium Inorganic materials 0.000 description 7
- 239000000956 alloy Substances 0.000 description 6
- 230000000052 comparative effect Effects 0.000 description 6
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 6
- 229910045601 alloy Inorganic materials 0.000 description 5
- KGBXLFKZBHKPEV-UHFFFAOYSA-N boric acid Chemical compound OB(O)O KGBXLFKZBHKPEV-UHFFFAOYSA-N 0.000 description 5
- 239000004327 boric acid Substances 0.000 description 5
- 238000005238 degreasing Methods 0.000 description 5
- 238000004090 dissolution Methods 0.000 description 5
- 125000004435 hydrogen atom Chemical group [H]* 0.000 description 5
- 230000003213 activating effect Effects 0.000 description 4
- 229910052736 halogen Inorganic materials 0.000 description 4
- 239000000203 mixture Substances 0.000 description 4
- 238000007789 sealing Methods 0.000 description 4
- 229910000679 solder Inorganic materials 0.000 description 4
- 230000007797 corrosion Effects 0.000 description 3
- 238000005260 corrosion Methods 0.000 description 3
- 230000007547 defect Effects 0.000 description 3
- 230000005611 electricity Effects 0.000 description 3
- 238000006722 reduction reaction Methods 0.000 description 3
- 239000004065 semiconductor Substances 0.000 description 3
- 229910052709 silver Inorganic materials 0.000 description 3
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 2
- 238000009792 diffusion process Methods 0.000 description 2
- 239000012535 impurity Substances 0.000 description 2
- 238000002844 melting Methods 0.000 description 2
- 230000008018 melting Effects 0.000 description 2
- 239000004332 silver Substances 0.000 description 2
- 239000006104 solid solution Substances 0.000 description 2
- 238000003860 storage Methods 0.000 description 2
- 229910020220 Pb—Sn Inorganic materials 0.000 description 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- 230000002378 acidificating effect Effects 0.000 description 1
- 238000000137 annealing Methods 0.000 description 1
- 125000004429 atom Chemical group 0.000 description 1
- 239000010953 base metal Substances 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 229910052801 chlorine Inorganic materials 0.000 description 1
- 239000000460 chlorine Substances 0.000 description 1
- DOBRDRYODQBAMW-UHFFFAOYSA-N copper(i) cyanide Chemical compound [Cu+].N#[C-] DOBRDRYODQBAMW-UHFFFAOYSA-N 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000010828 elution Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 238000011156 evaluation Methods 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 238000010348 incorporation Methods 0.000 description 1
- 150000002500 ions Chemical class 0.000 description 1
- 230000001788 irregular Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- LNOPIUAQISRISI-UHFFFAOYSA-N n'-hydroxy-2-propan-2-ylsulfonylethanimidamide Chemical compound CC(C)S(=O)(=O)CC(N)=NO LNOPIUAQISRISI-UHFFFAOYSA-N 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- HVZWVEKIQMJYIK-UHFFFAOYSA-N nitryl chloride Chemical compound [O-][N+](Cl)=O HVZWVEKIQMJYIK-UHFFFAOYSA-N 0.000 description 1
- 238000002161 passivation Methods 0.000 description 1
- 238000005554 pickling Methods 0.000 description 1
- 239000010970 precious metal Substances 0.000 description 1
- 238000001556 precipitation Methods 0.000 description 1
- 230000002265 prevention Effects 0.000 description 1
- 238000007086 side reaction Methods 0.000 description 1
- 239000010944 silver (metal) Substances 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- IIACRCGMVDHOTQ-UHFFFAOYSA-M sulfamate Chemical compound NS([O-])(=O)=O IIACRCGMVDHOTQ-UHFFFAOYSA-M 0.000 description 1
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2006287864A JP4704313B2 (ja) | 2006-10-23 | 2006-10-23 | リードフレームのめっき方法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2006287864A JP4704313B2 (ja) | 2006-10-23 | 2006-10-23 | リードフレームのめっき方法 |
Related Parent Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2003139114A Division JP3916586B2 (ja) | 2003-05-16 | 2003-05-16 | リードフレームのめっき方法 |
Related Child Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2009164981A Division JP2009235579A (ja) | 2009-07-13 | 2009-07-13 | リードフレーム |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2007009334A JP2007009334A (ja) | 2007-01-18 |
| JP2007009334A5 true JP2007009334A5 (enExample) | 2007-03-01 |
| JP4704313B2 JP4704313B2 (ja) | 2011-06-15 |
Family
ID=37748201
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2006287864A Expired - Fee Related JP4704313B2 (ja) | 2006-10-23 | 2006-10-23 | リードフレームのめっき方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP4704313B2 (enExample) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100834901B1 (ko) * | 2006-09-28 | 2008-06-03 | 알엠에스테크놀러지(주) | 전기액추에이터를 이용한 고정밀장비 운동제어용모션컨트롤러 및 이를 이용한 운동제어시스템 |
| JP2013013449A (ja) | 2011-06-30 | 2013-01-24 | Asahi Intecc Co Ltd | ガイドワイヤ |
-
2006
- 2006-10-23 JP JP2006287864A patent/JP4704313B2/ja not_active Expired - Fee Related
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JP3916586B2 (ja) | リードフレームのめっき方法 | |
| US3147547A (en) | Coating refractory metals | |
| JP2012502462A (ja) | リードフレーム及びその製造方法 | |
| JP2009235579A (ja) | リードフレーム | |
| JP2020155748A (ja) | リードフレーム | |
| JP5033197B2 (ja) | Ｓｎ−Ｂメッキ液及びこれを使用したメッキ法 | |
| JP6093646B2 (ja) | めっき膜の製造方法 | |
| JP5766318B2 (ja) | リードフレーム | |
| US7488408B2 (en) | Tin-plated film and method for producing the same | |
| JP2014123760A5 (enExample) | ||
| JPH10284667A (ja) | 耐食性、耐酸化性に優れる電気電子機器用部品材料、及びその製造方法 | |
| JP4704313B2 (ja) | リードフレームのめっき方法 | |
| WO2020079904A1 (ja) | 導電性材料、成型品及び電子部品 | |
| JP5508329B2 (ja) | リードフレーム | |
| JP7096955B1 (ja) | Ｎｉ電解めっき皮膜を備えるめっき構造体及び該めっき構造体を含むリードフレーム | |
| JP2007009334A5 (enExample) | ||
| JP4362600B2 (ja) | 金属−セラミックス接合部材 | |
| JP2020063493A (ja) | 導電性材料、成型品及び電子部品 | |
| JP4069181B2 (ja) | 無電解めっき法 | |
| JP2020105543A (ja) | 置換金めっき液および置換金めっき方法 | |
| JP3484367B2 (ja) | 無電解めっき方法およびその前処理方法 | |
| JP2000012762A (ja) | 耐食性に優れる電気電子機器用部品材料、及びその製造方法 | |
| JPWO2019163484A1 (ja) | 半導体素子及びその製造方法 | |
| JP2021070858A (ja) | 置換金めっき液および置換金めっき方法 | |
| JP2001185836A (ja) | 配線基板及び配線基板の製造方法及び製造装置 |