JP5747691B2 - 電子デバイス用パッケージの製造方法、電子デバイスおよび電子機器 - Google Patents
電子デバイス用パッケージの製造方法、電子デバイスおよび電子機器 Download PDFInfo
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- JP5747691B2 JP5747691B2 JP2011148688A JP2011148688A JP5747691B2 JP 5747691 B2 JP5747691 B2 JP 5747691B2 JP 2011148688 A JP2011148688 A JP 2011148688A JP 2011148688 A JP2011148688 A JP 2011148688A JP 5747691 B2 JP5747691 B2 JP 5747691B2
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Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2011148688A JP5747691B2 (ja) | 2011-07-04 | 2011-07-04 | 電子デバイス用パッケージの製造方法、電子デバイスおよび電子機器 |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2011148688A JP5747691B2 (ja) | 2011-07-04 | 2011-07-04 | 電子デバイス用パッケージの製造方法、電子デバイスおよび電子機器 |
Related Child Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2015097472A Division JP6112138B2 (ja) | 2015-05-12 | 2015-05-12 | 電子デバイスの製造方法 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2013016657A JP2013016657A (ja) | 2013-01-24 |
| JP2013016657A5 JP2013016657A5 (enrdf_load_stackoverflow) | 2014-05-22 |
| JP5747691B2 true JP5747691B2 (ja) | 2015-07-15 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2011148688A Expired - Fee Related JP5747691B2 (ja) | 2011-07-04 | 2011-07-04 | 電子デバイス用パッケージの製造方法、電子デバイスおよび電子機器 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP5747691B2 (enrdf_load_stackoverflow) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2013179228A (ja) | 2012-02-29 | 2013-09-09 | Seiko Epson Corp | 電子デバイスの製造方法および電子機器 |
| JP2015088643A (ja) | 2013-10-31 | 2015-05-07 | セイコーエプソン株式会社 | 電子デバイスの製造方法、電子デバイス、電子機器、移動体、および蓋体 |
| JP2015088644A (ja) | 2013-10-31 | 2015-05-07 | セイコーエプソン株式会社 | 電子デバイスの製造方法、電子デバイス、電子機器、移動体、および蓋体 |
| JP6958121B2 (ja) * | 2017-08-29 | 2021-11-02 | 住友電気工業株式会社 | 光モジュールおよびその製造方法 |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2693694B2 (ja) * | 1992-11-10 | 1997-12-24 | 日本碍子株式会社 | 半導体素子収納用パッケージのキャップ封止方法 |
| JPH07122670A (ja) * | 1993-10-21 | 1995-05-12 | Hitachi Ltd | ガラス封止型半導体装置の製造方法 |
| JP2008153485A (ja) * | 2006-12-19 | 2008-07-03 | Epson Toyocom Corp | 電子部品の製造方法 |
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2011
- 2011-07-04 JP JP2011148688A patent/JP5747691B2/ja not_active Expired - Fee Related
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| Publication number | Publication date |
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| JP2013016657A (ja) | 2013-01-24 |
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