JP5745382B2 - インクジェット式記録ヘッド - Google Patents
インクジェット式記録ヘッド Download PDFInfo
- Publication number
- JP5745382B2 JP5745382B2 JP2011226449A JP2011226449A JP5745382B2 JP 5745382 B2 JP5745382 B2 JP 5745382B2 JP 2011226449 A JP2011226449 A JP 2011226449A JP 2011226449 A JP2011226449 A JP 2011226449A JP 5745382 B2 JP5745382 B2 JP 5745382B2
- Authority
- JP
- Japan
- Prior art keywords
- film
- elastic film
- recording head
- elastic
- piezoelectric
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 10
- PMHQVHHXPFUNSP-UHFFFAOYSA-M copper(1+);methylsulfanylmethane;bromide Chemical group Br[Cu].CSC PMHQVHHXPFUNSP-UHFFFAOYSA-M 0.000 claims description 6
- 239000012528 membrane Substances 0.000 claims description 6
- 229910052814 silicon oxide Inorganic materials 0.000 claims description 6
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 claims description 3
- 229910052581 Si3N4 Inorganic materials 0.000 claims description 2
- 239000010408 film Substances 0.000 description 212
- 238000006073 displacement reaction Methods 0.000 description 46
- 230000000052 comparative effect Effects 0.000 description 24
- 239000000758 substrate Substances 0.000 description 21
- 238000010586 diagram Methods 0.000 description 11
- 238000000034 method Methods 0.000 description 11
- 238000004519 manufacturing process Methods 0.000 description 9
- 238000001020 plasma etching Methods 0.000 description 9
- 230000015572 biosynthetic process Effects 0.000 description 8
- 238000000206 photolithography Methods 0.000 description 8
- 238000004088 simulation Methods 0.000 description 8
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 7
- 229910052710 silicon Inorganic materials 0.000 description 7
- 239000010703 silicon Substances 0.000 description 7
- 239000000463 material Substances 0.000 description 6
- 239000013078 crystal Substances 0.000 description 5
- PIGFYZPCRLYGLF-UHFFFAOYSA-N Aluminum nitride Chemical compound [Al]#N PIGFYZPCRLYGLF-UHFFFAOYSA-N 0.000 description 4
- 230000000694 effects Effects 0.000 description 4
- 238000005530 etching Methods 0.000 description 4
- 239000004065 semiconductor Substances 0.000 description 4
- 238000004544 sputter deposition Methods 0.000 description 4
- XLOMVQKBTHCTTD-UHFFFAOYSA-N Zinc monoxide Chemical compound [Zn]=O XLOMVQKBTHCTTD-UHFFFAOYSA-N 0.000 description 3
- 230000007423 decrease Effects 0.000 description 3
- 238000001459 lithography Methods 0.000 description 3
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 description 3
- 238000005546 reactive sputtering Methods 0.000 description 3
- 239000000853 adhesive Substances 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 2
- 229910021417 amorphous silicon Inorganic materials 0.000 description 2
- 229910052451 lead zirconate titanate Inorganic materials 0.000 description 2
- 230000003647 oxidation Effects 0.000 description 2
- 238000007254 oxidation reaction Methods 0.000 description 2
- 235000012239 silicon dioxide Nutrition 0.000 description 2
- 239000000377 silicon dioxide Substances 0.000 description 2
- 239000011800 void material Substances 0.000 description 2
- 229910004298 SiO 2 Inorganic materials 0.000 description 1
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- 230000015556 catabolic process Effects 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
- 230000008602 contraction Effects 0.000 description 1
- 238000009792 diffusion process Methods 0.000 description 1
