JP5737278B2 - 回路接続材料、接続体、及び接続体を製造する方法 - Google Patents

回路接続材料、接続体、及び接続体を製造する方法 Download PDF

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Publication number
JP5737278B2
JP5737278B2 JP2012277028A JP2012277028A JP5737278B2 JP 5737278 B2 JP5737278 B2 JP 5737278B2 JP 2012277028 A JP2012277028 A JP 2012277028A JP 2012277028 A JP2012277028 A JP 2012277028A JP 5737278 B2 JP5737278 B2 JP 5737278B2
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Japan
Prior art keywords
connection
substrate
circuit
conductive particles
connection body
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Application number
JP2012277028A
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English (en)
Japanese (ja)
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JP2013149966A (ja
Inventor
研吾 篠原
研吾 篠原
美佐夫 小口
美佐夫 小口
後藤　泰史
泰史 後藤
藤縄　貢
貢 藤縄
松田　和也
和也 松田
立澤　貴
貴 立澤
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Showa Denko Materials Co Ltd
Original Assignee
Hitachi Chemical Co Ltd
Showa Denko Materials Co Ltd
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Publication date
Application filed by Hitachi Chemical Co Ltd, Showa Denko Materials Co Ltd filed Critical Hitachi Chemical Co Ltd
Priority to JP2012277028A priority Critical patent/JP5737278B2/ja
Publication of JP2013149966A publication Critical patent/JP2013149966A/ja
Application granted granted Critical
Publication of JP5737278B2 publication Critical patent/JP5737278B2/ja
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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
    • C09J9/02—Electrically-conducting adhesives
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R4/00—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation
    • H01R4/04—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation using electrically conductive adhesives
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/36—Assembling printed circuits with other printed circuits
    • H05K3/361—Assembling flexible printed circuits with other printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0137—Materials
    • H05K2201/0154—Polyimide
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0203—Fillers and particles
    • H05K2201/0206—Materials
    • H05K2201/0212—Resin particles

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Conductive Materials (AREA)
  • Combinations Of Printed Boards (AREA)
  • Wire Bonding (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Non-Insulated Conductors (AREA)
JP2012277028A 2011-12-21 2012-12-19 回路接続材料、接続体、及び接続体を製造する方法 Active JP5737278B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2012277028A JP5737278B2 (ja) 2011-12-21 2012-12-19 回路接続材料、接続体、及び接続体を製造する方法

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2011279887 2011-12-21
JP2011279887 2011-12-21
JP2012277028A JP5737278B2 (ja) 2011-12-21 2012-12-19 回路接続材料、接続体、及び接続体を製造する方法

Publications (2)

Publication Number Publication Date
JP2013149966A JP2013149966A (ja) 2013-08-01
JP5737278B2 true JP5737278B2 (ja) 2015-06-17

Family

ID=48637591

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JP2012277028A Active JP5737278B2 (ja) 2011-12-21 2012-12-19 回路接続材料、接続体、及び接続体を製造する方法

Country Status (4)

Country Link
JP (1) JP5737278B2 (zh)
KR (1) KR102036230B1 (zh)
CN (2) CN109949968B (zh)
TW (1) TWI629691B (zh)

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6364191B2 (ja) * 2012-12-06 2018-07-25 積水化学工業株式会社 導電材料、接続構造体及び接続構造体の製造方法
JP2015179732A (ja) * 2014-03-19 2015-10-08 デクセリアルズ株式会社 異方性導電接着剤
CN106104930A (zh) * 2014-03-20 2016-11-09 迪睿合株式会社 各向异性导电膜及其制备方法
WO2015174299A1 (ja) * 2014-05-14 2015-11-19 積水化学工業株式会社 導電ペースト、導電ペーストの製造方法、接続構造体及び接続構造体の製造方法
KR102545861B1 (ko) * 2014-10-29 2023-06-21 데쿠세리아루즈 가부시키가이샤 도전 재료
KR102542797B1 (ko) * 2015-01-13 2023-06-14 데쿠세리아루즈 가부시키가이샤 이방 도전성 필름
JP6579309B2 (ja) * 2015-05-01 2019-09-25 味の素株式会社 硬化性組成物
TWI711222B (zh) 2015-05-27 2020-11-21 日商迪睿合股份有限公司 異向導電性膜、連接構造體及連接構造體之製造方法
JP2017183239A (ja) * 2016-03-31 2017-10-05 デクセリアルズ株式会社 異方性導電接続構造体
JP6735652B2 (ja) * 2016-10-21 2020-08-05 デクセリアルズ株式会社 半導体装置の製造方法
KR102660793B1 (ko) * 2017-11-30 2024-04-26 가부시키가이샤 한도오따이 에네루기 켄큐쇼 표시 패널, 표시 장치, 입출력 장치, 정보 처리 장치
JP2019179647A (ja) * 2018-03-30 2019-10-17 デクセリアルズ株式会社 導電材料、及び接続体の製造方法
JPWO2021193911A1 (zh) * 2020-03-26 2021-09-30

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3367076B2 (ja) 1994-10-24 2003-01-14 日立化成工業株式会社 電気部材の接続構造及び接続方法
JPH08148213A (ja) 1994-11-25 1996-06-07 Hitachi Chem Co Ltd 接続部材、該接続部材を用いた電極の接続構造及び接続方法
JPH1150032A (ja) 1997-08-04 1999-02-23 Hitachi Chem Co Ltd 回路用接続部材及び回路板
JPH1173818A (ja) * 1997-08-28 1999-03-16 Ricoh Co Ltd 導電性粒子および異方導電性接着材および液晶表示装置
US20010046021A1 (en) * 1997-08-28 2001-11-29 Takeshi Kozuka A conductive particle to conductively bond conductive members to each other, an anisotropic adhesive containing the conductive particle, a liquid crystal display device using the anisotropic conductive adhesive, a method for manufacturing the liquid crystal display device
JP3296306B2 (ja) * 1997-10-28 2002-06-24 ソニーケミカル株式会社 異方導電性接着剤および接着用膜
EP0996321B1 (en) * 1998-10-22 2007-05-16 Sony Chemicals Corporation Anisotropically electroconductive adhesive and adhesive film
CN101142239A (zh) * 2005-03-31 2008-03-12 日清纺织株式会社 球形聚合物细颗粒及其制备方法
EP2386035A4 (en) * 2009-01-09 2012-05-02 Int Marketing Inc COMPOSITION FOR THE CORRECTION OF TIRE WHEEL MATERIALS, POWER VARIATIONS AND VIBRATIONS
JP4640531B2 (ja) * 2009-07-02 2011-03-02 日立化成工業株式会社 導電粒子
JP2011105861A (ja) * 2009-11-18 2011-06-02 Hitachi Chem Co Ltd 回路接続材料及び接続構造体
JP2012174358A (ja) * 2011-02-17 2012-09-10 Sekisui Chem Co Ltd 接続構造体及び接続構造体の製造方法
JP2012209097A (ja) * 2011-03-29 2012-10-25 Sekisui Chem Co Ltd 異方性導電材料及び接続構造体

Also Published As

Publication number Publication date
CN109949968B (zh) 2021-09-21
JP2013149966A (ja) 2013-08-01
KR20130072156A (ko) 2013-07-01
CN103177795A (zh) 2013-06-26
KR102036230B1 (ko) 2019-10-24
TW201330008A (zh) 2013-07-16
TWI629691B (zh) 2018-07-11
CN109949968A (zh) 2019-06-28

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