JP5765897B2 - 周期的パターンを有するベースプレート構造を含むヒートシンク、ならびに関連する装置および方法(周期的パターンを有するベースプレート構造を含むヒートシンク) - Google Patents
周期的パターンを有するベースプレート構造を含むヒートシンク、ならびに関連する装置および方法(周期的パターンを有するベースプレート構造を含むヒートシンク) Download PDFInfo
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- JP5765897B2 JP5765897B2 JP2010174276A JP2010174276A JP5765897B2 JP 5765897 B2 JP5765897 B2 JP 5765897B2 JP 2010174276 A JP2010174276 A JP 2010174276A JP 2010174276 A JP2010174276 A JP 2010174276A JP 5765897 B2 JP5765897 B2 JP 5765897B2
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- heat sink
- periodic pattern
- sink base
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- 230000000737 periodic effect Effects 0.000 title claims description 39
- 238000000034 method Methods 0.000 title claims description 7
- 239000004020 conductor Substances 0.000 claims description 7
- 238000001816 cooling Methods 0.000 description 31
- 229910052751 metal Inorganic materials 0.000 description 20
- 239000002184 metal Substances 0.000 description 20
- 239000000463 material Substances 0.000 description 14
- 239000011230 binding agent Substances 0.000 description 8
- 239000000945 filler Substances 0.000 description 6
- 239000004593 Epoxy Substances 0.000 description 5
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 4
- 239000002131 composite material Substances 0.000 description 4
- 239000011231 conductive filler Substances 0.000 description 4
- 229910052802 copper Inorganic materials 0.000 description 4
- 239000010949 copper Substances 0.000 description 4
- 239000007787 solid Substances 0.000 description 4
- 230000005670 electromagnetic radiation Effects 0.000 description 3
- 239000003990 capacitor Substances 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 230000005611 electricity Effects 0.000 description 2
- 238000003754 machining Methods 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000012545 processing Methods 0.000 description 2
- 238000012546 transfer Methods 0.000 description 2
- 229910052582 BN Inorganic materials 0.000 description 1
- PZNSFCLAULLKQX-UHFFFAOYSA-N Boron nitride Chemical group N#B PZNSFCLAULLKQX-UHFFFAOYSA-N 0.000 description 1
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- 230000002411 adverse Effects 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 238000005219 brazing Methods 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 238000001914 filtration Methods 0.000 description 1
- 229910002804 graphite Inorganic materials 0.000 description 1
- 239000010439 graphite Substances 0.000 description 1
- 230000017525 heat dissipation Effects 0.000 description 1
- 238000005304 joining Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 230000013011 mating Effects 0.000 description 1
- 230000001902 propagating effect Effects 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 239000002470 thermal conductor Substances 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/367—Cooling facilitated by shape of device
- H01L23/3677—Wire-like or pin-like cooling fins or heat sinks
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
- H01L23/467—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing gases, e.g. air
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/552—Protection against radiation, e.g. light or electromagnetic waves
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Materials Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Health & Medical Sciences (AREA)
- Electromagnetism (AREA)
- Toxicology (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
Description
上式で、A=WB+LPは、個々のEBG要素間の間隔と個々のEBG要素の寸法(すなわち幅または長さ)との和に対応する。ここで、c=3・108m/sであり、cは自由空間における光速を表し、εeffは、媒質の実効誘電率を表す。相互接続枝の寄与を考慮し、WP=LPおよびWB=LBであると仮定すると、この式は下式のように変形される。
長方形構造の場合には、EBGパッチの追加の長さおよびそれらの長さの組合せに対してLPを代入することによって、理論上、以降の他の全てのストップバンド位置を決定することができる。