- 238000001312 dry etching Methods 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- HFGPZNIAWCZYJU-UHFFFAOYSA-N lead zirconate titanate Chemical compound [O-2].[O-2].[O-2].[O-2].[O-2].[Ti+4].[Zr+4].[Pb+2] HFGPZNIAWCZYJU-UHFFFAOYSA-N 0.000 description 1
- 230000000116 mitigating effect Effects 0.000 description 1
- 230000009022 nonlinear effect Effects 0.000 description 1
- 238000005192 partition Methods 0.000 description 1
- 238000000059 patterning Methods 0.000 description 1
- 229910052697 platinum Inorganic materials 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
- 229910052719 titanium Inorganic materials 0.000 description 1
- 239000010936 titanium Substances 0.000 description 1
- 230000009466 transformation Effects 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/14—Structure thereof only for on-demand ink jet heads
- B41J2/14201—Structure of print heads with piezoelectric elements
- B41J2/14233—Structure of print heads with piezoelectric elements of film type, deformed by bending and disposed on a diaphragm
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/16—Production of nozzles
- B41J2/1607—Production of print heads with piezoelectric elements
- B41J2/161—Production of print heads with piezoelectric elements of film type, deformed by bending and disposed on a diaphragm
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/16—Production of nozzles
- B41J2/1621—Manufacturing processes
- B41J2/1623—Manufacturing processes bonding and adhesion
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/16—Production of nozzles
- B41J2/1621—Manufacturing processes
- B41J2/1626—Manufacturing processes etching
- B41J2/1628—Manufacturing processes etching dry etching
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/16—Production of nozzles
- B41J2/1621—Manufacturing processes
- B41J2/1631—Manufacturing processes photolithography
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/16—Production of nozzles
- B41J2/1621—Manufacturing processes
- B41J2/1635—Manufacturing processes dividing the wafer into individual chips
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/16—Production of nozzles
- B41J2/1621—Manufacturing processes
- B41J2/1637—Manufacturing processes molding
- B41J2/1639—Manufacturing processes molding sacrificial molding
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/16—Production of nozzles
- B41J2/1621—Manufacturing processes
- B41J2/164—Manufacturing processes thin film formation
- B41J2/1646—Manufacturing processes thin film formation thin film formation by sputtering
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Particle Formation And Scattering Control In Inkjet Printers (AREA)
Description
本実施の形態のインクジェット式記録ヘッドは、ノズル開口部に連通する圧力発生室の一部を構成する弾性膜と、端部が弾性膜に接続され、中央部は弾性膜と空隙を介して対向し、下部電極、圧電膜、上部電極が積層された圧電積層部とを備える。
本実施の形態のインクジェット式記録ヘッドは、弾性膜の段差部の構造が第1の実施の形態と異なっている。段差部の構造以外は第1の実施の形態と同様であるので、第1の実施の形態と重複する内容については、記載を省略する。
圧電膜52に加わる応力と弾性膜30に生じる撓みの関係について、シミュレーション結果に基づきさらに詳細に説明する。図1、2に示す第1の実施の形態と同様の構造を備えるインクジェット式記録ヘッドについて、シミュレーションを行った。シミュレーションに使用したインクジェット式記録ヘッドの主要部寸法を表1に示す。圧電膜52としては、c軸配向性の良い窒化アルミニウム(AlN)を、使用した。また、上下電極51、下部電極53として白金(Pt)を、弾性膜30として酸化シリコン(SiO2)を使用した。
次に、比較例1として、従来のユニモルフ構造を持つインクジェット式記録ヘッドについても同様にシミュレーション結果を示し、実施例と詳細に比較した。
次に、比較例2として、段差を持つ弾性膜とユニモルフ構造を持つインクジェット式記録ヘッドについても同様にシミュレーション結果を示し、実施例と詳細に比較した。
図16は、比較例2における1つの圧力発生室の横手方向における断面構造を示す図である。実施例と同じ部材には同じ番号を付してある。
11 圧力発生室
20 ノズルプレート
21 ノズル開口部
30 弾性膜
31 接続部
32 段差部(可動部)
40 空隙
50 圧電膜積層部
