JP5746661B2 - ペリクルの製造方法 - Google Patents
ペリクルの製造方法 Download PDFInfo
- Publication number
- JP5746661B2 JP5746661B2 JP2012106550A JP2012106550A JP5746661B2 JP 5746661 B2 JP5746661 B2 JP 5746661B2 JP 2012106550 A JP2012106550 A JP 2012106550A JP 2012106550 A JP2012106550 A JP 2012106550A JP 5746661 B2 JP5746661 B2 JP 5746661B2
- Authority
- JP
- Japan
- Prior art keywords
- frame
- pellicle
- pellicle film
- film
- divided
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Images
Classifications
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F1/00—Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
- G03F1/62—Pellicles, e.g. pellicle assemblies, e.g. having membrane on support frame; Preparation thereof
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C63/00—Lining or sheathing, i.e. applying preformed layers or sheathings of plastics; Apparatus therefor
- B29C63/02—Lining or sheathing, i.e. applying preformed layers or sheathings of plastics; Apparatus therefor using sheet or web-like material
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F1/00—Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
- G03F1/62—Pellicles, e.g. pellicle assemblies, e.g. having membrane on support frame; Preparation thereof
- G03F1/64—Pellicles, e.g. pellicle assemblies, e.g. having membrane on support frame; Preparation thereof characterised by the frames, e.g. structure or material, including bonding means therefor
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
- H01L21/0271—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers
- H01L21/0273—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers characterised by the treatment of photoresist layers
- H01L21/0274—Photolithographic processes
Landscapes
- Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Preparing Plates And Mask In Photomechanical Process (AREA)
- Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
Priority Applications (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2012106550A JP5746661B2 (ja) | 2012-05-08 | 2012-05-08 | ペリクルの製造方法 |
KR1020130034297A KR102020248B1 (ko) | 2012-05-08 | 2013-03-29 | 펠리클의 제조 방법 |
TW102116131A TWI491977B (zh) | 2012-05-08 | 2013-05-07 | 防塵薄膜組件的製造方法及由多個分割框並列結合而成的分割框組合體 |
CN201310167125.9A CN103389617B (zh) | 2012-05-08 | 2013-05-08 | 防尘薄膜组件的制造方法 |
HK14101592.4A HK1188487A1 (zh) | 2012-05-08 | 2014-02-19 | 防塵薄膜組件的製造方法 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2012106550A JP5746661B2 (ja) | 2012-05-08 | 2012-05-08 | ペリクルの製造方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2013235087A JP2013235087A (ja) | 2013-11-21 |
JP5746661B2 true JP5746661B2 (ja) | 2015-07-08 |
Family
ID=49533924
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2012106550A Active JP5746661B2 (ja) | 2012-05-08 | 2012-05-08 | ペリクルの製造方法 |
Country Status (5)
Country | Link |
---|---|
JP (1) | JP5746661B2 (ko) |
KR (1) | KR102020248B1 (ko) |
CN (1) | CN103389617B (ko) |
HK (1) | HK1188487A1 (ko) |
TW (1) | TWI491977B (ko) |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI566033B (zh) * | 2015-04-17 | 2017-01-11 | Micro Lithography Inc | Mask dustproof frame structure |
CN108123671A (zh) * | 2017-11-29 | 2018-06-05 | 北京创昱科技有限公司 | 一种框架压缩装置及薄膜拉伸方法 |
KR20230054032A (ko) | 2021-10-15 | 2023-04-24 | 주식회사 이솔 | Euv 리소그래피용 펠리클 구조 및 제조방법 |
Family Cites Families (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH06230561A (ja) * | 1993-01-29 | 1994-08-19 | Shin Etsu Chem Co Ltd | リソグラフィー用ペリクル膜の製造方法 |
JPH09258433A (ja) * | 1996-03-19 | 1997-10-03 | Nikon Corp | マスク |
JP3386693B2 (ja) * | 1997-06-09 | 2003-03-17 | 信越化学工業株式会社 | ペリクルの製造方法 |
JP2004157229A (ja) | 2002-11-05 | 2004-06-03 | Shin Etsu Chem Co Ltd | リソグラフィ用ペリクル及びその製造方法 |
US20050157288A1 (en) * | 2003-11-26 | 2005-07-21 | Sematech, Inc. | Zero-force pellicle mount and method for manufacturing the same |
JP2010145264A (ja) * | 2008-12-19 | 2010-07-01 | Pioneer Electronic Corp | Memsデバイスの製造方法、memsデバイスおよび接合マザー基板 |
JP5481106B2 (ja) * | 2009-06-24 | 2014-04-23 | 信越化学工業株式会社 | ペリクルフレーム及びリソグラフィ用ペリクル |
JP2011107230A (ja) * | 2009-11-13 | 2011-06-02 | Shin-Etsu Chemical Co Ltd | ペリクルおよびその製造方法 |
JP2011158585A (ja) * | 2010-01-29 | 2011-08-18 | Shin-Etsu Chemical Co Ltd | ペリクルおよびペリクルの製造方法 |
-
2012
- 2012-05-08 JP JP2012106550A patent/JP5746661B2/ja active Active
-
2013
- 2013-03-29 KR KR1020130034297A patent/KR102020248B1/ko active IP Right Grant
- 2013-05-07 TW TW102116131A patent/TWI491977B/zh active
- 2013-05-08 CN CN201310167125.9A patent/CN103389617B/zh active Active
-
2014
- 2014-02-19 HK HK14101592.4A patent/HK1188487A1/zh not_active IP Right Cessation
Also Published As
Publication number | Publication date |
---|---|
KR102020248B1 (ko) | 2019-09-10 |
HK1188487A1 (zh) | 2014-05-02 |
TWI491977B (zh) | 2015-07-11 |
CN103389617A (zh) | 2013-11-13 |
JP2013235087A (ja) | 2013-11-21 |
TW201404577A (zh) | 2014-02-01 |
KR20130125295A (ko) | 2013-11-18 |
CN103389617B (zh) | 2016-03-02 |
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