14 金属層、連続する電気伝導性の回路板層、接地層、金属接地層
16 取付けタブ
17 金具
20 ヒートシンク・ベース
21 ヒートシンク・ベースの第1の部分
22 ヒートシンク・ベースの第1の表面、ヒートシンク・ベースの上面
23 ヒートシンク・ベースの第2の部分
24 ヒートシンク・ベースの第2の表面、ヒートシンク・ベースの下面
25 周期的パターン構造の断面
26 熱伝導性/非電気伝導性結合材
28 パッチ(patch)
29 開口部
30 枝(branch)
31 L字形スロット
32 オープン・スロット32
33 ヒートシンク・ベースの外縁
34 熱伝導性/非電気伝導性充填材
40 冷却フィン構造
42 冷却フィン、ヒートシンク・フィン
50 電子デバイス
60 システム・ボード
62 中央処理ユニット(CPU)
64 システム・ボード上のソケット
65 ファン
66 電気接点
68 対合電気接点
68G 接地接点
80 グラフ
81 上曲線
82 下曲線
Claims (2)
- 集積回路が発生させた電磁雑音の伝搬を低減させる方法であって、
前記集積回路が発生させる前記電磁雑音の周波数帯を識別するステップと、
前記識別した周波数帯内にストップバンドを有する幾何学的配列を有する、間隔を置いて配置され、枝によって相互接続されたパッチの周期的パターンを選択するステップと、
前記集積回路を、前記選択した周期的パターンを有する電気伝導性/熱伝導性材料を含むベースを有するヒートシンクと熱接触させるステップと
を含む方法。 - 識別した周波数帯内にストップバンドを有する幾何学的配列を有する、間隔を置いて配
置され、枝によって相互接続されたパッチの周期的パターンを選択する前記ステップが、
パッチ幅、パッチ長、枝幅、枝長およびベース厚からなるグループのうちの1つまたは複
数を選択するステップを含む、請求項1に記載の方法。
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US12/536655 | 2009-08-06 | ||
US12/536,655 US7848108B1 (en) | 2009-08-06 | 2009-08-06 | Heatsink with periodically patterned baseplate structure |
Related Child Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2015039193A Division JP5914717B2 (ja) | 2009-08-06 | 2015-02-27 | 周期的パターンを有するベースプレート構造を含むヒートシンク、ならびに関連する装置および方法(周期的パターンを有するベースプレート構造を含むヒートシンク) |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2011040742A JP2011040742A (ja) | 2011-02-24 |
JP5765897B2 true JP5765897B2 (ja) | 2015-08-19 |
Family
ID=43244135
Family Applications (2)
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JP2010174276A Active JP5765897B2 (ja) | 2009-08-06 | 2010-08-03 | 周期的パターンを有するベースプレート構造を含むヒートシンク、ならびに関連する装置および方法(周期的パターンを有するベースプレート構造を含むヒートシンク) |
JP2015039193A Active JP5914717B2 (ja) | 2009-08-06 | 2015-02-27 | 周期的パターンを有するベースプレート構造を含むヒートシンク、ならびに関連する装置および方法(周期的パターンを有するベースプレート構造を含むヒートシンク) |
Family Applications After (1)
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JP2015039193A Active JP5914717B2 (ja) | 2009-08-06 | 2015-02-27 | 周期的パターンを有するベースプレート構造を含むヒートシンク、ならびに関連する装置および方法(周期的パターンを有するベースプレート構造を含むヒートシンク) |
Country Status (5)
Country | Link |
---|---|
US (1) | US7848108B1 (ja) |
JP (2) | JP5765897B2 (ja) |
KR (1) | KR20110014956A (ja) |
CN (1) | CN101996963B (ja) |
TW (1) | TWI440425B (ja) |
Families Citing this family (20)
Publication number | Priority date | Publication date | Assignee | Title |
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KR20120000282A (ko) * | 2010-06-25 | 2012-01-02 | 삼성전자주식회사 | 히트 스프레더 및 그를 포함하는 반도체 패키지 |
JP5821954B2 (ja) * | 2011-06-10 | 2015-11-24 | 日本電気株式会社 | 電子機器、構造体、及び、ヒートシンク |
JP5670392B2 (ja) * | 2012-07-27 | 2015-02-18 | 株式会社東芝 | 回路基板 |
US10403973B2 (en) * | 2014-04-22 | 2019-09-03 | Intel Corporation | EBG designs for mitigating radio frequency interference |
CN107534029B (zh) * | 2015-07-31 | 2021-11-26 | 慧与发展有限责任合伙企业 | 多芯片模块 |
US20170214150A1 (en) * | 2016-01-25 | 2017-07-27 | Philips Lighting Holding B.V. | Apparatus comprising antenna and heat sink |
US20170347490A1 (en) * | 2016-05-24 | 2017-11-30 | Texas Instruments Incorporated | High-frequency antenna structure with high thermal conductivity and high surface area |
US10553930B2 (en) * | 2016-12-30 | 2020-02-04 | Symantec Corporation | Antenna system for wireless communication devices and other wireless applications |
DE102017200122B4 (de) | 2017-01-05 | 2020-07-23 | Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. | Wafer Level Package mit integrierten Antennen und Mittel zum Schirmen, System dieses umfassend und Verfahren zu dessen Herstellung |
DE102017200124A1 (de) | 2017-01-05 | 2018-07-05 | Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. | Wafer Level Packages mit integrierter oder eingebetteter Antenne |