51 下部電極
52 圧電膜
53 上部電極
54 接続部
60 共通インク室
61 インク供給路
100 インクジェット式記録ヘッド
Claims (6)
- ノズル開口部に連通する圧力発生室の一部を構成する弾性膜と、
端部が前記弾性膜に接続され、中央部は前記弾性膜と空隙を介して対向し、下部電極、圧電膜、上部電極が積層された圧電膜積層部と、
を備え、
前記弾性膜の端部に、前記弾性膜の膜面に平行な方向に変形する可動部を備えることを特徴とするインクジェット式記録ヘッド。 - 前記可動部が前記弾性膜に設けられる段差構造であることを特徴とする請求項1記載のインクジェット式記録ヘッド。
- 前記圧電膜が窒化アルミニウムであることを特徴とする請求項1又は請求項2記載のインクジェット式記録ヘッド。
- 前記弾性膜がシリコン窒化膜またはシリコン酸化膜であることを特徴とする請求項1ないし請求項3いずれか一項記載のインクジェット式記録ヘッド。
- 前記段差構造が、前記圧力発生室の内側面と連続する面を備えることを特徴とする請求項2記載のインクジェット式記録ヘッド。
- 前記段差構造が、前記圧力発生室の内側に設けられることを特徴とする請求項2記載のインクジェット式記録ヘッド。
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2011226449A JP5745382B2 (ja) | 2011-10-14 | 2011-10-14 | インクジェット式記録ヘッド |
US13/650,797 US8746857B2 (en) | 2011-10-14 | 2012-10-12 | Inkjet recording head |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2011226449A JP5745382B2 (ja) | 2011-10-14 | 2011-10-14 | インクジェット式記録ヘッド |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2013086287A JP2013086287A (ja) | 2013-05-13 |
JP5745382B2 true JP5745382B2 (ja) | 2015-07-08 |
Family
ID=48135624
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2011226449A Expired - Fee Related JP5745382B2 (ja) | 2011-10-14 | 2011-10-14 | インクジェット式記録ヘッド |
Country Status (2)
Country | Link |
---|---|
US (1) | US8746857B2 (ja) |
JP (1) | JP5745382B2 (ja) |
Families Citing this family (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP6167657B2 (ja) * | 2013-05-13 | 2017-07-26 | 三菱マテリアル株式会社 | 強誘電体膜付きシリコン基板 |
JP5771655B2 (ja) | 2013-08-30 | 2015-09-02 | 株式会社東芝 | インクジェットヘッド及びインクジェット記録装置 |
JP5916676B2 (ja) | 2013-09-20 | 2016-05-11 | 株式会社東芝 | インクジェットヘッド、インクジェット記録装置及びインクジェットヘッドの製造方法 |
JP6217495B2 (ja) * | 2014-03-31 | 2017-10-25 | ブラザー工業株式会社 | 圧電アクチュエータ |
GB202007236D0 (en) * | 2020-05-15 | 2020-07-01 | 3C Project Tech Limited | Droplet ejector assembly structure and methods |
Family Cites Families (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6357250A (ja) * | 1986-08-28 | 1988-03-11 | Fujitsu Ltd | インクジエツトヘツド |
JPH11291495A (ja) | 1998-04-10 | 1999-10-26 | Seiko Epson Corp | インクジェット式記録ヘッド及びその製造方法 |
JP4165043B2 (ja) * | 2001-07-13 | 2008-10-15 | 富士ゼロックス株式会社 | 液滴吐出ヘッド |
JP3906738B2 (ja) * | 2002-05-10 | 2007-04-18 | ブラザー工業株式会社 | 液滴噴射装置 |
JP2004066652A (ja) * | 2002-08-07 | 2004-03-04 | Ricoh Co Ltd | 液滴吐出ヘッド、インクカートリッジ及びインクジェット記録装置 |
JP3956964B2 (ja) * | 2003-09-25 | 2007-08-08 | ブラザー工業株式会社 | 液体移送装置及び圧電アクチュエータ |
JP2005104038A (ja) * | 2003-09-30 | 2005-04-21 | Fuji Photo Film Co Ltd | 吐出ヘッド及び液吐出装置 |
JP2006212992A (ja) * | 2005-02-04 | 2006-08-17 | National Institute Of Advanced Industrial & Technology | 液体噴射装置 |
JP2007013009A (ja) * | 2005-07-01 | 2007-01-18 | Seiko Epson Corp | 圧電素子、電子デバイスおよび電子機器 |
JP4735840B2 (ja) * | 2005-12-06 | 2011-07-27 | セイコーエプソン株式会社 | 圧電体積層体、表面弾性波素子、薄膜圧電共振子および圧電アクチュエータ |
US8029111B2 (en) * | 2007-11-05 | 2011-10-04 | Seiko Epson Corporation | Droplet ejection head and droplet ejection apparatus |
JP2010247495A (ja) * | 2009-04-20 | 2010-11-04 | Seiko Epson Corp | 圧電素子及び液体噴射ヘッド |
JP2011000729A (ja) * | 2009-06-16 | 2011-01-06 | Ricoh Co Ltd | 液体吐出装置 |
-
2011
- 2011-10-14 JP JP2011226449A patent/JP5745382B2/ja not_active Expired - Fee Related
-
2012
- 2012-10-12 US US13/650,797 patent/US8746857B2/en active Active
Also Published As
Publication number | Publication date |
---|---|
US8746857B2 (en) | 2014-06-10 |
JP2013086287A (ja) | 2013-05-13 |
US20130100211A1 (en) | 2013-04-25 |
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