JP5763759B2 - アライメント装置およびアライメント方法 - Google Patents

アライメント装置およびアライメント方法 Download PDF

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Publication number
JP5763759B2
JP5763759B2 JP2013517950A JP2013517950A JP5763759B2 JP 5763759 B2 JP5763759 B2 JP 5763759B2 JP 2013517950 A JP2013517950 A JP 2013517950A JP 2013517950 A JP2013517950 A JP 2013517950A JP 5763759 B2 JP5763759 B2 JP 5763759B2
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Japan
Prior art keywords
alignment
target object
spin chuck
rotation
suction
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Active
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JP2013517950A
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English (en)
Japanese (ja)
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JPWO2012165141A1 (ja
Inventor
泰弘 瀧本
泰弘 瀧本
浩明 月本
浩明 月本
藤田　大輔
大輔 藤田
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Tazmo Co Ltd
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Tazmo Co Ltd
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Priority to JP2013517950A priority Critical patent/JP5763759B2/ja
Publication of JPWO2012165141A1 publication Critical patent/JPWO2012165141A1/ja
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
    • H01L21/681—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment using optical controlling means

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
JP2013517950A 2011-06-02 2012-05-16 アライメント装置およびアライメント方法 Active JP5763759B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2013517950A JP5763759B2 (ja) 2011-06-02 2012-05-16 アライメント装置およびアライメント方法

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP2011123891 2011-06-02
JP2011123891 2011-06-02
JP2013517950A JP5763759B2 (ja) 2011-06-02 2012-05-16 アライメント装置およびアライメント方法
PCT/JP2012/062479 WO2012165141A1 (ja) 2011-06-02 2012-05-16 アライメント装置およびアライメント方法

Publications (2)

Publication Number Publication Date
JPWO2012165141A1 JPWO2012165141A1 (ja) 2015-02-23
JP5763759B2 true JP5763759B2 (ja) 2015-08-12

Family

ID=47259004

Family Applications (1)

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JP2013517950A Active JP5763759B2 (ja) 2011-06-02 2012-05-16 アライメント装置およびアライメント方法

Country Status (4)

Country Link
JP (1) JP5763759B2 (ko)
KR (1) KR20140025513A (ko)
TW (1) TW201306165A (ko)
WO (1) WO2012165141A1 (ko)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN107665850B (zh) * 2016-07-29 2019-09-17 上海微电子装备（集团）股份有限公司 基板的对接装置及对接方法
CN106486406B (zh) * 2016-10-21 2019-05-14 杭州长川科技股份有限公司 集成电路晶圆预对位装置及预对位方法
KR102377036B1 (ko) * 2020-02-24 2022-03-22 피에스케이홀딩스 (주) 정렬 장치, 그리고 이를 포함하는 기판 처리 장치
CN115116917A (zh) * 2021-03-19 2022-09-27 台湾积体电路制造股份有限公司 设备校准方法、设备维护方法及半导体处理方法

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002329769A (ja) * 2001-04-27 2002-11-15 Lintec Corp アライメント装置
JP2010021281A (ja) * 2008-07-09 2010-01-28 Olympus Corp 基板保持装置、基板検査装置、及び、基板保持方法
JP5384220B2 (ja) * 2009-06-22 2014-01-08 東京応化工業株式会社 アライメント装置およびアライメント方法

Also Published As

Publication number Publication date
KR20140025513A (ko) 2014-03-04
TW201306165A (zh) 2013-02-01
JPWO2012165141A1 (ja) 2015-02-23
WO2012165141A1 (ja) 2012-12-06

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