DE102017200121A1 (de) * | 2017-01-05 | 2018-07-05 | Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. | Wafer Level Package mit zumindest einem integrierten Antennenelement |
KR102658311B1 (ko) * | 2017-02-08 | 2024-04-18 | 삼성전자주식회사 | 스피커를 포함하는 전자 장치 |
CN107240770B (zh) * | 2017-05-10 | 2019-11-26 | 哈尔滨工程大学 | 一种用于微带天线阵列的周期性空间波阻挡去耦结构 |
WO2020041320A1 (en) * | 2018-08-21 | 2020-02-27 | Laird Technologies, Inc. | Patterned materials and films and systems and methods for making the same |
JP6612008B1 (ja) * | 2019-04-23 | 2019-11-27 | 三菱電機株式会社 | 電子機器 |
KR102290036B1 (ko) * | 2019-05-15 | 2021-08-18 | 주식회사 케이엠더블유 | 안테나 장치 |
US20220117112A1 (en) * | 2020-10-12 | 2022-04-14 | Intel Corporation | Enhanced electronic package thermal dissipation with in-situ transpiration cooling and reduced thermal interstitial resistance |
US11252841B1 (en) * | 2021-02-18 | 2022-02-15 | Giftedness And Creativity Company | Heat sink with slotted pin fins |
CN117897865A (zh) * | 2021-09-02 | 2024-04-16 | 日本电气株式会社 | 无线电设备、无线电系统和散热结构 |
CN116234323A (zh) * | 2022-07-01 | 2023-06-06 | 北京超弦存储器研究院 | 三维堆叠芯片和电子设备 |
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JPS6381838A (ja) * | 1986-09-25 | 1988-04-12 | Hitachi Cable Ltd | 冷却体の製造方法 |
JPH0278255A (ja) * | 1988-09-14 | 1990-03-19 | Hitachi Ltd | 樹脂封止型半導体装置 |
JP3008942B1 (ja) * | 1998-11-20 | 2000-02-14 | 日本電気株式会社 | 電子装置の放熱構造 |
US6437438B1 (en) * | 2000-06-30 | 2002-08-20 | Intel Corporation | Eddy current limiting thermal plate |
US6563198B1 (en) * | 2001-08-01 | 2003-05-13 | Lsi Logic Corporation | Adhesive pad having EMC shielding characteristics |
JP2003298283A (ja) * | 2002-03-28 | 2003-10-17 | Seiko Epson Corp | 電磁波シールド部材、記録装置 |
TWM241965U (en) * | 2003-05-23 | 2004-08-21 | Hon Hai Prec Ind Co Ltd | EMI-Attenuating air ventilation panel |
US20070053168A1 (en) * | 2004-01-21 | 2007-03-08 | General Electric Company | Advanced heat sinks and thermal spreaders |
US7748440B2 (en) * | 2004-06-01 | 2010-07-06 | International Business Machines Corporation | Patterned structure for a thermal interface |
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CN1845666A (zh) * | 2005-04-07 | 2006-10-11 | 华硕电脑股份有限公司 | 遮蔽结构 |
US20080303121A1 (en) | 2005-06-07 | 2008-12-11 | University Of Florida Research Foundation, Inc. | Integrated Electronic Circuitry and Heat Sink |
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JP2007235460A (ja) | 2006-02-28 | 2007-09-13 | Mitsumi Electric Co Ltd | アンテナ装置 |
CN101031197A (zh) * | 2006-03-02 | 2007-09-05 | 华硕电脑股份有限公司 | 具有电磁干扰抑制功能的电子装置及其散热组件 |
JP2008010859A (ja) * | 2006-06-02 | 2008-01-17 | Renesas Technology Corp | 半導体装置 |
US7839654B2 (en) * | 2007-02-28 | 2010-11-23 | International Business Machines Corporation | Method for ultimate noise isolation in high-speed digital systems on packages and printed circuit boards (PCBS) |
JP4644717B2 (ja) * | 2008-01-11 | 2011-03-02 | 富士通株式会社 | 基板ユニット |
-
2009
- 2009-08-06 US US12/536,655 patent/US7848108B1/en active Active
-
2010
- 2010-06-10 TW TW099118846A patent/TWI440425B/zh active
- 2010-07-21 KR KR1020100070464A patent/KR20110014956A/ko not_active Application Discontinuation
- 2010-08-03 JP JP2010174276A patent/JP5765897B2/ja active Active
- 2010-08-06 CN CN2010102490562A patent/CN101996963B/zh not_active Expired - Fee Related
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2015
- 2015-02-27 JP JP2015039193A patent/JP5914717B2/ja active Active
Also Published As
Publication number | Publication date |
---|---|
TWI440425B (zh) | 2014-06-01 |
TW201112938A (en) | 2011-04-01 |
JP2015135979A (ja) | 2015-07-27 |
CN101996963B (zh) | 2013-01-30 |
US7848108B1 (en) | 2010-12-07 |
KR20110014956A (ko) | 2011-02-14 |
JP5914717B2 (ja) | 2016-05-11 |
CN101996963A (zh) | 2011-03-30 |
JP2011040742A (ja) | 2011-02-24 |
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